TS12001 ETC2 | Alldatasheet
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Technical content
- 1 - TS12001 Version 1.3 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC nanoSmart® Battery Management Under-Voltage Load Switch DESCRIPTION FEATURES Off-Active™ feature with ultra-low pico-amp current Best-in-class Off-active™ quiescent current of 100pA Ultra-low on-active quiescent current of 70nA Accurate on to Off-active™ voltage threshold Threshold voltage options of 1.2V - 4.2V in 100mV steps (programmed at manufacturing) Supervisory over-current limit shutdown Low Rds(on): 175mΩ typical @ 5V Low drop out disconnect from VBAT to loads Turn-on slew rate controlled 500mV off to on-active hysteresis SUMMARY SPECIFICATIONS Wide input voltage range: 1.2V – 5.5V Packaged in a 8pin DFN (2x2) Block Diagram The TS12001 Off-Active™ battery management load s witch is used to protect a battery from excessive discharge. It consists of an internally generated threshold voltage (VTHRESH), comparator with hysteresis, slew rate control for the load switch, a P -Channel load switch, and a n open-drain indicator pin. When the input battery voltage is above VTHRESH, the load switch is on- active. When the input battery v oltage falls to VTHRESH, the load switch is Off-Active™ and the quiescent current draw is approximately 100pA.
APPLICATIONS
Portable Battery Industrial Medical SmartCard RFID Energy Harvesting Systems G N D R e g u la te d T h re s h o ld V O U T n P G V C C
- 2 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 TYPICAL APPLICATIONS Charger Load Disconnect the Battery TS12001 GND VOUT nPG VCC CBYP Note: When the TS12001 is Off-Active™, the battery will continue to charge through the body diode between VOUT and VCC. Charger Load Disconnect the Load TS12001 GND VOUT nPG VCC CBYP
- 3 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 PIN-OUT CONFIGURATION PIN # NAME I/O/P DESCRIPTION
1 GND P GND
2 VOUT O Output to System Load
3 NC No Connect (connect to GND or float)
4 NC No Connect (connect to GND or float)
5 NC No Connect (connect to GND or float)
6 VCC I/P Supply Input
7 VCC I/P Supply Input
8 nPG O Open-Drain N-Channel Output (low indicates Power Good) ABSOLUTE MAXIMUM RATINGS Over operating free–air temperature range unless otherwise noted(1,2,3) PIN / PARAMETER VALUE UNIT VCC, VOUT, nPG -0.3 to 6.0 V Electrostatic Discharge – Human Body Model 2 kV Operating Junction Temperature Range, TJ -20 to 85 C Storage Temperature Range, TSTG -65 to 150 C Lead Temperature (soldering, 10 seconds) 260 C Note 1: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are str ess ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. Note 2: All voltage values are with respect to network ground terminal. Note 3: ESD testing is performed according to the respective JESD22 JEDEC standard. THERMAL CHARACTERISTICS Package DFN JA (C/W) (See Note 4) JC (C/W) (See Note 5) 8 pin 73.1 10.7 Note 4: This assumes a FR4 board only. Note 5: This assumes a 1 Oz. Copper JEDEC standard board with thermal vias – See Exposed Pad section and application note for more information.
- 4 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 RECOMMENDED OPERATING CONDITIONS Parameter Min Typ Max Unit Unregulated Supply Input Voltage (VCC) 1.2 5.5 V Operating Ambient Temperature, TA (Note 6) -20 55 °C Operating Junction Temperature, TJ -20 85 °C Input Bypass Capacitor (CBYP) 100 nF Note 6: TA Max shown here is a guideline. Higher TA can be tolerated if TJ does not exceed the Absolute Maximum Rating. CHARACTERISTICS Electrical characteristics, VCC = 1.2V to 5.5V, TJ = 25C, unless otherwise noted Symbol Parameter Condition Min Typ Max Unit Input Supply VCC Input Supply Voltage 1.2 5.5 V Iq-ON Quiescent current: on-active Mode VCC = 5V, No Load 70 150 nA Iq-OFF Quiescent current: Off-Active™ Mode VCC < VTHRESH, No Load 100 pA Load Switch IOC Over Current Shutdown VCC = 5.0V 3 A TOC Over Current Retry Period VCC = 5.0V 1.7 ms ILEAK-SW Output Switch Leakage Current VCC < VTHRESH; VOUT Grounded 100 pA Rds-on Switch On Resistance VCC = 5.0V 175 m VCC = 3.3V 200 m VCC = 1.8V 350 m Transition times td1 Transition delay: on-active to Off-Active™ VOFF = 2.0V, VCC = 3.0V 1.5V 650 s td2 Transition delay: Off-Active™ to on-active VOFF = 2.0V, VCC = 1.5V 3.0V 1.7 ms TON Output turn-on rise time VCC = 2.5V, RLOAD = 50 200 s nPG Output ILEAK-nPG Output Leakage VCC = 5.0V, VnPG = 5.5V 100 nA VOL-nPG Low-Level Output Voltage InPG = 5 mA 0.4 V Off-Active Thresholds VOFF Off-Active™ Threshold VTHRESH = 1.2V to 3.3V 0.95* VTHRESH VTHRESH 1.05* VTHRESH V VHys Off-Active™ to on-active Hysteresis Rising Transition: Off-Active™ to on-active 500 mV
- 5 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 TYPICAL CHARACTERISTICS On-Active / Off-Active™ Characteristics On-Active Switching Behavior On-Active / Off-Active™ Iq Off-Active™ VTHRESH Temperature Performance On-Active / Off-Active™ Transition Delay Over Current Retry Performance
- 6 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 PACKAGE MECHANICAL DRAWINGS
- 7 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 RECOMMENDED PCB LAND PATTERN
- 8 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 APPLICATION USING A MULTI-LAYER PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. JEDEC standard FR4 PCB Cross-section: Multi-Layer Board (Cross-sectional View) In a multi -layer board application, the thermal vias are the primary method of he at transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal v ias, thickness of copper, etc. Package Thermal Pad Solder Pad (Land Pattern) Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB (square) Package Solder Pad Package Solder Pad (bottom trace) Thermal Via Component Traces Thermal Isolation Power plane only 1.5748mm 0.0 - 0.071 mm Board Base & Bottom Pad 0.5246 - 0.5606 mm Power Plane (1oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane
4 Plane
- 9 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output c urrent rating for the linear regulators may have to be de -rated for ambient temperatures above 85C. The de -rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. APPLICATION USING A SINGLE LAYER PCB Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachmen t method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. Mold compound Die Epoxy Die attach Exposed pad Solder Thermal Vias with Cu plating Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu 20% Cu coverage 90% Cu coverage 5% - 10% Cu coverage Note: NOT to Scale Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline
- 10 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3
ORDERING INFORMATION
vvv Threshold Voltage (VTHRESH)* 017 1.7 V 021 2.1 V 023 2.3 V 024 2.4 V 025 2.5 V 026 2.6 V 028 2.8 V 030 3.0 V * Custom values also available (1.2V - 4.2V typical in 100mV increments)
- 11 - Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 Legal Notices Information contained in this publication regarding device applications and the like is provided on ly for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. “Typical” parameters whic h may be provided in Triune Systems data sheets and/or specifications can and do v ary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for your application by your technical experts. TRIUNE SYSTEMS MAKES NO R EPRESENTATIONS OR WARRANTIES OF ANY KIND WH ETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Triune Systems disclaims all liability arising from thi s information and its use. Triune System products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to su pport or sustain life, or for any other applicatio n in which the failure of the Triune Systems product could create a situation where personal injury or death may occur. Shoul d the Buyer purchase or use Triune Systems products for any such unintended or unauthorized application, the Buyer shall indemnify and hold Triune Systems, and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expe nses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Triune Systems was negligent regarding the design or manufacture of the part. No licenses are conveyed, implici tly or otherwise, under any Triune Systems intellectual property rights. Trademarks All other trademarks mentioned herein are property of their respective companies. © 2012 Triune Systems, LLC. All Rights Reserved.