TS18H

TS18H SUNTAN | Alldatasheet

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HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H F E A T U R E S ‧ Small size ‧ Excellent Break down voltage, low DF ‧ Suit to re-flow soldering, wave soldering, hand soldering

APPLICATIONS

‧ TS18H SMD is widely used in Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, V oltage Multipliers, DC-DC Converter, Back-lighting Inverters.  OUTSIDE DIMENSION Type Dimension (inches) British expression Metric expression Length(L±0.1) Width(W±0.1) 0603 1608 0.06 0.03 0805 2012 0.08 0.05 1206 3216 0.12 0.06 1210 3225 0.12 0.10 1808 4520 0.18 0.08 1812 4532 0.18 0.12 2225 5763 0.22 0.20 Coefficient Parameter NPO Temperature Wave X7R Temperature Wave Temperature Coefficient Dissipation Factor DF ≤0.15% DF≤2.50% Aging None ≤2.5% decade hour Insulation Resistance ≥100GΩ ≥500ΩF OR 50 GΩ Dielectric Strength Rated V oltage Test V oltage Time Ur=100V 2.5Ur 6 0±5S 200V≤Ur≤1000V 1.5Ur 6 0±5S Ur>1000V 1.2Ur 6 0±5S

HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H S P E C I F I C A T I O N S Item Specifications Test Method Operating Temperature Range Class I NPO: -55 ~ +125℃ Class II X7R: -55 ~ +125℃ X5R: -55 ~ +85℃ Y5V: -30 ~ +85℃ Z5U: +10 ~ +85℃ Tolerance ±5%, ±10% ±20% Appearance No visual defects Visual inspection Capacitance Class I Should be within the specified tolerance Capacitance Test Frequency Test Voltage Temperature ≤1000pF 1MHz±10% 1.0±0.2Vrms 25±2℃ ＞1000pF 1KHz±10% Class II Should be within the specified tolerance ≤10μF 1KHz±10% 1.0±0.2Vrms ＞10μF 120±24Hz 0.5±0.1Vrms Z5U 1.0±0.1KHz 0.5±0.05Vrms Dissipation Factor （D.F.） Class I ≤0.15% Test Method: The same as "Capacitance" Class II X7R X5R ≥50V 25V 16V ≤2.5% ≤.35% ≤3.5% Y5V Z5U ≤7.0% (C<1.0μF) ≤9.0% (C≥1.0μF) ≤12.5% ≤12.5% Insulation Resistance （I.R.） Class I C≤10nF，Ri≥50000MΩ C＞10nF，Ri*CR≥500ΩF Rated Voltage Tes Voltage Duration Charge/Disch arge Current Temper ature:25 ±2℃ Humidit y:<75% Class II X7R C≤25nF，Ri≥ 10000MΩ Ur<500V Ur 60±5 sec ≤50 mA X5R C＞25nF，Ri*CR＞ 100ΩF Y5V C≤25nF，Ri≥ 4000MΩ Ur<500V 500V 60±5 sec ≤50 mA Z5U C＞25nF，Ri*CR＞ 100ΩF Suntan

HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H S P E C I F I C A T I O N S Item Specifications Test Method Dielectric Withstanding Voltage （D.W.V.） No breakdown or visual defects Rated Voltage Test Voltage Duration Charge/Discha rge Current Ur<200V 2.5Ur 1~5sec. ≤50mA 200V≤Ur ≤ 1000V 1.5Ur 1~5sec. Ur＞ 1000V 1.2Ur 1~5sec. Dielectric withstanding voltage testing may requires immersion of the capacitor in a isolation fluid,at test voltage over 2000Vdc. Capacitance Temperature Characteristic / Coefficient Class I NPO:0±30ppm/℃ Perform a heat temperature at 150+0/-10℃ for 1hrs,then place room temp. for 24±2hrs. According to the following sequence, measure the capacitance after temperature stabilize for 30min .（△C based on T3） Step Temperature（℃） Class II X7R:≤±15% T1 25±2 X5R:≤±15% T2 Low-category temp. Z5U:+22%～-56% T4 High-category temp. T1 25±2 Solderability No defects,≥90% of each terminal should be covered with fresh solder Preheating Conditions:80~120℃;10～30sec. Solder Temperature ：245±5℃ Immersing Speed:25±0.25mm/s Duration：2±0.5sec. Adhesive Strength of Termination Appearance: No visible damage. Applied Force:5N Duration:10±1sec. Speed:1mm/sec

HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H S P E C I F I C A T I O N S Resistance to Flexure Stresses Appearance No crack or marked defects should occur. Solder the capacitor on the test jig,using a eutectic solder.Then apply a force i n t h e d i r e c t i o n . Deflection:1mm Speed: 1mm/sec △C/C Class I ：≤±5% Class II：≤±10% Resistance to Soldering Heat Appearance No defects,≥90% of each terminal should be covered with fresh solder Preheat the capacitor at 100 to 200℃ for 10±2 minute.Immerse the capacitor in a eutectic solder at 265±5 ℃ for 5±1 seconds.Store at room temperature for 24±2 hours before measureing electric properties. △C/C Class I: ≤±0.5% or ± 0 . 5 p F （whichever is larger） Class II: X7R X5R: -5~+10% Y5V Z5U: -10～+20% D.F. Meets Initial Values (As Above) I.R. Meets Initial Values (As Above) Temperature Cycle Appearance No visual defect Perform a heat temperature at 150+0/-10℃ for 1hrs,then place room temp. for 24±2hrs. △C/C Class I: ≤±1% or ± 1 p F （whichever is larger） Fix the capacitor to the supporting jig,Perform the five cycles according to the four heat treatments listed in the following table.Store at room temperature for 24±2 hours before measureing electric properties. Class II: X7R X5R ≤±10% Step Temperature（℃） Time (min.) Z5U Y5V ≤±20% 1 Low-category temp. 30 D.F. Meets Initial Values (As Above) 2 25±2 3 3 High-category temp. 30 I.R. Meets Initial Values (As Above) 4 25±2 3

HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H S P E C I F I C A T I O N S Humidity Steady State Appearance No visual defect Let the capacitor sit at 40±2℃ and 90 to 95% humidity for 500+24/-0 hours.Remove and let sit for 48±2 hours at room temperature before measureing electric properties. △C/C Class I: ≤±2% or ± 1 p F （whichever is larger） Class II: X7R X5R ≤±10% Z5U Y5V ≤±30% D.F. ≤Initial Values *2 (See Above) I.R. ClassI:Ri≥2500MΩor Ri*CR＞25ΩF （whichever is smaller） ClassII:Ri≥1000MΩor Ri*CR＞25ΩF （whichever is smaller） Loading Life Appearance No visual defect Rated Voltage Applied Voltage Charge/Discharge Current △C/C Class I: ≤±2% or ±1pF （whichever is larger） Ur<500V 2Ur ≤50mA 500V≤Ur ≤ 1000V 1.5Ur Class II: X7R X5R ≤±20% Z5U Y5V ≤±30% Ur＞1000V 1.2Ur D.F. ≤Initial Values *2 (See Above) I.R. ClassI:Ri≥4000MΩor Ri*CR＞40ΩF （whichever is smaller） ClassII:Ri≥2000MΩor Ri*CR＞50ΩF （whichever is smaller）

HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H Precautions on the use of MLCC: 1.eneral Precautions On The Use Of MLCC: The Multi-layer Ceramic Capacitors MLCC may fail when subjected to severe conditions of electrical environment and manchanical stress beyond the specified "rating" and specified condition in the specification.Following the precautions for satefy . 2. PCB Design The amount of solder applied can affect the ability of chips to withstand mechanical stresses, which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads, which determines the amount of solder necessary to form the fillets. When designing the position of so lder pads and SMD capacitors,it should be carefully performed to minimize stress.SMD capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. 3. Considerations For Automatic Placement If the lower limit of the pick-up nozzle is low,too much force may be imposed on the capacitors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. The pick-up pressure should be adjusted between 1 and 3 N static loads. To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins of back-up should be used the under PC board. Suntan

HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H 4. Soldering The ceramic section and metal sec tion combine to the MLCC. As the poor heat conductivity of the ceramic section ,ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling, especialy for large s When hand soldering,use a solderi ng iron with a maximum power of 25W and a maximum tip diameter of 1.0mm.The soldering iron should not touch the capacitor directly . 5.Cleaning The temperature difference between the components and cleaning process should not be greater than 100 .℃ In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes’ strength, thus the following condition Ultrasonic output : Below20W/L Ultrasonic frequency: Below 40KHZ Ultrasonic washing period: 5min or less 6.Breakaway PC Boards When splitting the PC board after mounting capacitors and other components, care is required so as not to give any stresses of twisting to board.1. Be careful not to subject the capacitors to excessive mechanical shocks. Board separation should not be done manually, but by using the appropriate devices. 7. Storage Conditions To maintain the solderability of terminal electrodes and to keep the packaging material in good condition,recommended conditions as the following: Temperature: 5-40℃; Humidity: 20-70% RH Even though MLCC are stored in a good condition ,the solderability of MLCC termimal electrodes will decrease as time goes by, so components should be used within 6 months from the time of delivery.

HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD S u n t a n® TS18H Capacitance & Voltage Size Rated Voltage Capacitance Range (pF) Size Rated Voltage Capacitance Range (pF) NPO X7R NPO X7R 0603 100V 1 ~ 470 100~22 000 1812 100V 3.3~8 200 220~470 000 200V 1~330 100~8 200 200V 3.3~6 800 220~180 000 0805 100V 1~1 000 100~56 000 500V 3.3~4 700 220~150 000 200V 1~820 100~27 000 1000V 3.3~1 200 220~27 000 500V 1~560 100~12 000 2000V 3.3~390 220~12 000 1206 100V 1.5~3 300 100~220 000 3000V 3.3~270 220~5 600 200V 1.5~2 200 100~120 000 4000V 3.3~220 220~1 500 500V 1.5~1 000 100~56 000 2225 100V 10~12 000 470~1000 000 1000V 1.5~680 100~12 000 200V 10~8 200 470~1000 000 1000V 1.5~10 100~5 600 500V 10~5 600 470~470 000 1210 100V 2~5 600 150~330 000 1000V 10~2 700 470~68 000 200V 2~3 900 150~150 000 2000V 10~1 000 470~33 000 500V 2~2 200 150~100 000 3000V 10~680 470~4 700 1000V 2~820 150~15 000 4000V 10~560 470~3 900 2000V 2~470 150~8 200 3035 100V 10~56 000 470~2200 000 1808 100V 2~3 900 150~390 000 200V 10~47 000 470~2200 000 200V 2~3 000 150~180 000 500V 10~12 000 470~1000 000 500V 2~1 800 150~120 000 1000V 10~10 000 470~390 000 1000V 2~820 150~22 000 2000V 10~5 600 470~270 000 3000V 2~150 150~2 700 3000V 10~3 900 470~8 200 4000V 2~100 150~1 000 4000V 10~560 470~3 000 Note: Specification are subject to change without notice. For more detail and update, please visit our website.