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D, DB, DW, OR PW PACKAGE (TOP VIEW) NC − No internal connection C1+ C1− C2+ C2− DOUT2 RIN2 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 DESCRIPTION/ORDERING INFORMATION TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER SLLS858 AUGUST 2007 Operates With 3-V to 5.5-V V CC Supply Operates up to Mbit/s Low Supply Current 300 μ A Typ External Capacitors 0.1 μ F Accepts 5-V Logic Input With 3.3-V Supply Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II RS-232 Bus-Pin ESD Protection Exceeds kV Using Human-Body Model (HBM) Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment The TRSF3232 consists of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin-to-pin (serial-port connection pins, including GND). This device provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232 operates at typical data signaling rates up to Mbit/s and a driver output slew rate of μ s to 150 μ ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of TRSF3232CD SOIC D TRSF3232C Reel of 2500 TRSF3232CDR Tube of TRSF3232CDW SOIC DW TRSF3232C Reel of 2000 TRSF3232CDWR C to C Tube of TRSF3232CDB SSOP DB RT22C Reel of 2000 TRSF3232CDBR Tube of TRSF3232CPW TSSOP PW RT22C Reel of 2000 TRSF3232CPWR SOIC D Tube of TRSF3232ID TRSF3232I SOIC DW Reel of 2000 TRSF3232IDR Tube of TRSF3232IDW SOIC DW TRSF3232I Reel of 2000 TRSF3232IDWR C to C Tube of TRSF3232IDB SSOP DB RT22I Reel of 2000 TRSF3232IDBR Tube of TRSF3232IPW TSSOP PW RT22I Reel of 2000 TRSF3232IPWR (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com DIN1 DOUT1 RIN1ROUT1 DIN2 DOUT2 RIN2ROUT2 TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER SLLS858 AUGUST 2007 FUNCTION TABLES XXX Each Driver (1) INPUT OUTPUT DIN DOUT L H H L (1) H high level, L low level Each Receiver (1) INPUT OUTPUT RIN ROUT L H H L Open H (1) H high level, L low level Open input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) Submit Documentation Feedback

www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions (1) Electrical Characteristics (1) TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER SLLS858 AUGUST 2007 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (2) 0.3 V Positive-output supply voltage range (2) 0.3 V V Negative-output supply voltage range (2) 0.3 V V Supply voltage difference (2) V Drivers 0.3 V I Input voltage range V Receivers Drivers 13.2 13.2 V O Output voltage range V Receivers 0.3 V CC 0.3 D package DB package θ JA Package thermal impedance (3) (4) C/W DW package PW package 108 T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. See Figure MIN NOM MAX UNIT V CC 3.3 V 3.3 3.6 Supply voltage V V CC V 4.5 5.5 V CC 3.3 V V IH Driver high-level input voltage DIN V V CC V 2.4 V IL Driver low-level input voltage DIN 0.8 V Driver input voltage DIN 5.5 V I V Receiver input voltage TRSF3232C T A Operating free-air temperature C TRSF3232I (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT I CC Supply current No load, V CC 3.3 V or V 0.3 mA (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback

www.ti.com DRIVER SECTION Switching Characteristics (1) TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER SLLS858 AUGUST 2007 abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage DOUT at R L k Ω to GND, DIN GND 5.4 V V OL Low-level output voltage DOUT at R L k Ω to GND, DIN V CC 5.4 V I IH High-level input current V I V CC 0.01 μ A I IL Low-level input current V I at GND 0.01 μ A V CC 3.6 V I OS Short-circuit output current (3) V O V mA V CC 5.5 V r o Output resistance V CC V+, and V V O V 300 10M Ω (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L 1000 pF 250 Maximum data rate R L k Ω C L 250 pF, V CC V to 4.5 V 1000 kbit/s (see Figure One DOUT switching C L 1000 pF, V CC 4.5 V to 5.5 V 1000 t sk(p) Pulse skew (3) C L 150 pF to 2500 pF, R L k Ω to k Ω See Figure 300 ns Slew rate, SR(tr) transition region R L k Ω to k Ω C L 150 pF to 1000 pF, V CC 3.3 V 150 μ s (see Figure (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback

www.ti.com RECEIVER SECTION Switching Characteristics (1) TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER SLLS858 AUGUST 2007 abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA V CC 0.6 V CC 0.1 V V OL Low-level output voltage I OL 1.6 mA 0.4 V V CC 3.3 V 1.5 2.4 V IT+ Positive-going input threshold voltage V V CC V 1.8 2.4 V CC 3.3 V 0.6 1.2 V IT Negative-going input threshold voltage V V CC V 0.8 1.5 V hys Input hysteresis IT+ V IT 0.3 V r i Input resistance V I V to V k Ω (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS TYP (2) UNIT t PLH Propagation delay time, low- to high-level output C L 150 pF 300 ns t PHL Propagation delay time, high- to low-level output C L 150 pF 300 ns t sk(p) Pulse skew (3) 300 ns (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback

www.ti.com PARAMETER MEASUREMENT INFORMATION 50 Ω TEST CIRCUIT VOLT AGE W AVEFORMS −3 V−3 V

3 V3 V

1.5 V1.5 V Output Input VOL VOH tTLH Generator (see Note B) R L RS-232 Output tTHL C L (see Note A) SR(tr)/C00436 V tTHL or tTLH 50 Ω TEST CIRCUIT VOLT AGE W AVEFORMS −3 V−3 V 1.5 V1.5 V Output Input VOL VOH tTLH Generator (see Note B) R L RS-232 Output tTHL C L (see Note A) SR(tr)/C00436 V tTHL or tTLH TEST CIRCUIT VOLT AGE W AVEFORMS 50 Ω 50%50% −3 V 3 V 1.5 V1.5 V Output Input VOL VOH tPHL Generator (see Note B) tPLH Output C L (see Note A) TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER SLLS858 AUGUST 2007 C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 250 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Slew Rate C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 250 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Pulse Skew C L includes probe and jig capacitance. The pulse generator has the following characteristics: Z O Ω 50% duty cycle, t r ns, t f ns. Figure Receiver Propagation Delay Times Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION ROUT2 DIN2 RIN1 DIN1 −C3 VCC C2+ C1+ GND C1− ROUT1 C2− C BYPASS = 0.1 mF RIN2 C4 + VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 mF 0.047 mF 0.1 mF 0.1 mF 0.33 mF 0.47 mF VCC vs CAPACITOR V ALUES DOUT1 DOUT2 ² C3 can be connected to VCC or GND. 5 kW 5 kW TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER SLLS858 AUGUST 2007 Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback

www.ti.com 28-Aug-2010 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TRSF3232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office TRSF3232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3232IDWR SOIC DW 16 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

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