TRSF3223EIDBG4 | DigiCamel IC Datasheet

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DB, DW, OR PW PACKAGE (TOP VIEW) EN C1+ C1− C2+ C2− DOUT2 RIN2 ROUT2 FORCEOFF VCC GND DOUT1 RIN1 ROUT1 FORCEON DIN1 DIN2 INVALID EN C1+ C1− C1+ C1− C2+ C2− 6 7 8 9 10 DOUT2 RIN2 INVALIDROUT2 DIN2 DOUT1 RIN1 ROUT1 FORCEON DIN1 20 19 18 17 16 V+ ENFORCEOFFGNDV CC RGW PACKAGE (TOP VIEW) TRSF3223E www.ti.com SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 3-VTO5.5-VMULTICHANNELRS-232LINEDRIVER/RECEIVER WITH±15-kVESDPROTECTION Check forSamples: TRSF3223E 1FEATURES

ESD ProtectionforRS-232 Bus Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC 61000-4-2,ContactDischarge – ±15-kV IEC 61000-4-2,Air-GapDischarge
Meets or Exceeds theRequirements of TIA/EIA-232-Fand ITU v.28Standards
Operates With 3-V to5.5-VVCC Supply
Operates up to1000 kbit/s
Two Driversand Two Receivers
Low Standby Current...1 μA Typ
ExternalCapacitors...4 × 0.1μF
Accepts 5-V Logic InputWith 3.3-VSupply

APPLICATIONS

Battery-PoweredSystems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment DESCRIPTION/

ORDERING INFORMATION

The TRSF3223E consistsoftwo linedrivers,two line receivers,and a dualcharge-pumpcircuitwith±15-kV ESD protectionpintopin(serial-portconnectionpins, includingGND). Thisdevicemeets therequirements ofTIA/EIA-232-Fand providestheelectricalinterface between an asynchronouscommunicationcontroller and theserial-portconnector.The chargepump and foursmallexternalcapacitorsallowoperationfrom a single3-V to5.5-Vsupply.The TRSF3223E operates attypicaldatasignalingratesup to1000 kbit/s. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. UNLESS OTHERWISE NOTED this document contains Copyright© 2007–2011,Texas InstrumentsIncorporatedPRODUCTION DATA informationcurrentas of publicationdate. Products conform to specificationsper the terms of Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 www.ti.com Flexiblecontroloptions for power management are availablewhen the serialport is inactive.The auto-powerdown featurefunctionswhen FORCEON is low and FORCEOFF is high.During thismode of operation,ifthedevicedoes notsense a validRS-232 signal,thedriveroutputsare disabled.IfFORCEOFF is setlow and EN ishigh,both driversand receiversare shutoff,and the supplycurrentisreduced to 1 mA. Disconnectingthe serialport or turningoff the peripheraldriverscauses auto-powerdown to occur. Auto-powerdown can be disabledwhen FORCEON and FORCEOFF are high.With auto-powerdownenabled, thedeviceisautomaticallyactivatedwhen a validsignalisappliedtoany receiverinput.The INVALID outputis used tonotifytheuserifan RS-232 signalispresentatany receiverinput.INVALID ishigh(validdata)ifany receiverinputvoltageisgreaterthan2.7V orlessthan–2.7V, orhas been between –0.3V and 0.3V forless than30 μs.INVALID islow (invaliddata)ifthereceiverinputvoltageisbetween –0.3V and 0.3V formore than 30 μs.RefertoFigure4 forreceiverinputlevels. Table1. ORDERING INFORMATION TA PACKAGE (1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of25 TRSF3223ECDW SOIC – DW TRSF3223EC Reelof2000 TRSF3223ECDWR Tube of70 TRSF3223ECDB 0°C to70°C SSOP – DB RT23EC Reelof2000 TRSF3223ECDBR Tube of70 TRSF3223ECPW TSSOP – PW RT23EC Reelof2000 TRSF3223ECPWR Tube of25 TRSF3223EIDW SOIC – DW TRSF3223EI Reelof2000 TRSF3223EIDWR Tube of70 TRSF3223EIDB SSOP – DB RT23EI –40°C to85°C Reelof2000 TRSF3223EIDBR Tube of70 TRSF3223EIPW TSSOP – PW RT23EI Reelof2000 TRSF3223EIPWR QFN – RGW Reelof3000 TRSF3223EIRGWR RT23EI (1) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. (2) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. FUNCTION TABLES ABC Each Driver(1) INPUTS OUTPUT DRIVER STATUSVALID RIN DOUTDIN FORCEON FORCEOFF RS-232 LEVEL X X L X Z Powered off L H H X H Normal operationwith auto-powerdowndisabledH H H X L L L H Yes H Normal operationwith auto-powerdownenabledH L H Yes L L L H No Z Powered offby auto-powerdownfeatureH L H No Z (1) H = highlevel,L = lowlevel,X = irrelevant,Z = highimpedance

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www.ti.com SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 Each Receiver(1) INPUTS OUTPUT VALID RIN ROUTRIN EN RS-232 LEVEL L L X H H L X L X H X Z Open L No H (1) H = highlevel,L = lowlevel,X = irrelevant, Z = highimpedance (off), Open = inputdisconnectedorconnecteddriveroff LOGIC DIAGRAM (POSITIVE LOGIC) Pinnumbers arefortheDB, DW, and PW packages. Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TRSF3223E

SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 www.ti.com AbsoluteMaximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC Supplyvoltagerange –0.3 6 V V+ Positive-outputsupplyvoltagerange(2) –0.3 7 V V– Negative-outputsupplyvoltagerange(2) 0.3 –7 V V+ – V– Supplyvoltagedifference(2) 13 V Driver(FORCEOFF, FORCEON, EN) –0.3 6 VI Inputvoltagerange V Receiver –25 25 Driver –13.2 13.2 VO Outputvoltagerange V Receiver(INVALID) –0.3 VCC + 0.3 DB package 70 θJA Package thermalimpedance(3)(4) DW package 58 °C/W PW package 83 TJ Operatingvirtualjunctiontemperature 150 °C Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings" may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions" isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) AllvoltagesarewithrespecttonetworkGND. (3) Maximum power dissipationisa functionofTJ(max),θJA,and TA.The maximum allowablepower dissipationatany allowableambient temperatureisPD = (TJ(max)– TA)/θJA.Operatingattheabsolutemaximum TJ of150°C can affectreliability. (4) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7. Recommended OperatingConditions(1) See Figure6 MIN NOM MAX UNIT VCC = 3.3V 3 3.3 3.6 Supplyvoltage V VCC = 5 V 4.5 5 5.5 VCC = 3.3V 2Driverand controlVIH DIN,EN, FORCEOFF, FORCEON Vhigh-levelinputvoltage VCC = 5 V 2.4 Driverand controlVIL DIN,EN, FORCEOFF, FORCEON 0.8 Vlow-levelinputvoltage Driverand controlinputvoltage DIN,EN, FORCEOFF, FORCEON 0 5.5 VI V Receiverinputvoltage –25 25 TRSF3223EC 0 70 TA Operatingfree-airtemperature °C TRSF3223EI –40 85 ElectricalCharacteristics(1) overrecommended rangesofsupplyvoltageand operatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT Inputleakage EN, FORCEOFF,II ±0.01 ±1 μAcurrent FORCEON VCC = 3.3V or5 V,TA = 25°C,Auto-powerdowndisabled 0.3 1 mANo load,FORCEOFF and FORCEON atVCC ICC Supplycurrent Powered off No load,FORCEOFF atGND 1 10 μANo load,FORCEOFF atVCC ,FORCEON atGND,Auto-powerdownenabled 1 10AllRIN areopen orgrounded (2) AlltypicalvaluesareatVCC = 3.3V orVCC = 5 V,and TA = 25°C.

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www.ti.com SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 DRIVER SECTION ElectricalCharacteristics(1) overrecommended rangesofsupplyvoltageand operatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT VOH High-leveloutputvoltage DOUT atR L = 3 kΩ toGND 5 5.4 V VOL Low-leveloutputvoltage DOUT atR L = 3 kΩ toGND –5 –5.4 V IIH High-levelinputcurrent VI= VCC ±0.01 ±1 μA IIL Low-levelinputcurrent VIatGND ±0.01 ±1 μA VCC = 3.6V,VO = 0 V IOS Short-circuitoutputcurrent(3) ±35 ±60 mA VCC = 5.5V,VO = 0 V ro Outputresistance VCC ,V+, and V– = 0 V,VO = ±2 V 300 10M Ω FORCEOFF = GND, VCC = 3 V to3.6V,VO = ±12 V ±25 IOZ Outputleakagecurrent μA FORCEOFF = GND, VCC = 4.5V to5.5V,VO = ±12 V ±25 (2) AlltypicalvaluesareatVCC = 3.3V orVCC = 5 V,and TA = 25°C. (3) Short-circuitdurationsshouldbe controlledtopreventexceedingthedeviceabsolutepower dissipationratings,and notmore thanone outputshouldbe shortedata time. SwitchingCharacteristics(1) overrecommended rangesofsupplyvoltageand operatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L = 1000 pF 250Maximum R L = 3 kΩ,datarate C L = 250 pF, VCC = 3 V to4.5V 1000 kbit/sOne DOUT switching(seeFigure1) C L = 1000 pF, VCC = 4.5V to5.5V 1000 tsk(p) Pulseskew (3) C L = 150 pF to2500 pF, R L = 3 kΩ to7 kΩ, See Figure2 300 ns R L = 7 kΩ, C L = 150 pF to1000 pF 8 90Slew rate, SR(tr) transitionregion C L = 1000 pF 12 60 V/μs R L = 3 kΩ(seeFigure1) C L = 150 pF to250 pF 24 150 (2) AlltypicalvaluesareatVCC = 3.3V orVCC = 5 V,and TA = 25°C. (3) Pulseskew isdefinedas |tPLH – tPHL |ofeach channelofthesame device. Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TRSF3223E

SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 www.ti.com RECEIVER SECTION ElectricalCharacteristics(1) overrecommended rangesofsupplyvoltageand operatingfree-airtemperature(unlessotherwisenoted)(seeFigure6) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT VOH High-leveloutputvoltage IOH = –1 mA VCC – 0.6 VCC – 0.1 V VOL Low-leveloutputvoltage IOL = 1.6mA 0.4 V VCC = 3.3V 1.6 2.4 VIT+ Positive-goinginputthresholdvoltage V VCC = 5 V 1.9 2.4 VCC = 3.3V 0.6 1.1 VIT– Negative-goinginputthresholdvoltage V VCC = 5 V 0.6 1.4 Vhys Inputhysteresis(VIT+ – VIT–) 0.5 V IOZ Outputleakagecurrent EN = VCC ±0.05 μA ri Inputresistance VI= ±3 V to±25 V 3 5 kΩ (2) AlltypicalvaluesareatVCC = 3.3V orVCC = 5 V,and TA = 25°C. SwitchingCharacteristics(1) overrecommended rangesofsupplyvoltageand operatingfree-airtemperature(unlessotherwisenoted) PARAMETER TEST CONDITIONS TYP (2) UNIT tPLH Propagationdelaytime,low-tohigh-leveloutput C L = 150 pF,See Figure3 150 ns tPHL Propagationdelaytime,high-tolow-leveloutput C L = 150 pF,See Figure3 150 ns ten Outputenabletime C L = 150 pF,R L = 3 kΩ,See Figure4 200 ns tdis Outputdisabletime C L = 150 pF,R L = 3 kΩ,See Figure4 200 ns tsk(p) Pulseskew (3) See Figure3 50 ns (2) AlltypicalvaluesareatVCC = 3.3V orVCC = 5 V,and TA = 25°C. (3) Pulseskew isdefinedas |tPLH – tPHL |ofeach channelofthesame device.

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www.ti.com SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 AUTO-POWERDOWN SECTION ElectricalCharacteristics overrecommended rangesofsupplyvoltageand operatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TEST CONDITIONS MIN MAX UNIT ReceiverinputthresholdforVT+(valid) FORCEON = GND, FORCEOFF = VCC 2.7 VINVALID high-leveloutputvoltage ReceiverinputthresholdforVT–(valid) FORCEON = GND, FORCEOFF = VCC –2.7 VINVALID high-leveloutputvoltage ReceiverinputthresholdforVT(invalid) FORCEON = GND, FORCEOFF = VCC –0.3 0.3 VINVALID low-leveloutputvoltage IOH = 1 mA, FORCEON = GND,VOH INVALID high-leveloutputvoltage VCC – 0.6 VFORCEOFF = VCC IOL = 1.6mA, FORCEON = GND,VOL INVALID low-leveloutputvoltage 0.4 VFORCEOFF = VCC SwitchingCharacteristics overrecommended rangesofsupplyvoltageand operatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TYP (1) UNIT tvalid Propagationdelaytime,low-tohigh-leveloutput 1 μs tinvalid Propagationdelaytime,high-tolow-leveloutput 30 μs ten Supplyenabletime 100 μs (1) AlltypicalvaluesareatVCC = 3.3V orVCC = 5 V,and TA = 25°C. Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TRSF3223E

50 Ω TEST CIRCUIT VOLT AGE W AVEFORMS −3 V−3 V

3 V3 V

1.5 V1.5 V Output Input VOL VOH tTLH Generator (see Note B) R L RS-232 Output tTHL C L (see Note A) SR(tr)/C00436 V tTHL or tTLH 3 V FORCEOFF 50 Ω TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLH Generator (see Note B) R L 3 V FORCEOFF RS-232 Output tPHLC L (see Note A) 50% 50% 1.5 V 1.5 V TEST CIRCUIT VOLT AGE W AVEFORMS 50 Ω 50%50% −3 V 3 V 1.5 V1.5 V Output Input VOL VOH tPHL Generator (see Note B) tPLH Output EN 0 V C L (see Note A) TRSF3223E SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION A. C L includesprobeand jigcapacitance. B. The pulsegeneratorhas thefollowingcharacteristics:PRR = 250 kbit/s,ZO = 50 Ω,50% dutycycle,tr ≤ 10 ns, tf ≤ 10 ns. Figure1.DriverSlew Rate A. C L includesprobeand jigcapacitance. B. The pulsegeneratorhas thefollowingcharacteristics:PRR = 250 kbit/s,ZO = 50 Ω,50% dutycycle,tr ≤ 10 ns, tf ≤ 10 ns. Figure2.DriverPulse Skew A. C L includesprobeand jigcapacitance. B. The pulsegeneratorhas thefollowingcharacteristics:ZO = 50 Ω,50% dutycycle,tr ≤ 10 ns,tf ≤ 10 ns. Figure3.ReceiverPropagationDelay Times A. C L includesprobeand jigcapacitance. B. The pulsegeneratorhas thefollowingcharacteristics:ZO = 50 Ω,50% dutycycle,tr ≤ 10 ns,tf ≤ 10 ns.

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50 ΩGenerator (see Note B)

3 V or 0 V

(S1 at GND) tPLZ (S1 at VCC ) tPHZ (S1 at GND) tPZL (S1 at VCC ) 1.5 V1.5 V 3 V 0 V 50% 0.3 V Output Input 50% 0.3 V EN R L VCC GND C L (see Note A) Output TRSF3223E www.ti.com SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 PARAMETER MEASUREMENT INFORMATION (continued) Figure4.ReceiverEnable and DisableTimes A. C L includesprobeand jigcapacitance. B. The pulsegeneratorhas thefollowingcharacteristics:PRR = 250 kbit/s,ZO = 50 Ω,50% dutycycle,tr ≤ 10 ns, tf ≤ 10 ns. Copyright© 2007–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TRSF3223E

TEST CIRCUIT VOLTAGE WAVEFORMS 50 W 3 V2.7 V 2.7 V INVALID Output Receiver Input tinvalid Generator (see Note B) FORCEOFF tvalid ROUT FORCEON Auto- Powerdown INVALID DOUT 0 V 0 V −3 V DIN C L = 30 pF (see Note A) VCC 0 V ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ 2.7 V 2.7 V 0.3 V 0.3 V 0 V Indeterminate Indeterminate If Signal Remains Within This Region for More Than 30/C0109s, INVALID Is Low† ≈V+ 0 V ≈V− VCC ten 50% V CC 50% V CC 2.7 V −2.7 V 0.3 V 0.3 V Supply Voltages † Auto-powerdown disables drivers and reduces supply current to 1 mA Valid RS-232 Level, INVALID High Valid RS-232 Level, INVALID High EN TRSF3223E SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure5. INVALID PropagationDelay Times and Supply EnablingTime

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V RIN1 C BYPASS DOUT2 EN C4 + DIN2 INVALID RIN2 ROUT2 = 0.1/C0109F 5 kΩ 5 kΩ VCC C1 C2, C3, and C4 3.3 V /C0034 0.3 V 5 V /C0034 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.47 µF 0.33 µF 0.1 µF VCC vs CAPACITOR V ALUES ² C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Auto- Powerdown TRSF3223E www.ti.com SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011

APPLICATION INFORMATION

SLLS824A –AUGUST 2007–REVISED SEPTEMBER 2011 www.ti.com

REVISION HISTORY

Changes from Original(August 2007)toRevisionA Page

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www.ti.com 1-Oct-2011 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TRSF3223ECDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223ECPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

www.ti.com 1-Oct-2011 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TRSF3223EIDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3223EIRGWR ACTIVE VQFN RGW 20 3000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 1-Oct-2011 Addendum-Page 3 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3223ECDBR SSOP DB 20 2000 367.0 367.0 38.0 TRSF3223ECDWR SOIC DW 20 2000 367.0 367.0 45.0 TRSF3223ECPWR TSSOP PW 20 2000 367.0 367.0 38.0 TRSF3223EIDBR SSOP DB 20 2000 367.0 367.0 38.0 TRSF3223EIDWR SOIC DW 20 2000 367.0 367.0 45.0 TRSF3223EIPWR TSSOP PW 20 2000 367.0 367.0 38.0 TRSF3223EIRGWR VQFN RGW 20 3000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

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Product Information

TRSF3223EIDBG4 specifications and overview.

Summary

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 짹15-kV ESD PROTECTION

Description

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 짹15-kV ESD PROTECTION

Source title TRSF3223EIDBG4 Datasheet(PDF) - Texas Instruments

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