TS0808ZZ-50R0JN-2S BARRY | Alldatasheet
Document overview
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Technical content
DC-44GHz 4W AlN SMT Termination w/ ‘Flip-Chip’ Terminals TS0808ZZ-50R0JN-2S
- Surface Mountable
- Solder or Epoxy Attachment
- RoHS Compliant or SnPb Available
- Customer Defined Testing Available TS0808ZZ-50R0JN-2S Features: TS0808ZZ-50R0JN-2S Parameters: TS0808ZZ-50R0JN-2S Dimensions:
- ±5% Resistor Tolerance
- Tape and Reel or Waffle Pack Available (Standard is Bulk) Barry Industries barryind.com 60 Walton St. Attleboro, MA 02703 • T (508) 226-3350 • F (508) 226-3317 • sales@barryind.com TS0808ZZ-50R0JN-2S Power Derating Curve Barry Industries reserves the right to change part number and/or process without notification. Operating Frequency: DC - 44GHz CW Input Power: 4W* Peak Input Power (at 30% Duty Cycle): 20W for 10µ Seconds 10W for 50µ Seconds 5W for 1000µ Seconds Return Loss (Typical)**: 20dB or Better Impedance: 50Ω Resistor Construction: Thick Film on AlN Operating Temperature: -55 to +150°C Barry Industries maintains an ISO9001 Certified Quality Management System and is an ITAR Registered company. ORIG. REV. No. Dimensions in inches [mm]. Tolerance is ± 0.005 [0.254] unless otherwise stated PAGE 1 OF 2 * Rating based on ≤100°C constant baseplate temperature on recommended PCB land pattern w/ power applied ** Performance based on board thicknesses of 8 to 10 mils with Єr= 3.2 to 3.6 in a matched, continious 50Ω system with proper workmanship. Performance on other boards may vary. Contact factory with board properties for a custom simulation. JUNE 12 2017 F Actual Size 0808 TS 0808 ZZ - 50R0 J N - 2S UU Substrate BA - Palladium Silver CB - SnPb over Nickel over Silver CT - 100% Matte Tin over Nickel over Silver GA - Gold RoHS Yes No Yes Yes Magnetic No Yes Yes No Solder No Yes Yes No Epoxy Yes No No Yes Wirebond No No No No 2S - 0.025” AlNJ - 5% Normal Inspection Terminal Metallization Size 50R0 - 50Ω Value Code Tolerance Contact factory for additional options Packaging Blank - Bulk WP - Waffle Pack TRD - Tape and Reel OCT 14 2021 0.079 2.01 0.079 2.01 0.015 0.38 Min. 0.010 0.26 Min. 0.013 0.32 (2X) 0.025 0.64 Back marked with impedance Alignment mark indicates input side 100 % of Rated Power 0 25 50 75 100 125 150 Baseplate Temperature °C Prefix for Chip Termination w/ Single-Sided Terminals
barryind.com 60 Walton St. Attleboro, MA 02703 • T (508) 226-3350 • F (508) 226-3317 • sales@barryind.com Barry Industries reserves the right to change part number and/or process without notification. Barry Industries maintains an ISO9001 Certified Quality Management System and is an ITAR Registered company. Parameter: Test Condition: Results: Short Time Overload Apply 1.1x Rated Power for 5 Seconds. ≤ 5.0% Resistance Shift Rated Load Life Apply 1/2 Power Under 40°C ±2°C 90 Minutes on/ 30 Minutes off. Repeat for 100 hours ≤ 5.0% Resistance Shift Moisture Resistance MIL-PRF-55342 para 4.8.9 95% RH, 25°C - 65°C ≤ 5.0% Resistance Shift High Temperature Storage 125°C ±2°C for 500 Hours 1.) ≤ 5.0% Resistance Shift 2.) No Significant Abnormality (Visual) Thermal Shock -65°C to +150°C
30 Minutes Dwell, 5 Cycles
1.) ≤ 5.0% Resistance Shift 2.) No Significant Abnormality (Visual) Ground Plane Board SMD Component 50Ω Microstrip Traces Location of Resistor Element TS0808ZZ-50R0JN-2S Recommended Pad Layout & Mounting Configuration*: TS0808ZZ-50R0JN-2S Reliability Specifications: Gap Under Part Via Via 0.044 1.12 0.008 0.20 0.067 1.69 0.084 2.13 0.020 0.51 0.053 1.35 0.044 1.12 0.017 0.43 0.018 0.44 0.010 0.25 (8X) 0.00 0.01 0.28 0.03 0.78 0.05 1.28 0.07 1.78 0.08 2.03 (2X) DC-44GHz 4W AlN SMT Termination w/ ‘Flip-Chip’ Terminals TS0808ZZ-50R0JN-2S * When mounting onto land pattern, alignment is critical for RF performance. Component must be positioned within ±0.002 [0.051] of nominal center. ORIG. REV. No. PAGE 2 OF 2 JUNE 12