Datasheet - TS110-7 - High surge voltage 1.25 A SCR for circuit breaker
Document overview
- Manufacturer or author: STMICROELECTRONICS
- PDF pages: 13
Technical content
Features
- On-state rms current, I T(RMS) 1.25 A
- Repetitive peak off-state voltage, V DRM/VRRM, 700 V
- Non-repetitive direct surge peak off-state voltage, 1250 V
- Non-repetitive reverse surge peak off-state voltage, 850 V
- Triggering gate current, I GT (Q1) 100 µA
Applications
- Ground fault circuit interrupters
- Arc fault circuit interrupters
- Overvoltage crowbar protection in power supplies
- Residual current device
- Residual current circuit breaker with overload protection
Description
Thanks to highly sensitive triggering levels, the TS110-7 series is suitable for circuit breaker applications where the available gate current is limited. Such applications include GFCI (ground fault circuit interrupter), AFCI (arc fault circuit interrupter), RCD (residual current device), and RCBO (residual current circuit breaker with overload protection). This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. TS110-7 enables high robustness of the whole circuit breaker. The low leakage current of the TS110-7 reduces power consumption over the entire lifetime of the circuit breaker. The TS110-7 is available in through-hole TO-92 package with GAK pinout and in SMBflat-3L. G A K A K G A K G TO-92SMBflat-3L Product status link TS110-7 Product summary IT(RMS) 1.25 A VDRM/VRRM 700 V IGTstandard 100 µA High surge voltage 1.25 A SCR for circuit breaker TS110-7 Datasheet DS8670 - Rev 5 - April 2023 For further information contact your local STMicroelectronics sales office.
1 Characteristics
Table 1. Absolute ratings (limiting values, TJ = 25 °C unless otherwise specified) Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
- Minimum I GT is guaranteed at 5 % of IGT max.
- For both polarities of A2 referenced to A1
Table 3. Static electrical characteristics
- For both polarities of A2 referenced to A1
Table 4. Thermal resistance
- Copper surface under tab.
1.1 Characteristics (curves)
Figure 1. Maximum average power dissipation versus Figure 2. Average and DC on-state current versus lead Figure 3. Average and DC on-state current versus lead Figure 4. Average and DC on-state current versus ambient Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of gate triggering current and
2 AC line transient voltage ruggedness
IEC 61000-4-5 standard conditions. The TS110-7 folds back safely to the on state as shown in Figure 16. non repetitive test can be done at least 10 times. Figure 15. Overvoltage ruggedness test circuit for IEC 61000-4-5 standards Figure 16. Typical current and voltage waveforms across the TS110-7 during IEC 61000-4-5 standard test
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
3.1 TO-92 package information
- Lead free plating + halogen-free molding resin
- Epoxy meets UL94, V0
Figure 17. TO-92 package outline Table 5. TO-92 package mechanical data
- Inches dimensions given for information
Package information
3.2 SMBflat-3L package information
- Epoxy meets UL94, V0
- Lead-free package
Figure 18. SMBflat-3L package outline following table are guaranteed. Table 6. SMBflat-3L mechanical data
Figure 19. Footprint recommendations, dimensions in mm (inches) Note: This drawing may not be in scale; however, all the specified dimensions are guaranteed.
4 Ordering information
Figure 20. Ordering information scheme Table 7. Ordering information
2500 Bulk
Ordering information
Revision history
Table 8. Document revision history 01-Sep-2012 1 Initial release. 11-Sep-2012 2 Added SMBflat-3L package. 17-Oct-2013 3 Corrected typographical error in Figure 8. 18-Jun-2014 4 Updated device name. 17-Apr-2023 5 Updated Figure 18 and Table 6. Minor text changes.
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