TS14001 ETC2 | Alldatasheet

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  • 1 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC nanoSmart® Ultra-Low-Power Linear Regulator DESCRIPTIONS FEATURES Block Diagram GND EN VOUT Reference Voltage VCC Current Limit FB The TS14001 linear r egulator is an ultra -low- power circuit which draws low nA level quiescent current at light load, but has the capability to regulate current loads as high as 200mA.

APPLICATIONS

 Portable electronics  RFID  Industrial  Medical  Energy harvesting systems  SmartCard  Ultra-low nA operating current at light load  Best-in-class quiescent current of 20nA at Iload=0  Best-in-class quiescent current of 100pA in disable mode  Output voltage options of 1.2V - 4.2V in 100mV steps (programmed at manufacturing)  Accurate output regulation  Over-current protection SUMMARY SPECIFICATIONS  Low input operating voltage of 2.5V to 5.5V  Packaged in a 8pin DFN (2x2)

  • 2 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TYPICAL APPLICATION Load GND EN VOUTVCC FB TS14001 COUTCBYP PIN-OUT CONFIGURATION PIN # NAME I/O/P DESCRIPTION

1 GND P Ground

2 VOUT O Regulated Output Voltage

3 NC No Connect (connect to GND or float)

4 NC No Connect (connect to GND or float)

5 NC No Connect (connect to GND or float)

6 FB I Feedback Input

7 VCC P Input Power

8 EN I Enable Input

Over operating free–air temperature range unless otherwise noted(1,2,3) PIN / PARAMETER VALUE UNIT VCC, VOUT, EN, FB -0.3 to 6.0 V Electrostatic Discharge (Human Body Model) 2 kV Operating Junction Temperature Range, TJ -20 to 85 C Storage Temperature Range, TSTG -65 to 150 C Lead Temperature (soldering, 10 seconds) 260 C Note 1: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are st ress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. Note 2: All voltage values are with respect to network ground terminal. Note 3: ESD testing is performed according to the respective JESD22 JEDEC standard.

  • 3 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC THERMAL CHARACTERISTICS Package DFN JA (C/W) (See Note 4) JC (C/W) (See Note 5) 8 pin 73.1 10.7 Note 4: This assumes a FR4 board only. Note 5: This assumes a 1oz. Copper JEDEC standard board with thermal vias. See Exposed Pad section and application note for more information. RECOMMENDED OPERATING CONDITIONS Parameter Min Typ Max Unit Unregulated Supply Input Voltage (VCC) 2.5 5.5 V Enable Input (EN) 0 5 V Regulated Supply Output Voltage (VOUT) typical 1.2 4.2 V Operating Ambient Temperature, TA (Note 6) -40 55 °C Operating Junction Temperature, TJ -40 85 °C Input Bypass Capacitor (CBYP) 2.2 uF Output Bypass Capacitor (COUT) 1 2.2 4.7 uf Note 6: TA Max shown here is a guideline. Higher TA can be tolerated if TJ does not exceed the Absolute Maximum Rating. CHARACTERISTICS Electrical characteristics, VCC = 2.5V to 5V, TJ = 25C, unless otherwise noted Symbol Parameter Condition Min Typ Max Unit VBAT Input Supply Voltage 2.5 5.5 V VilEN Input Low Logic Level 0.3*VCC V VihEN Input High Logic Level 0.7*VCC V Iqq Quiescent Current VCC = 2.5V to 5.5V, IOUT = 0 20 nA Iqq-disable Quiescent Current: Disable Mode IOUT = 0, EN = 0 100 pA Iop-gnd Operating Current VCC = VCC_MIN, IOUT = 200mA (Note 7) 200 uA VCC = VCC_NOM, IOUT = 200mA (Note 7) 200 uA VCC = VCC_MAX, IOUT = 200mA (Note 7) 200 uA Iout Load Capability Voutnominal from 1.2V to 3.5V 0 200 mA Voutnominal >3.5V 0 100 VCC_MIN.
  • 4 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC CHARACTERISTICS CONTINUED Electrical characteristics, VCC = 2.5V to 5V, TJ = 25C, unless otherwise noted Symbol Parameter Condition Min Typ Max Unit VLine DC Line Regulation VCC = VCC_MIN to VCC_MAX, VOUT =1.8V to 4.2V, IOUT = 50mA 0.5 1 % VCC = VCC_MIN to VCC_MAX, VOUT < 1.8V, IOUT = 50mA 2 % VLoad DC Load Regulation VCC = VCC_NOM, IOUT = 0.02mA to 200mA, 1 2 % Ilimit Current Limit IOUT measured at VOUT = 0.9*Voutnominal ; Voutnominal from 1.2V to 3.5V 250 mA IOUT measured at VOUT = 0.9*Voutnominal ; Voutnominal >3.5V 175
  • 5 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TYPICAL CHARACTERISTICS Iqq Performance Iqq Performance Iqq Performance vs. Load Current Iqq Performance vs. Load Current Line Regulation Performance VOUT Performance vs. Temperature
  • 6 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC Dropout Voltage When VOUT Drops By 3% Load Regulation Performance Dropout Voltage = VCC - VOUT Load Step Response Load Step Response Load Step Response Line Step Response
  • 7 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC Output Enable Timing
  • 8 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC PACKAGE MECHANICAL DRAWINGS
  • 9 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC RECOMMENDED PCB LAND PATTERN
  • 10 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC APPLICATION USING A MULTI-LAYER PCB To maximize the efficiency of this package for application on a single layer or multi -layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. JEDEC standard FR4 PCB Cross-section: Multi-Layer Board (Cross-sectional View) In a multi -layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. Package Thermal Pad Solder Pad (Land Pattern) Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB (square) Package Solder Pad Package Solder Pad (bottom trace) Thermal Via Component Traces Thermal Isolation Power plane only 1.5748mm 0.0 - 0.071 mm Board Base & Bottom Pad 0.5246 - 0.5606 mm Power Plane (1oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane

4 Plane

  • 11 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de -rated for ambient temperatures above 85C. The de -rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. APPLICATION USING A SINGLE LAYER PCB Layout recommendations f or a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. Mold compound Die Epoxy Die attach Exposed pad Solder Thermal Vias with Cu plating Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu 20% Cu coverage 90% Cu coverage 5% - 10% Cu coverage Note: NOT to Scale Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline
  • 12 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC

ORDERING INFORMATION

vvv Output Voltage* 012 1.2 V 018 1.8 V 025 2.5 V 033 3.3 V 042 4.2 V * Custom values also available (1.2V - 4.2V typical in 100mV increments)

  • 13 - TS14001 Version 1.4 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC Legal Notices Information contained in this publication regarding device applications and the like is provided only for your convenience an d may be superseded by updates. It is your responsibility to en sure that your application meets with your specifications. “Typical” parameters which may be provided in Triune Systems data sheets and/or specifications can and do vary in different applications and actual performance may vary over time . All operating parameters, including “Typicals” must be validated for your application by your technical experts. TRIUNE SYSTEMS MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Triune Systems disclaims all liability arising from this information and its use. Triune System products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Triune Systems product could create a situation where perso nal injury or death may occur. Should the Buyer purchase or use Triune Systems products for any such unintended or unauthorized application, the Buyer shall indemnify and hold Triune Systems, and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Triune Systems was negligent regarding the design or manufacture of the part. No licenses are conveyed, implicitly or otherwise, under any Triune Systems intellectual property rights. Trademarks All other trademarks mentioned herein are property of their respective companies. © 2012 Triune Systems, LLC. All Rights Reserved.