TRSF3232ECD

TRSF3232E_V01 TI | Alldatasheet

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FEATURES

D, DB, DW, OR PW PACKAGE (TOP VIEW) C1+ C1− C2+ C2− DOUT2 RIN2 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2

APPLICATIONS

5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 Operates With 3-V to 5.5-V V CC Supply Operates up to Mbit/s Low Supply Current 300 μ A Typ External Capacitors 0.1 μ F Accept 5-V Logic Input With 3.3-V Supply Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection for RS-232 Pins 15-kV Human-Body Model (HBM) 15-kV IEC 61000-4-2 Air-Gap Discharge 8-kV IEC 61000-4-2 Contact Discharge Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment The TRSF3232E consists of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). This device provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232E operates at data signaling rates up to Mbit/s and a driver output slew rate of μ s to 150 μ ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of TRSF3232ECD SOIC D TRSF3232EC Reel of 2500 TRSF3232ECDR Tube of TRSF3232ECDW SOIC DW TRSF3232EC C to C Reel of 2000 TRSF3232ECDWR SSOP DB Reel of 2000 TRSF3232ECDBR RT32EC Tube of TRSF3232ECPW TSSOP PW RT32EC Reel of 2000 TRSF3232ECPWR Tube of TRSF3232EID SOIC D TRSF3232EI SOIC DW TRSF3232EIDR Tube of TRSF3232EIDW SOIC DW TRSF3232EI C to C TSSOP PW TRSF3232EIDWR SSOP DB Reel of 2000 TRSF3232EIDBR RT32EI Tube of TRSF3232EIPW TSSOP PW RT32EI Reel of 2000 TRSF3232EIPWR (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 Table 1-Mbit/s RS-232 Parts SUPPLY TEMPERATURE PART NO. OF NO. OF PIN/ ESD V CC FEATURE RANGE NO. DRIVERS RECEIVERS PACKAGE (V) 15-kV Air-Gap Discharge, 16-pin TRSF3221E 8-kV Contact Discharge, 3.3 or Auto-powerdown SOIC, SSOP, 15-kV HBM TSSOP 15-kV Air-Gap Discharge, 16-pin TRSF3232E 8-kV Contact Discharge, 3.3 or Low pin count SOIC, SSOP, 15-kV HBM TSSOP 8-kV Air-Gap Discharge, Auto-powerdown 16-pin TRS3227 8-kV Contact Discharge, 3.3 or plus, ready signal SSOP 15-kV HBM 16-pin TRSF3221 15-kV HBM 3.3 or Auto-powerdown SOIC, SSOP, TSSOP Enable, 20-pin C to C TRSF3222 15-kV HBM 3.3 or powerdown SOIC, SSOP, signal TSSOP 20-pin Auto-powerdown, TRSF3223 15-kV HBM 3.5 or SOIC, SSOP, enable signal TSSOP 16-pin TRSF3232 15-kV HBM 3.3 or Low pin count SOIC, SSOP, TSSOP 28-pin Auto-powerdown TRSF3238 15-kV HBM 3.3 or SOIC, SSOP, plus TSSOP 28-pin TRSF3243 15-kV HBM 3.3 or Auto-powerdown SOIC, SSOP, TSSOP 15-kV Air-Gap Discharge, 16-pin TRSF3221E 8-kV Contact Discharge, 3.3 or Auto-powerdown SOIC, SSOP, 15-kV HBM TSSOP 15-kV Air-Gap Discharge, 16-pin TRSF3232E 8-kV Contact Discharge, 3.3 or Low pin count SOIC, SSOP, 15-kV HBM TSSOP 8-kV Air-Gap Discharge, Auto-powerdown 16-pin TRS3227 8-kV Contact Discharge, 3.3 or plus, ready signal SSOP 15-kV HBM 16-pin TRSF3221 15-kV HBM 3.3 or Auto-powerdown SOIC, SSOP, TSSOP Enable, 20-pin C to C TRSF3222 15-kV HBM 3.3 or powerdown SOIC, SSOP, signal TSSOP 20-pin Auto-powerdown, TRSF3223 15-kV HBM 3.3 or SOIC, SSOP, enable signal TSSOP 16-pin TRSF3232 15-kV HBM 3.3 or Low pin count SOIC, SSOP, TSSOP 28-pin Auto-powerdown TRSF3238 15-kV HBM 3.3 or SOIC, SSOP, plus TSSOP 28-pin TRSF3243 15-kV HBM 3.3 or Auto-powerdown SOIC, SSOP, TSSOP Submit Documentation Feedback

www.ti.com DIN1 DOUT1 RIN1ROUT1 DIN2 DOUT2 RIN2ROUT2 5 k/C0087 5 k/C0087 TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 FUNCTION TABLES xxx Each Driver (1) INPUT OUTPUT DIN DOUT L H H L (1) H high level, L low level Each Receiver (1) INPUT OUTPUT RIN ROUT L H H L Open H (1) H high level, L low level, Open input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) Submit Documentation Feedback

www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions (1) Electrical Characteristics (1) TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (2) 0.3 V Positive-output supply voltage range (2) 0.3 V V Negative-output supply voltage range (2) 0.3 V V Supply voltage difference (2) V Drivers 0.3 V I Input voltage range V Receivers Drivers 13.2 13.2 V O Output voltage range V Receivers 0.3 V CC 0.3 D package DB package θ JA Package thermal impedance (3) (4) C/W DW package PW package 108 T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. MIN NOM MAX UNIT V CC 3.3 V 3.3 3.6 Supply voltage V V CC V 4.5 5.5 V CC 3.3 V V IH Driver high-level input voltage DIN V V CC V 2.4 V IL Driver low-level input voltage DIN 0.8 V Driver input voltage DIN 5.5 V I V Receiver input voltage TRSF3232EI T A Operating free-air temperature C TRSF3232EC (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 V (see Figure over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT I CC Supply current No load, V CC 3.3 V or V 0.3 mA (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 V (see Figure (2) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback

www.ti.com DRIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) ESD Protection TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage DOUT at R L k Ω to GND, DIN GND 5.5 V V OL Low-level output voltage DOUT at R L k Ω to GND, DIN V CC 5.4 V I IH High-level input current V I V CC 0.01 μ A I IL Low-level input current V I at GND 0.01 μ A V CC 3.6 V O V I OS (3) Short-circuit output current mA V CC 5.5 V O V r o Output resistance V CC V+, and V V O V 300 10M Ω (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 V (see Figure (2) All typical values are at V CC 3.3 V or V CC and T A (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L 250 pF, V CC V to 4.5 V 1000 Maximum data rate R L k Ω kbit/s (see Figure One DOUT switching C L 1000 pF, V CC 3.5 V to 5.5 V 1000 t sk(p) Pulse skew (3) C L 150 pF to 2500 pF, R L k Ω to k Ω See Figure 300 ns Slew rate, SR(tr) transition region R L k Ω to k Ω C L 150 pF to 1000 pF, V CC 3.3 V 150 μ s (see Figure (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 V (see Figure (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. TERMINAL TEST CONDITIONS TYP UNIT NAME NO. HBM DOUT IEC 61000-4-2 Air-Gap Discharge kV IEC 61000-4-2 Contact Discharge Submit Documentation Feedback

www.ti.com RECEIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) ESD Protection TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA V CC 0.6 V CC 0.1 V V OL Low-level output voltage I OL 1.6 mA 0.4 V V CC 3.3 V 1.5 2.4 V IT+ Positive-going input threshold voltage V V CC V 1.8 2.4 V CC 3.3 V 0.6 1.2 V IT Negative-going input threshold voltage V V CC V 0.8 1.5 V hys Input hysteresis IT+ V IT 0.3 V r i Input resistance V I V to V k Ω (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 V (see Figure (2) All typical values are at V CC 3.3 V or V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT t PLH Propagation delay time, low- to high-level output C L 150 pF 300 ns t PHL Propagation delay time, high- to low-level output C L 150 pF 300 ns t sk(p) Pulse skew (3) 300 ns (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 V (see Figure (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. TERMINAL TEST CONDITIONS TYP UNIT NAME NO. HBM RIN IEC 61000-4-2 Air-Gap Discharge kV IEC 61000-4-2 Contact Discharge Submit Documentation Feedback

www.ti.com PARAMETER MEASUREMENT INFORMATION 50 W TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tTLH Generator (see Note B) R L RS-232 Output tTHLC L (see Note A) SR(tr)/C00436 V tTHL or tTLH NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr10 ns, tf ≤ 10 ns. 1.5 V 1.5 V 3 V −3 V 3 V −3 V TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLHtPHL 50% 50% NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. 1.5 V 1.5 V 50 W Generator (see Note B) R L RS-232 Output C L (see Note A) TEST CIRCUIT VOLT AGE W AVEFORMS 50 W 50%50% −3 V 3 V 1.5 V1.5 V Output Input VOL VOH tPHL Generator (see Note B) tPLH Output C L (see Note A) NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 Figure Driver Slew Rate Figure Driver Pulse Skew Figure Receiver Propagation Delay Times Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION ROUT2 DIN2 RIN1 DIN1 −C3 VCC C2+ C1+ GND C1− ROUT1 C2− C BYPASS = 0.1 mF RIN2 C4 + VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 mF 0.047 mF 0.1 mF 0.1 mF 0.33 mF 0.47 mF VCC vs CAPACITOR V ALUES DOUT1 DOUT2 5 kW 5 kW TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS825 AUGUST 2007 can be connected to V CC or GND. Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback

www.ti.com 11-Nov-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TRSF3232ECD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC TRSF3232ECDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC TRSF3232ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC TRSF3232ECDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC TRSF3232ECDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC TRSF3232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC TRSF3232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC TRSF3232EID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 TRSF3232EI TRSF3232EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 RT32EI TRSF3232EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 TRSF3232EI TRSF3232EIDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 TRSF3232EI TRSF3232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 TRSF3232EI TRSF3232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 RT32EI TRSF3232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 RT32EI TRSF3232EIRGTR PREVIEW VQFN RGT 16 3000 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

www.ti.com 11-Nov-2020 Addendum-Page 2 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3232ECDR SOIC D 16 2500 367.0 367.0 38.0 TRSF3232ECDWR SOIC DW 16 2000 350.0 350.0 43.0 TRSF3232ECPWR TSSOP PW 16 2000 367.0 367.0 35.0 TRSF3232EIDR SOIC D 16 2500 367.0 367.0 38.0 TRSF3232EIDWR SOIC DW 16 2000 350.0 350.0 43.0 TRSF3232EIPWR TSSOP PW 16 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 Pack Materials-Page 2

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. SOIC - 2.65 mm max heightDW 16 SMALL OUTLINE INTEGRATED CIRCUIT7.5 x 10.3, 1.27 mm pitch 4224780/A

www.ti.com PACKAGE OUTLINE C TYP10.63 9.97

2.65 MAX

14X 1.27 16X 0.51 0.31 8.89 TYP0.33 0.10 0 - 8 0.3 0.1 (1.4) 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 10.5 10.1 B NOTE 4 7.6 7.4 4220721/A 07/2016 SOIC - 2.65 mm max heightDW0016A SOIC NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MS-013. 1 16

0.25 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.500

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

(9.3) 14X (1.27) R0.05 TYP 16X (2) 16X (0.6) 4220721/A 07/2016 SOIC - 2.65 mm max heightDW0016A SOIC NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS OPENING SOLDER MASK METAL SOLDER MASK DEFINED LAND PATTERN EXAMPLE SCALE:7X SYMM 8 9 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN R0.05 TYP 16X (2) 16X (0.6) 14X (1.27) (9.3) 4220721/A 07/2016 SOIC - 2.65 mm max heightDW0016A SOIC NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:7X SYMM SYMM 8 9

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

www.ti.com PACKAGE OUTLINE C 14X 0.65 4.55 16X 0.30 0.19 TYP6.6 6.2

1.2 MAX

0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 5.1 4.9 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 8 9 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 8 9

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