SP3232EBCY-L-TR EXAR | Alldatasheet

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Technical content

True +3.0V to +5.5V RS-232 Transceivers The SP3222EB/SP3232EB series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or laptop computers. The SP3222EB/SP3232EB series has a high-effi ciency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3222EB/SP3232EB series to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222EB/ SP3232EB are 2-driver/2-receiver devices. The ESD tolerance of the SP3222EB/SP3232EB devices is over +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test methods. The SP3222EB device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1µA.

FEATURES

■ Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply ■ 250kbps Transmission Rate Under Load ■ 1µA Low Power Shutdown with Receivers active (SP3222EB) ■ Interoperable with RS-232 down to a +2.7V power source ■ Enhanced ESD Specifi cations: +15kV Human Body Model +15kV IEC61000-4-2 Air Discharge +8kV IEC61000-4-2 Contact Discharge

DESCRIPTION

# of Pins SP3222EB +3.0V to +5.5V 2 2 4 Capacitors Yes Yes 18, 20 SP3232EB +3.0V to +5.5V 2 2 4 Capacitors No No 16 Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000• www.exar.com SP3222EB/SP3232EB_106_022316

NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifi cations below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. V I Input Voltages Output Voltages CC +0.3V) Short-Circuit Duration Unless otherwise noted, the following specifi cations apply for V CC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 - C4 = 0.1µF. Power Dissipation per package

ELECTRICAL CHARACTERISTICS

PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DC CHARACTERISTICS Supply Current 0.3 1.0 mA no load, V CC = 3.3V, TAMB = 25oC, TxIN = GND or VCC Shutdown Supply Current 1.0 10 µA SHDN = GND, VCC = 3.3V, TAMB = 25oC, TxIN = Vcc or GND LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW GND 0.8 V TxIN, EN, SHDN, Note 2 Input Logic Threshold HIGH 2.0 Vcc V Vcc = 3.3V, Note 2 Input Logic Threshold HIGH 2.4 Vcc V Vcc = 5.0V, Note 2 Input Leakage Current +0.01 +1.0 µA TxIN, EN, SHDN, TAMB = +25oC, VIN = 0V to VCC Output Leakage Current +0.05 +10 µA Receivers disabled, V OUT = 0V to VCC Output Voltage LOW 0.4 V I OUT = 1.6mA Output Voltage HIGH V CC -0.6 V CC -0.1 V I OUT = -1.0mA DRIVER OUTPUTS Output Voltage Swing +5.0 +5.4 V All driver outputs loaded with 3kΩ to GND, TAMB = +25oC NOTE 2: Driver Input hysteresis is typically 250mV. ABSOLUTE MAXIMUM RATINGS Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

Unless otherwise noted, the following specifi cations apply for V CC = +3.0V to +5.5V with TAMB = TMIN to TMAX, PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DRIVER OUTPUTS (continued) Output Resistance 300 Ω VCC = V+ = V- = 0V, VOUT=+2V Output Short-Circuit Current +35 +60 mA V OUT = 0V Output Leakage Current +25 µA VCC = 0V or 3.0V to 5.5V, VOUT = +12V, Drivers disabled RECEIVER INPUTS Input Voltage Range -15 15 V Input Threshold LOW 0.6 1.2 V Vcc = 3.3V Input Threshold LOW 0.8 1.5 V Vcc = 5.0V Input Threshold HIGH 1.5 2.4 V Vcc = 3.3V Input Threshold HIGH 1.8 2.4 V Vcc = 5.0V Input Hysteresis 0.3 V Input Resistance 3 5 7 kΩ TIMING CHARACTERISTICS Maximum Data Rate 250 kbps R L = 3kΩ, CL = 1000pF, one driver active Receiver Propagation Delay, tPHL 0.15 µs Receiver input to Receiver output, CL = 150pF Receiver Propagation Delay, tPLH 0.15 µs Receiver input to Receiver output, CL = 150pF Receiver Output Enable Time 200 ns Receiver Output Disable Time 200 ns Driver Skew 100 ns | t PHL - tPLH |, TAMB = 25°C Receiver Skew 50 ns | t PHL - tPLH | Transition-Region Slew Rate 30 V/µs Vcc = 3.3V, R L = 3kΩ, CL = 1000pF, TAMB = 25°C, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000• www.exar.com SP3222EB/SP3232EB_106_022316

Table 1. Device Pin Description EN Receiver Enable. Apply Logic LOW for normal operation.

The SP3222EB/SP3232EB transceivers meet the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be imple- mented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. The SP3222EB/ SP3232EB devices feature Exar's propri- etary on-board charge pump circuitry that generates ±5.5V for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that require true RS-232 perfor- mance. The SP3222EB/SP3232EB devices can operate at a data rate of 250kbps when fully loaded. The SP3222EB and SP3232EB are 2- driver/2- receiver devices ideal for portable or hand-held applications. The SP3222EB features a 1µA shutdown mode that reduces power consumption and extends battery life in portable systems. Its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1µA supply current. THEORY OF OPERATION The SP3222EB/SP3232EB series is made up of three basic circuit blocks: 1. Drivers 2. Receivers 3. The Exar proprietary charge pump Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to +5.0V EIA/TIA-232 levels with an inverted sense relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.4V with no load and +5V minimum fully loaded. The driver outputs are protected against infi nite short-circuits to ground with- out degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of +/-3.7V with supply voltages as low as 2.7V. The drivers can guarantee a data rate of 250kbps fully loaded with 3kΩ in parallel with 1000pF, ensuring compatability with PC-to-PC communication software. The slew rate of the driver is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Para- graph 5). The transition of the loaded output from HIGH to LOW also meet the monotonic- ity requirements of the standard. Figure 10 shows a loopback test circuit used to test the RS-232 Drivers. Figure 11 shows the test results of the loopback circuit with all drivers active at 120kbps with RS-232 loads in parallel with a 1000pF capacitor. Figure 12 shows the test results where one driver was active at 250kbps and all drivers loaded with an RS-232 receiver in parallel with 1000pF capacitors. A solid RS-232 data transmis- sion rate of 250kbps provides compatibility with many designs in personal computer peripherals and LAN applications. The SP3222EB driver's output stages are turned off (tri-state) when the device is in shutdown mode. When the power is off, the SP3222EB device permits the outputs to be driven up to +/-12V. The driver's inputs do not have pull-up resistors. Designers should connect unused inputs to Vcc or GND. In the shutdown mode, the supply current falls to less than 1µA, where SHDN = LOW. When the SP3222EB device is shut down, the device's driver outputs are disabled (tri- stated) and the charge pumps are turned off with V+ pulled down to Vcc and V- pulled to GND. The time required to exit shutdown is typically 100µs. Connect SHDN to Vcc if the shutdown mode is not used. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to fi gures 8 and 9) In applications that are sensitive to power- supply noise, decouple Vcc to ground with a capacitor of the same value as charge-pump capacitor C1. Physically connect bypass capcitors as close to the IC as possible. The charge pump operates in a discontinu- ous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pump is enabled. If the output voltages exceed a magnitude of 5.5V, the charge pump is disabled. This oscillator controls the four phases of the voltage shift- ing. A description of each phase follows. Phase 1 — V SS charge storage — During this phase of the clock cycle, the positive side of capaci- tors C1 and C2 are initially charged to V CC . Cl + is then switched to GND and the charge in C1 – is transferred to C 2 –. Since C 2 + is con- nected to VCC , the voltage potential across capacitor C2 is now 2 times VCC . Phase 2 — V SS transfer — Phase two of the clock connects the negative terminal of C 2 to the V SS storage capacitor and the positive terminal of C2 to GND. This transfers a negative gener- ated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the volt- age to C3, the positive side of capacitor C 1 is switched to VCC and the negative side is connected to GND. Phase 3 — V DD charge storage — The third phase of the clock is identical to the fi rst phase — the charge transferred in C 1 produces –V CC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since + is at V CC , the voltage potential across C 2 is 2 times VCC . Phase 4 — V DD transfer — The fourth phase of the clock connects the negative terminal of C 2 to GND, and transfers this positive generated voltage across C 2 to C 4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the in- ternal oscillator is disabled. Simultaneous with the transfer of the voltage to C 4, the positive side of capacitor C 1 is switched to V CC and the negative side is con- nected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. Since both V+ and V – are separately gener- ated from V CC , in a no–load condition V + and V– will be symmetrical. Older charge pump approaches that generate V – from V+ will show a decrease in the magnitude of V– compared to V + due to the inherent ineffi ciencies in the design. The clock rate for the charge pump typically operates at greater than 250kHz. The exter- nal capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

The SP3222EB/SP3232EB series incor- porates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC61000-4-2 Air-Discharge c) IEC61000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semi-conductors. This method is also specifi ed in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 18. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manu- facturing areas where the ICs tend to be handled frequently. The IEC-61000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human pres- ence. The premise with IEC61000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC61000-4-2 is shown on Figure 19. There are two methods within IEC61000-4-2, the Air Discharge method and the Contact Discharge method. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to fi nd an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situ- ations such as hand held systems, the ESD charge can be directly discharged to the Figure 18. ESD Test Circuit for Human Body Model Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 20 PIN SSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 16 PIN SSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000• www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 16 PIN WSOIC Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 18 PIN WSOIC Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000• www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 16 PIN nSOIC Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 16 PIN TSSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000• www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 20 PIN TSSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

PACKAGE: 16 PIN QFN Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000• www.exar.com SP3222EB/SP3232EB_106_022316

ORDERING INFORMATION

Note: "/TR" is for tape and Reel option. "-L" is for lead free packaging Part Number Temp. Range Package SP3222EBCA-L 0°C to +70°C 20 Pin SSOP SP3222EBCA-L/TR 0°C to +70°C 20 Pin SSOP SP3222EBCT-L 0°C to +70°C 18 Pin WSOIC SP3222EBCT-L/TR 0°C to +70°C 18 Pin WSOIC SP3222EBCY-L 0°C to +70°C 20 Pin TSSOP SP3222EBCY-L/TR 0°C to +70°C 20 Pin TSSOP SP3222EBEA-L -40°C to +85°C 20 Pin SSOP SP3222EBEA-L/TR -40°C to +85°C 20 Pin SSOP SP3222EBET-L -40°C to +85°C 18 Pin WSOIC SP3222EBET-L/TR -40°C to +85°C 18 Pin WSOIC SP3222EBEY-L -40°C to +85°C 20 Pin TSSOP SP3222EBEY-L/TR -40°C to +85°C 20 Pin TSSOP Part Number Temp. Range Package SP3232EBCA-L 0°C to +70°C 16 Pin SSOP SP3232EBCA-L/TR 0°C to +70°C 16 Pin SSOP SP3232EBCN-L 0°C to +70°C 16 Pin NSOIC SP3232EBCN-L/TR 0°C to +70°C 16 Pin NSOIC SP3232EBCT-L 0°C to +70°C 16 Pin WSOIC SP3232EBCT-L/TR 0°C to +70°C 16 Pin WSOIC SP3232EBCY-L 0°C to +70°C 16 Pin TSSOP SP3232EBCY-L/TR 0°C to +70°C 16 Pin TSSOP SP3232EBEA-L -40°C to +85°C 16 Pin SSOP SP3232EBEA-L/TR -40°C to +85°C 16 Pin SSOP SP3232EBEN-L -40°C to +85°C 16 Pin NSOIC SP3232EBEN-L/TR -40°C to +85°C 16 Pin NSOIC SP3232EBET-L -40°C to +85°C 16 Pin WSOIC SP3232EBET-L/TR -40°C to +85°C 16 Pin WSOIC SP3232EBEY-L -40°C to +85°C 16 Pin TSSOP SP3232EBEY-L/TR -40°C to +85°C 16 Pin TSSOP SP3232EBER-L -40°C to +85°C 16 Pin QFN SP3232EBER-L/TR -40°C to +85°C 16 Pin QFN Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000 • www.exar.com SP3222EB/SP3232EB_106_022316

REVISION HISTORY

EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reli- ability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are only for illustration purposes and may vary depending upon a user's specifi c application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to signifi cantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright 2016 EXAR Corporation Datasheet February 2016 Send your serial transceiver technical inquiry with technical details to: serialtechsupport@exar.com Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. DATE REVISION DESCRIPTION 11/02/05 -- Legacy Sipex Datasheet 09/09/09 1.0.0 Convert to Exar Format, Update ordering information and change revision to 1.0.0. 06/07/11 1.0.1 Remove obsolete devices per PDN 110510-01 and change ESD rating to IEC-61000-4-2. 03/14/13 1.0.2 Correct type error to RX input voltage range and TX transi- tion region slew rate condition. 8/14/14 1.0.3 Add Max Junction temperature and package thermal infor- mation. 5/28/15 1.0.4 Update Absolute Max Rating for RxIN input voltage to +/-25V, update logo. 10/27/15 1.0.5 Add SP3232EBER (QFN_16) preliminary package option. 2/23/16 1.0.6 Remove preminary status of QFN_16 package option. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7000• www.exar.com SP3222EB/SP3232EB_106_022316

Click to View Pricing, Inventory, Delivery & Lifecycle Information: Exar: SP3222EBCA-L SP3232EBCN-L SP3232EBCA-L SP3232EBEN-L SP3222EBEY-L SP3232EBCY-L SP3222EBCY-L SP3232EBEA-L SP3232EBEY-L SP3222EBEA-L SP3232EBEY-L/TR SP3232EBCY-L/TR SP3222EBEY-L/TR SP3232EBCT-L SP3222EBET-L/TR SP3222EBET-L SP3232EBET-L SP3222EBCT-L/TR SP3222EBCT-L SP3222EBEA-L/TR SP3232EBET-L/TR SP3232EBEA-L/TR SP3232EBCN-L/TR SP3232EBCA- L/TR SP3222EBCA-L/TR SP3222EBCY-L/TR SP3232EBCT-L/TR SP3232EBEN-L/TR SP3232EBEP-L