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Technical content

Features

  • Ultra-low nA operating current at light load
  • Best-in-class quiescent current of 20nA at Iload=0
  • Best-in-class quiescent current of 100pA in disable mode
  • Output voltage options of 1.2V - 4.2V in 100mV steps (pro- grammed at manufacturing)
  • Accurate output regulation
  • Over-current protection Summary Specifications
  • Low input operating voltage of 2.5V to 5.5V
  • Packaged in a 8pin DFN (2x2)

Description

The TS14002 linear regulator is an ultra-low-power circuit which draws low nA level quiescent current at light load, but has the capability to regulate current loads as high as 200mA.

Applications

  • Portable electronics
  • RFID
  • Industrial
  • Medical
  • Energy harvesting systems
  • SmartCard Typical Applications TS14002 VCC VOUT Load CBYP COUT EN FB GND

February 16, 2016 www.semtech.com 2 of 13 Rev 1.1 Semtech Block Diagram VCC VOUT Current Limit FB Reference Voltage EN Pin Description GND Pin # Pin Name Pin Type (1) Description GND P Ground

2 VOUT

O Regulated Output Voltage NC No Connect (connect to GND or float) NC No Connect (connect to GND or float) NC No Connect (connect to GND or float) FB I Feedback Input

7 VCC

P Input Power EN I Enable Input (1) I = Input, O = Output, P = Power Absolute Maximum Rating Over operating free–air temperature range unless otherwise noted(2, 3, 4) Parameter Value Unit VCC, VOUT, EN, FB -0.3 to 6.0 V Electrostatic Discharge (Human Body Model) 2 kV Operating Junction Temperature Range, TJ -20 to 85 °C Storage Temperature Range, TSTG -65 to 150 °C Lead Temperature (soldering, 10 seconds) 260 °C (2) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con- ditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (3) All voltage values are with respect to network ground terminal. (4) ESD testing is performed according to the respective JESD22 JEDEC standard.

February 16, 2016 www.semtech.com 3 of 13 Rev 1.1 Semtech Thermal Characteristics Package DFN θJA (°C/W) (See Note 5) θJC (°C/W) (See Note 6) 8 pin 73.1 10.7 (5) This assumes a FR4 board only. (6) This assumes a 1 Oz. Copper JEDEC standard board with thermal vias – See Exposed Pad section and application note for more information. Recommended Operating Conditions Parameter Min Typ Max Unit Unregulated Supply Input Voltage (VCC) 2.5 5.5 V Enable Input (EN) 0 5 V Regulated Supply Output Voltage (VOUT) typical 1.2 4.2 V Operating Ambient Temperature, TA (Note 7) -40 55 °C Operating Junction Temperature, TJ -40 85 °C Input Bypass Capacitor (CBYP) 2.2 uF Output Bypass Capacitor (COUT) 1 2.2 4.7 uf (7) T Max shown here is a guideline. Higher T can be tolerated if T does not exceed the Absolute Maximum Rating. A A J Characteristics Electrical characteristics, VCC = 2.5V to 5V, TJ = 25C, unless otherwise noted Symbol Parameter Condition Min Typ Max Unit VBAT Input Supply Voltage 2.5 5.5 V VilEN Input Low Logic Level 0.3*VCC V VihEN Input High Logic Level 0.7*VCC V Iqq Quiescent Current VCC = 2.5V to 5.5V, IOUT = 0 nA Iqq-disable Quiescent Current: Disable Mode IOUT = 0, EN = 0 100 pA Iop-gnd Operating Current VCC = VCC_MIN, IOUT = 200mA (Note 8) 200 uA VCC = VCC_NOM, IOUT = 200mA (Note 8) 200 uA VCC = VCC_MAX, IOUT = 200mA (Note 8) 200 uA Iout Load Capability Voutnominal from 1.2V to 3.5V 200 mA Voutnominal >3.5V 100 nominal CC_MIN CC_MIN CC_MAX CC_NOM CC_MAX CC_MIN

February 16, 2016 www.semtech.com 4 of 13 Rev 1.1 Semtech Characteristics Continued Electrical characteristics, VCC = 2.5V to 5V, TJ = 25C, unless otherwise noted Symbol Parameter Condition Min Typ Max Unit VLine DC Line Regulation VCC = VCC_MIN to VCC_MAX, VOUT =1.8V to 4.2V, IOUT = 50mA 0.5 VCC = VCC_MIN to VCC_MAX, VOUT < 1.8V, IOUT = 50mA VLoad DC Load Regulation VCC = VCC_NOM, IOUT = 0.02mA to 200mA, Ilimit Current Limit IOUT measured at VOUT = 0.9*Voutnominal ; Voutnominal from 1.2V to 3.5V 250 mA IOUT measured at VOUT = 0.9*Voutnominal ; Voutnominal >3.5V 175

February 16, 2016 www.semtech.com 5 of 13 Rev 1.1 Semtech Typical Characteristics Iqq Performance Iqq Performance Iqq Performance vs. Load Current Iqq Performance vs. Load Current Line Regulation Performance VOUT Performance vs. Temperature

February 16, 2016 www.semtech.com 6 of 13 Rev 1.1 Semtech Dropout Voltage When VOUT Drops By 3% Load Regulation Performance Dropout Voltage = VCC - VOUT Load Step Response Load Step Response Load Step Response Line Step Response

February 16, 2016 www.semtech.com 7 of 13 Rev 1.1 Semtech Output Enable Timing

February 16, 2016 www.semtech.com 8 of 13 Rev 1.1 Semtech Package Mechanical Drawings (all dimensions in mm) Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Exposed Pad Width E2 0.75 0.90 1.00 Overall Width E 2.00 BSC Exposed Pad Length D2 1.55 1.70 1.80 Contact Width b 0.18 0.25 0.30 Contact Length L 0.20 0.30 0.40 Contact-to-Exposed Pad K 0.20 - - Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only.

February 16, 2016 www.semtech.com 9 of 13 Rev 1.1 Semtech Recommeded PCB Land Pattern DIMENSIONS IN MILLIMETERS Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width W2 - - 1.70 Optional Center Pad Length T2 - - 0.90 Contact Pad Spacing C1 - 2.00 - Contact Pad Spacing C2 - - - Contact Pad Width (X8) X1 - - 0.35 Contact Pad Length (X8) Y1 - - 0.65 Distance Between Pads G 0.15 - -

February 16, 2016 www.semtech.com 10 of 13 Rev 1.1 Semtech Application Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Solder Pad (Land Pattern) Package Thermal Pad Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad Component Traces

4 Plane

2 Plane

1.5748mm Thermal Via 1.5038 - 1.5748 mm Component Trace (2oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) Thermal Isolation Power plane only Package Solder Pad (bottom trace) 0.5246 - 0.5606 mm Power Plane (1oz Cu) 0.0 - 0.071 mm Board Base & Bottom Pad Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc.

February 16, 2016 www.semtech.com 11 of 13 Rev 1.1 Semtech Mold compound Die Epoxy Die attach Exposed pad Solder 5% - 10% Cu coverage Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu Thermal Vias with Cu plating 90% Cu coverage 20% Cu coverage Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board.

February 16, 2016 Rev 1.1 Semtech

Ordering Information

vvv Output Voltage* 012 1.2 V 018 1.8 V 025 2.5 V 033 3.3 V 042 4.2 V * Custom values also available (1.2V - 4.2V typical in 100mV increments) RoHS and Reach Compliance Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following:

  • Cadmium (Cd)
  • Chlorofluorocarbons (CFCs)
  • Chlorinate Hydrocarbons (CHCs)
  • Halons (Halogen free)
  • Hexavalent Chromium (CrVI)
  • Hydrobromofluorocarbons (HBFCs)
  • Hydrochlorofluorocarbons (HCFCs)
  • Lead (Pb)
  • Mercury (Hg)
  • Perfluorocarbons (PFCs)
  • Polybrominated biphenyls (PBB)
  • Polybrominated Diphenyl Ethers (PBDEs) TS14002 www.semtech.com 12 of 13

February 16, 2016 Rev 1.1 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation

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Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com TS14002 13 of 13