TRSF3222E TI1 | Alldatasheet

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DB, DW , OR PW PACKAGE (TOP VIEW) EN C1+ C1− C2+ C2− DOUT2 RIN2 ROUT2 PWRDOWN VCC GND DOUT1 RIN1 ROUT1 NC DIN1 DIN2 NC NC − No internal connection RHL PACKAGE (TOP VIEW) 1 24 12 13 VCC NC GND DOUT1 RIN1 ROUT1 NC DIN1 NC DIN2 C1+ NC C1– C2+ C2– DOUT2 NC RIN2 NC PWRDOWN ROUT2 EN NC − No internal connection The TRSF3222E can be placed in the power-down mode by setting the power-down PWRDOWN input low, TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 ESD Protection for RS-232 Bus Pins 15-kV Human-Body Model (HBM) 8-kV IEC 61000-4-2, Contact Discharge 15-kV IEC 61000-4-2, Air-Gap Discharge Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V V CC Supply Operates up to 1000 kbit/s Two Drivers and Two Receivers Low Standby Current μ A Typ External Capacitors 0.1 μ F Accepts 5-V Logic Input With 3.3-V Supply Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment ORDERING INFORMATION The TRSF3222E consists of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The TRSF3222E meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3222E operates at typical data signaling rates up to 1000 kbit/s and is an improved drop-in replacement for industry-popular '3222 two-driver, two-receiver functions. which draws only μ A from the power supply. When the device is powered down, the receivers remain active while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is disabled; is lowered to V CC and V is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting enable EN high. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of TRSF3222ECDW SOIC DW TRSF3222EC Reel of 2000 TRSF3222ECDWR Tube of TRSF3222ECDB C to C SSOP DB RT22EC Reel of 2000 TRSF3222ECDBR Tube of TRSF3222ECPW TSSOP PW RT22EC Reel of 2000 TRSF3222ECPWR Tube of TRSF3222EIDW SOIC DW TRSF3222EI Reel of 2000 TRSF3222EIDWR Tube of TRSF3222EIDB C to C SSOP DB RT22EI Reel of 2000 TRSF3222EIDBR Tube of TRSF3222EIPW TSSOP PW RT22EI Reel of 2000 TRSF3222EIPWR (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com FUNCTION TABLES XXX Each Driver (1) INPUTS OUTPUT DOUT DIN PWRDOWN X L Z L H H H H L (1) H high level, L low level, X irrelevant, Z high impedance Each Receiver (1) INPUTS OUTPUT ROUT RIN EN L L H H L L X H Z Open L H (1) H high level, L low level, X irrelevant, Z high impedance (off), Open input disconnected or connected driver off Submit Documentation Feedback

www.ti.com DIN2 DOUT212 8 Powerdown RIN116 PWRDOWN ROUT1 DIN1 DOUT113 17 RIN2910ROUT2 1EN 5 k/C0087 5 k/C0087 Absolute Maximum Ratings (1) TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 LOGIC DIAGRAM (POSITIVE LOGIC) (1) (1) Pin numbers shown are for the DB, DW, and PW packages. over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (2) 0.3 V Positive-output supply voltage range (2) 0.3 V V Negative-output supply voltage range (2) 0.3 V V Supply voltage difference (2) V Driver EN PWRDOWN 0.3 V I Input voltage range V Receiver Driver 13.2 13.2 V O Output voltage range V Receiver 0.3 V CC 0.3 DB package DW package θ JA Package thermal impedance (3) (4) C/W PW package RHL package TBD T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback

www.ti.com Recommended Operating Conditions (1) Electrical Characteristics (1) TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 See Figure MIN NOM MAX UNIT V CC 3.3 V 3.3 3.6 Supply voltage V V CC V 4.5 5.5 V CC 3.3 V V IH Driver and control high-level input voltage DIN, EN PWRDOWN V V CC V 2.4 V IL Driver and control low-level input voltage DIN, EN PWRDOWN 0.8 V V I Driver and control input voltage DIN, EN PWRDOWN 5.5 V V I Receiver input voltage V TRSF3222EC T A Operating free-air temperature C TRSF3222EI (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT I I Input leakage current EN PWRDOWN 0.01 μ A Supply current No load, PWRDOWN at V CC 0.3 mA I CC Supply current (powered off) No load, PWRDOWN at GND μ A (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback

www.ti.com DRIVER SECTION Switching Characteristics (1) TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage DOUT at R L k Ω to GND, DIN GND 5.4 V V OL Low-level output voltage DOUT at R L k Ω to GND, DIN V CC 5.4 V I IH High-level input current V I V CC 0.01 μ A I IL Low-level input current V I at GND 0.01 μ A V CC 3.6 V I OS Short-circuit output current (3) V O V mA V CC 5.5 V r o Output resistance V CC V+, and V V O V 300 10M Ω V CC V to 3.6 V O V I OZ Output leakage current PWRDOWN GND μ A V CC 4.5 V to 5.5 V O V (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L 1000 pF 250 Maximum data rate R L k Ω C L 250 pF, V CC V to 4.5 V 1000 kbit/s (See Figure One DOUT switching C L 1000 pF, V CC 4.5 V to 5.5 V 1000 t sk(p) Pulse skew (3) C L 150 pF to 2500 pF, R L k Ω to k Ω See Figure 300 ns R L k Ω C L 150 pF to 1000 pF Slew rate, SR(tr) transition region C L 1000 pF μ s R L k Ω (see Figure C L 150 pF to 250 pF 150 (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback

www.ti.com RECEIVER SECTION Switching Characteristics (1) TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA V CC 0.6 V CC 0.1 V V OL Low-level output voltage I OL 1.6 mA 0.4 V V CC 3.3 V 1.5 2.4 V IT+ Positive-going input threshold voltage V V CC V 1.8 2.4 V CC 3.3 V 0.6 1.2 V IT Negative-going input threshold voltage V V CC V 0.8 1.5 V hys Input hysteresis IT+ V IT 0.3 V I OZ Output leakage current EN 0.05 μ A r i Input resistance V I V to V k Ω (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT t PLH Propagation delay time, low- to high-level output C L 150 pF, See Figure 300 ns t PHL Propagation delay time, high- to low-level output C L 150 pF, See Figure 300 ns t en Output enable time C L 150 pF, R L k Ω See Figure 200 ns t dis Output disable time C L 150 pF, R L k Ω See Figure 200 ns t sk(p) Pulse skew (3) See Figure 300 ns (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback

www.ti.com PARAMETER MEASUREMENT INFORMATION 50 Ω TEST CIRCUIT VOLT AGE W AVEFORMS −3 V−3 V

3 V3 V

1.5 V1.5 V Output Input VOL VOH tTLH Generator (see Note B) R L RS-232 Output tTHL C L (see Note A) SR(tr)/C00436 V tTHL or tTLH 3 V PWRDOWN 50 Ω TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLH Generator (see Note B) R L 3 V PWRDOWN RS-232 Output tPHLC L (see Note A) 50% 50% 1.5 V 1.5 V TEST CIRCUIT VOLT AGE W AVEFORMS 50 Ω 50%50% −3 V 3 V 1.5 V1.5 V Output Input VOL VOH tPHL Generator (see Note B) tPLH Output EN 0 V C L (see Note A) TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 250 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Slew Rate C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 250 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Pulse Skew C L includes probe and jig capacitance. The pulse generator has the following characteristics: Z O Ω 50% duty cycle, t r ns, t f ns. Figure Receiver Propagation Delay Times Submit Documentation Feedback

www.ti.com TEST CIRCUIT VOLT AGE W AVEFORMS 50 ΩGenerator (see Note B)

3 V or 0 V

(S1 at GND) tPLZ (S1 at VCC ) tPHZ S1 at GND) tPZL (S1 at VCC ) 1.5 V1.5 V 3 V 0 V 50% 0.3 V Output Input 50% 0.3 V EN R L VCC GND C L (see Note A) Output TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 PARAMETER MEASUREMENT INFORMATION (continued) C L includes probe and jig capacitance. The pulse generator has the following characteristics: Z O Ω 50% duty cycle, t r ns, t f ns. Figure Receiver Enable and Disable Times Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION DIN1 PWRDOWN NC DOUT1 ROUT1 −C3 † VCC C2+ C1+ GND C1− RIN1 C2− C BYPASS = 0.1 µF DOUT2 VCC C1 C2, C3, and C4 3.3 V /C0034 0.3 V 5 V /C0034 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.47 µF 0.33 µF 0.1 µF VCC vs CAPACITOR V ALUES EN C4 + Powerdown DIN2 NC RIN2 ROUT2 † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. NC − No internal connection C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. 5 k/C0087 5 k/C0087 TRSF3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS823 JULY 2007 Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TRSF3222ECDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222ECPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3222EIPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 Addendum-Page 1

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3222ECDBR SSOP DB 20 2000 367.0 367.0 38.0 TRSF3222ECDWR SOIC DW 20 2000 367.0 367.0 45.0 TRSF3222ECPWR TSSOP PW 20 2000 367.0 367.0 38.0 TRSF3222EIDBR SSOP DB 20 2000 367.0 367.0 38.0 TRSF3222EIDWR SOIC DW 20 2000 367.0 367.0 45.0 TRSF3222EIPWR TSSOP PW 20 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

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