TS32101 SEMTECH | Alldatasheet

Document overview

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Technical content

Features

  • Output up to 1.5A at 5.0V with 1.8V input
  • Wide input voltage range: 1.75V – 5.5V
  • Output current up to 2A
  • Robust operation during hot-load disconnect and hot- load disable
  • Adjustable output voltage up to 5.5V
  • Adjustable output current limit
  • Includes full output isolation/reverse current blocking when disabled
  • 2 MHz ± 10% fixed switching frequency
  • Low power mode
  • High efficiency – up to 95%
  • Full protection for over-current, over-temperature, VOUT over-voltage, and VIN under-voltage
  • Power good/fault indication Summary Specifications
  • Ambient operating temperature -40C to 85C
  • Packaged in a 16pin QFN (3x3)

Description

The TS32101 is a DC/DC synchronous switching Boost Converter with fully integrated power switches, internal PWM current mode compensation, and full fault protection. The switching frequency of 2 MHz was chosen to enable the use of small external components for portable applications. The device also has a constant output current limit loop to provide a sharp output current limit that doesn’t move significantly with input voltage and output voltage.

Applications

  • USB power
  • Portable products
  • Wireless remote sensors
  • Emergency chargers Typical Application Circuit

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 2 of 12 Semtech Pinout TS32101 12ISEN ISEN ISEN VOUT VIN NC NC VSW VSW PGND ISEN PGND EN GND FB PG 5 6 7 8 16 15 14 13 Pin Description Pin # Pin Name Pin Function Description

1 ISEN Boot Power Stage Output Connects to current sense resistor becoming current sense

(Pin 1,2,3,16 are internally connected)

2 ISEN Boot Power Stage Output Connects to current sense resistor becoming current sense

3 ISEN Boot Power Stage Output Connects to current sense resistor becoming current sense

4 VOUT Output Voltage Connect to the other terminal of current sense resistor, which is the

output of the boost regulator

5 FB Output Voltage Feedback Feedback point for output voltage

6 GND GND Primary ground for the majority of the device except

7 EN Enable Input Tie EN pin high to enable device

8 PG PG Output Open-drain output for Power Good

9 N/C Not Used Connect to GND

10 N/C Not Used Connect to GND

11 VIN Input Voltage Connect to input supply and input capacitor. 12 VSW Switching Voltage Node Connected to 1.0uH (typical) inductor

13 PGND Power GND GND supply for internal low-side FET

14 VSW Switching Voltage Node Connected to 1.0uH (typical) inductor

15 PGND Power GND GND supply for internal low-side FET

16 ISEN Boot Power Stage Output Connects to current sense resistor becoming current sense

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 3 of 12 Semtech Functional Block Diagram Figure 1: TS32101 Block Diagram Current Limit Gate Drive Gate Drive Gate Drive Control ISEN VSW Oscillator Ramp Generator Comparator Error Amp GND MONITOR CONTROL VIN Under Voltage Protection VOUT VIN VIN Σ EN PGND PG COUT LOUT Compensation Network 1.8 – 3.5V Vref CIN VIN VOUT Under Voltage Detection Bulk Control FB CFF RTOPRBOT COUT2 VOUT VOUT RSENSE Compensation Network Comparator Ramp Ramp Iref

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 4 of 12 Semtech Absolute Maximum Ratings Over operating free–air temperature range unless otherwise noted(1, 2) Parameter Value Unit VIN -0.3 to 6.0 V EN, PG, FB -0.3 to 5.5 V VSW -1 to 6.0 V VOUT, ISEN -0.3 to 6.0 V Continuous total power dissipation See Dissipation Rating Table Electrostatic Discharge – Human Body Model ±2k V Electrostatic Discharge – Charged Device Model +/-500 V Lead Temperature (soldering, 10 seconds) 260 °C Notes: (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con- ditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. Thermal Characteristics Symbol Parameter Value Units θJA Thermal Resistance Junction to Air (Note 1) 50 °C/W TSTG Storage Temperature Range -65 to 150 °C TJ Operating Ambient Temperature Range -40 to 85 °C TJ MAX Maximum Junction Temperature 150 °C TJ Operating Junction Temperature Range -40 to 125 °C Note 1: Assumes TQFN-16 in 1 in2 area of 2 oz copper and 25C ambient temperature. Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VIN Input Operating Voltage 1.8 2.4 5.5 V LOUT Output Filter Inductor Typical Value (Note 1) 1.0 uH COUT Output Filter Capacitor Typical Value (Note 2) 33 47 100 uF COUT2 VOUT2 Filter Capacitor Typical Value (Note 2) 0.1 1 uF CBYPASS Input Supply Bypass Capacitor Typical Value (Note 3) 8 10 uF RTOP Feedback Divider Resistor Typical Value (Note 4) 1000 kΩ RBOT Feedback Divider Resistor Typical Value (Note 4) 330 kΩ Note 1: For best performance, an inductor with a saturation current rating higher than the maximum input current requirement plus the inductor current ripple. See Inductor Selection section to determine input current and ripple current. Note 2: For best performance, a low ESR ceramic capacitor should be used. Note 3: For best performance, a low ESR ceramic capacitor should be used. If CBYPASS is not a low ESR ceramic capacitor, a 0.1uF ceramic capacitor should be added in parallel to CBYPASS. Note 4: Values shown for 5V output.

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 5 of 12 Semtech Characteristics Electrical Characteristics, TA = -40C to 85C, VIN =2.4V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit VIN Supply Voltage VIN Voltage Input 1.75 5.5 V IIN-STBY Quiescent current Standby Mode EN = Low, VOUT=0V 5 10 uA IIN-LPM Operating Low Power Mode Input Current Iout = 0 uA 50 uA VOUT Supply Current IOUT Quiescent current Normal Mode (Note 1) EN = High, Switching 3 mA EN = High, Non-switching 500 uA IOUT-STBY Quiescent current, stby EN = Low, Vout=5V 25 uA IOUT Output current EN = High, VIN > 0.7 * Vout 2 A VIN Under Voltage Lockout (UVLO) VIN_UV VIN Under Voltage Detect Threshold Increasing Vin 1.5 V VIN-UV_HYST VIN Under Voltage Detect Hysteresis 150 mV OSC fOSC Oscillator Frequency 1.8 2 2.2 MHz PG Open Drain Output VPG_THRESH Power Good Voltage Detect Threshold Vout Increasing 90 % VOUT VPG_HYST Power Good Voltage Detect Hysteresis 1 % VOUT IOH-PG High-Level Output Leakage VPG = 5.0 V 0.1 uA VOL-PG Low-Level Output Voltage IPG = -1mA 0.4 V EN Input VIH High Level Input Voltage 1.5 V VIL Low Level Input Voltage 0.6 V VHYST Input Hysteresis 150 mV IIN-EN Input Leakage VEN=VIN 0.1 uA VEN=0V 0.1 uA Thermal Shutdown TSD Thermal Shutdown Junction Temperature 150 170 C TSDHYST TSD Hysteresis 10 C Note 1: large percentage of supply current due to power FET gate switching losses.

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 6 of 12 Semtech Boost Converter Characteristics Electrical Characteristics, TA = -40C to 85C, VIN = 2.4V, VOUT = 5.0V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit Boost Regulator: L=1.0uH and C=44uF VOUT Output Voltage 3.0 5.5 V VFB Feedback Voltage 1.175 1.2 1.225 V RDSON High Side Switch On Resistance ISW = -1A, TJ=25C 120 mΩ Low Side Switch On Resistance ISW = -1A, TJ=25C 50 mΩ IOCD Over Current Detect LS switch current 3 A VISEN Output Current Threshold Voltage 23 mV VOUT-OV VOUT Over Voltage Threshold 101 102 103 %VOUT DUTYMAX Max Duty Cycle 85 % Functional Description The TS32101 is a fully-integrated, low-voltage synchronous boost converter IC based on a highly-efficient switching topology. It is optimized to be powered from NiMH or Li- Ion batteries and includes features to make it suitable for powering portable equipment as an emergency power/ charging source. A 2MHz internal switching frequency yields a good balance between efficiency and the ability to use small, low-cost LC filter components. Internal Protection Details Internal Current Limit The current through the low side switch is sensed on a cycle by cycle basis and if current limit is reached, it will abbreviate the cycle. Current limit is always active when the boost converter is enabled. Adjustable Output Current Limit The TS32101 has an adjustable output current limit that is implemented by sensing the voltage across an external resistor placed in series with the output. The voltage across this resistor is continuously monitored with no output current limit occurring until the output current is large enough to produce a voltage drop of 23mV across the sense resistor. If the voltage drop across the sense resistor reaches 23mV the TS32101 will reduce the duty cycle to limit the output current and result in a constant output current limit. This feature can be disabled by connecting the ISEN to VOUT and removal of the sense resistor. Adjustable Output Voltage The TS32101 has an adjustable output voltage selected by an external resistor divider in the feedback loop. To change the output voltage, replace resistors RTOP and RBOT with values from the following equation: VOUT = 1.2 * (1 + RTOP / RBOT) Power Good The PG signal provides the ability to monitor fault conditions and power supply sequencing. The PG output is valid high when the TS32101 is enabled, the input voltage is above the VIN under-voltage threshold, the output voltage is above 90% of the desired value, and the device is not in thermal shutdown. The PG output can be utilized for power supply sequencing. When the device is operating normally and the output voltage is above 90% of the desired value, the PG output will be high. A 100us deglitch timer is used to insure that the PG signal does not respond to noise or transients. Thermal Shutdown If the temperature of the die exceeds 150C (typical), the VSW outputs will tri-state to protect the device from damage. The PG and all other protection circuitry will stay active to inform the system of the failure mode. Once the device cools to 140C (typical), the device will attempt to start up again. If the device reaches 150C, the shutdown/restart sequence will repeat. The PG output will be pulled low in this condition.

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 7 of 12 Semtech Output Over Voltage Protection The TS32101 has an output over voltage protection circuit which prevents the device from reaching a dangerously high voltage under sudden light load conditions. The typical Overvoltage detection threshold is 102% of Vout. Output Voltage Disable When the enable pin of the TS32101 is low, not only is switching disabled, but the output is isolated from the input. This functionality is maintained whether the output node is at a higher or a lower potential than the input voltage. Low Power Mode When the output current is low the TS32101 will detect and automatically enter low power mode. In low power mode, switching stops when the output is slightly above the regulation point and the device enters a sleep state. The sleep state continues until the output drops slightly below the regulation point. At this point, switching will resume and if the load current is increased enough to prevent the output from going above the regulation point, low power mode is exited. External Components The internal compensation is optimized for a 47uF output capacitor and a 1.0uH inductor. To keep the output ripple low, a low ESR (less than 35mOhm) ceramic capacitor is recommended.

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 8 of 12 Semtech Functional Description (continued)Package Mechanical Drawings (all dimensions in mm) Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 16 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 3.00 BSC Exposed Pad Width E2 1.55 1.70 1.80 Overall Width E 3.00 BSC Exposed Pad Length D2 1.55 1.70 1.80 Contact Width b 0.20 0.25 0.30 Contact Length L 0.20 0.30 0.40 Contact-to-Exposed Pad K 0.20 - - TOP VIEW BOTTOM VIEW EXPOSED PAD

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 9 of 12 Semtech Recommended PCB Land Pattern DIMENSIONS IN MILLIMETERS Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width W2 - - 1.70 Optional Center Pad Length T2 - - 1.70 Contact Pad Spacing C1 - 3.00 - Contact Pad Spacing C2 - 3.00 - Contact Pad Width (X16) X1 - - 0.35 Contact Pad Length (X16) Y1 - - 0.65 Distance Between Pads G 0.15 - - Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only. Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS32101 Version 2.0 RECOMMEDED PCB LAND PATTERN DIMENSIONS IN MILLIMETERS Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width -­‐ -­‐ 1.70 Optional Center Pad Length -­‐ -­‐ 1.70 Contact Pad Spacing -­‐ 3.00 -­‐ Contact Pad Spacing -­‐ 3.00 -­‐ Contact Pad Width (X16) -­‐ -­‐ 0.35 Contact Pad Length (X16) -­‐ -­‐ 0.65 Distance Between Pads G 0.15 -­‐ -­‐ Notes: Dimensions and tolerances per ASME Y14.5M . BSC: Basic Dimension. Theore tically exact value s shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only. PACAKGING INFORMATION Pb-Free (RoHS): The TS30011/12/13 devices are fully compliant for all materials covered by European Union Di rective 2002/95/EC, and meet all IPC - 1752 Level 3 materials declaration requirements. MSL, Peak Temp: The TS30011/12/13 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J -STD-020D. These devices also have a Peak Profile Solder Temperature (Tp) of 260°C. RECOMMENDED LAND PATTERN Silk Screen

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 10 of 12 Semtech Functional Description (continued)Packaging Information Pb-Free (RoHS): The TS32101 devices are fully compliant for all materials covered by European Union Directive 2002/95/EC, and meet all IPC-1752 Level 3 materials declaration requirements. MSL, Peak Temp: The TS32101 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices also have a Peak Profile Solder Temperature (Tp) of 260°C.

Ordering Information

Application Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Package Thermal Pad Solder Pad (Land Pattern) Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad Package Solder Pad (bottom trace) Thermal Via Component Traces Thermal Isolation Power plane only 1.5748mm 0.0 - 0.071 mm Board Base & Bottom Pad 0.5246 - 0.5606 mm Power Plane (1oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane

4 Plane

Multi-Layer Board (Cross-sectional View)

Final Datasheet Rev 2.1 January 26, 2016 www.semtech.com 11 of 12 Semtech In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. Mold compound Die Epoxy Die attach Exposed pad Solder Thermal Vias with Cu plating Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu 20% Cu coverage 90% Cu coverage 5% - 10% Cu coverage Note: NOT to Scale

Final Datasheet Rev 2.1 January 26, 2016 12 of 12 Semtech Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESUL T IN PERSONAL INJURY , LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015