TS12001 SEMTECH | Alldatasheet

Document overview

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Technical content

Features

  • Off-Active™ feature with ultra-low pico-amp current
  • Best-in-class Off-active™ quiescent current of 100pA
  • Ultra-low on-active quiescent current of 70nA
  • Accurate on to Off-active™ voltage threshold
  • Threshold voltage options of 1.2V - 4.2V in 100mV steps (programmed at manufacturing)
  • Supervisory over-current limit shutdown
  • Low Rds(on): 175mΩ typical @ 5V
  • Low drop out disconnect from VBAT to loads
  • Turn-on slew rate controlled
  • 500mV off to on-active hysteresis Summary Specifications
  • Wide input voltage range: 1.2V – 5.5V
  • Packaged in a 8pin DFN (2x2)

Description

The TS12001 Off-Active™ battery management load switch is used to protect a battery from excessive discharge. It consists of an internally generated threshold voltage (VTHRESH), comparator with hysteresis, slew rate control for the load switch, a P-Channel load switch, and an open-drain indicator pin. When the input battery voltage is above VTHRESH, the load switch is on-active. When the input battery voltage falls to VTHRESH, the load switch is Off-Active™ and the quiescent current draw is approximately 100pA.

Applications

  • Portable Battery
  • Industrial
  • Medical
  • SmartCard
  • RFID
  • Energy Harvesting Systems Block Diagram GN D Re gula te d Th re sh ol d VO UT nP G VC C

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 2 of 11 Semtech Charger Load Disconnect the Load TS12001 GND VOUT nPG VCC CBYP Charger Load Disconnect the Battery TS12001 GND VOUT nPG VCC CBYP Note: When the TS12001 is Off-Active™, the battery will continue to charge through the body diode between VOUT and VCC. Typical Applications

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 3 of 11 Semtech Pin Description Pin # Pin Name Pin Type (1) Description

1 GND P GND

2 VOUT O Output to System Load

3 NC No Connect (connect to GND or float)

4 NC No Connect (connect to GND or float)

5 NC No Connect (connect to GND or float)

6 VCC I/P Supply Input

7 VCC I/P Supply Input

8 nPG O Open-Drain N-Channel Output (low indicates Power Good) (1) I = Input, O = Output, P = Power Absolute Maximum Ratings Over operating free–air temperature range unless otherwise noted(2, 3, 4) Parameter Value Unit VCC, VOUT, nPG -0.3 to 6.0 V Electrostatic Discharge – Human Body Model 2 kV Operating Junction Temperature Range, TJ -20 to 85 °C Storage Temperature Range, TSTG -65 to 150 °C Lead Temperature (soldering, 10 seconds) 260 °C (2) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con- ditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (3) All voltage values are with respect to network ground terminal. (4) ESD testing is performed according to the respective JESD22 JEDEC standard. Thermal Characteristics Package DFN θJA (°C/W) (See Note 5) θJC (°C/W) (See Note 6) 8 pin 73.1 10.7 (5) This assumes a FR4 board only. (6) This assumes a 1 Oz. Copper JEDEC standard board with thermal vias – See Exposed Pad section and application note for more information.

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 4 of 11 Semtech Recommended Operating Conditions Parameter Min Typ Max Unit Unregulated Supply Input Voltage (VCC) 1.2 5.5 V Operating Ambient Temperature, TA (Note 7) -20 55 °C Operating Junction Temperature, TJ -20 85 °C Input Bypass Capacitor (CBYP) 100 nF (7) TA Max shown here is a guideline. Higher TA can be tolerated if TJ does not exceed the Absolute Maximum Rating. Characteristics Electrical characteristics, VCC = 1.2V to 5.5V, TJ = 25C, unless otherwise noted Symbol Parameter Condition Min Typ Max Unit Input Supply VCC Input Supply Voltage 1.2 5.5 V Iq-ON Quiescent current: on-active Mode VCC = 5V, No Load 70 150 nA Iq-OFF Quiescent current: Off-Active™ Mode VCC < VTHRESH, No Load 100 pA Load Switch IOC Over Current Shutdown VCC = 5.0V 3 A TOC Over Current Retry Period VCC = 5.0V 1.7 ms ILEAK-SW Output Switch Leakage Current VCC < VTHRESH; VOUT Grounded 100 pA Rds-on Switch On Resistance VCC = 5.0V 175 mΩ VCC = 3.3V 200 mΩ VCC = 1.8V 350 mΩ Transition Times td1 Transition delay: on-active to Off-Active™ VOFF = 2.0V, VCC = 3.0V → 1.5V 650 μs td2 Transition delay: Off-Active™ to on-active VOFF = 2.0V, VCC = 1.5V → 3.0V 1.7 ms tON Output turn-on rise time VCC = 2.5V, RLOAD = 50Ω 200 μs nPG Output ILEAK-nPG Output Leakage VCC = 5.0V, VnPG = 5.5V 100 nA VOL-nPG Low-Level Output Voltage InPG = 5 mA 0.4 V Off-Active Thresholds VOFF Off-Active™ Threshold VTHRESH = 1.2V to 3.3V 0.95* VTHRESH VTHRESH 1.05* VTHRESH V VHys Off-Active™ to on-active Hysteresis Rising Transition: Off-Active™ to on-active 500 mV

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 5 of 11 Semtech Typical Characteristics Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 TYPICAL CHARACTERISTICS On-Active / Off-Active™ Characteristics On-Active Switching Behavior On-Active / Off-Active™ Iq Off-Active™ VTHRESH Temperature Performance On-Active / Off-Active™ Transition Delay Over Current Retry Performance Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 PACKAGE MECHANICAL DRAWINGS

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 6 of 11 Semtech Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Exposed Pad Width E2 0.75 0.90 1.00 Overall Width E 2.00 BSC Exposed Pad Length D2 1.55 1.70 1.80 Contact Width b 0.18 0.25 0.30 Contact Length L 0.20 0.30 0.40 Contact-to-Exposed Pad K 0.20 - - Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only. Package Mechanical Drawings (all dimensions in mm)

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 7 of 11 Semtech Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS12001 Version 1.3 RECOMMENDED PCB LAND PATTERN Recommeded PCB Land Pattern DIMENSIONS IN MILLIMETERS Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width W2 - - 1.70 Optional Center Pad Length T2 - - 0.90 Contact Pad Spacing C1 - 2.00 - Contact Pad Spacing C2 - - - Contact Pad Width (X8) X1 - - 0.35 Contact Pad Length (X8) Y1 - - 0.65 Distance Between Pads G 0.15 - -

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 8 of 11 Semtech Functional Description (continued)Application Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Package Thermal Pad Solder Pad (Land Pattern) Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad Package Solder Pad (bottom trace) Thermal Via Component Traces Thermal Isolation Power plane only 1.5748mm 0.0 - 0.071 mm Board Base & Bottom Pad 0.5246 - 0.5606 mm Power Plane (1oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane

4 Plane

Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc.

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 9 of 11 Semtech The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. Mold compound Die Epoxy Die attach Exposed pad Solder Thermal Vias with Cu plating Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu 20% Cu coverage 90% Cu coverage 5% - 10% Cu coverage Note: NOT to Scale

Final Datasheet Rev 1.3 April 30, 2015 www.semtech.com 10 of 11 Semtech

Ordering Information

vvv Threshold Voltage (VTHRESH)* 017 1.7 V 021 2.1 V 023 2.3 V 024 2.4 V 025 2.5 V 026 2.6 V 028 2.8 V 030 3.0 V * Custom values also available (1.2V - 4.2V typical in 100mV increments) RoHS and Reach Compliance Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following:

  • Cadmium (Cd)
  • Chlorofluorocarbons (CFCs)
  • Chlorinate Hydrocarbons (CHCs)
  • Halons (Halogen free)
  • Hexavalent Chromium (CrVI)
  • Hydrobromofluorocarbons (HBFCs)
  • Hydrochlorofluorocarbons (HCFCs)
  • Lead (Pb)
  • Mercury (Hg)
  • Perfluorocarbons (PFCs)
  • Polybrominated biphenyls (PBB)
  • Polybrominated Diphenyl Ethers (PBDEs)

Final Datasheet Rev 1.3 April 30, 2015 11 of 11 Semtech Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESUL T IN PERSONAL INJURY , LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015