TRSF3221EIPW

TRSF3221E_V01 TI | Alldatasheet

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FEATURES

(TOP VIEW) EN C1+ C1− C2+ C2− RIN FORCEOFF VCC GND DOUT FORCEON DIN INVALID ROUT

APPLICATIONS

5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 ESD Protection for RS-232 Pins 15-kV Human-Body Model (HBM) 8-kV IEC 61000-4-2 Contact Discharge 15-kV IEC 61000-4-2 Air-Gap Discharge Operates With 3-V to 5.5-V V CC Supply Operates up to Mbit/s Low Standby Current μ A Typ External Capacitors 0.1 μ F Accepts 5-V Logic Input With 3.3-V Supply RS-232 Bus-Pin ESD Protection Exceeds kV Using HBM Auto-Powerdown Feature Automatically Disables Drivers for Power Savings Battery-Powered, Hand-Held, and Portable Equipment PDAs and Palmtop PCs Notebooks, Sub-Notebooks, and Laptops Digital Cameras Mobile Phones and Wireless Devices The TRSF3221E consists of one line driver, one line receiver, and a dual charge-pump circuit with 15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The TRSF3221E provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3221E operates at data signaling rates up to Mbit/s and a driver output slew rate of μ s to 150 μ Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the TRSF3221E does not sense a valid RS-232 signal on the receiver input, the driver output is disabled. If FORCEOFF is set low and the enable EN input is high, both the driver and receiver are shut off, and the supply current is reduced to μ Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high (valid data) if the receiver input voltage is greater than 2.7 V or less than 2.7 or has been between 0.3 V and 0.3 V for less than μ INVALID is low (invalid data) if the receiver input voltage is between 0.3 V and 0.3 V for more than μ See Figure for receiver input levels. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING SSOP DB Reel of 2000 TRSF3221ECDBR RT21EC C to C Tube of TRSF3221ECPW TSSOP PW RT21EC Reel of 2000 TRSF3221ECPWR SSOP DB Reel of 2000 TRSF3221EIDBR RT21EI C to C Tube of TRSF3221EIPW TSSOP PW RT21EI Reel of 2000 TRSF3221EIPWR (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com FUNCTION TABLES abc Each Driver (1) INPUTS OUTPUT DRIVER STATUS VALID RIN DOUT DIN FORCEON FORCEOFF RS-232 LEVEL X X L X Z Powered off L H H X H Normal operation with auto-powerdown disabled H H H X L L L H Yes H Normal operation with auto-powerdown enabled H L H Yes L L L H No Z Powered off by auto-powerdown feature H L H No Z (1) H high level, L low level, X irrelevant, Z high impedance abc Each Receiver (1) INPUTS OUTPUT VALID RIN ROUT RIN EN RS-232 LEVEL L L X H H L X L X H X Z Open L No H (1) H high level, L low level, X irrelevant, Z high impedance (off), Open disconnected input or connected driver off Submit Documentation Feedback

www.ti.com DIN DOUT Auto-powerdown INVALID RIN FORCEOFF FORCEON ROUT EN TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 LOGIC DIAGRAM (POSITIVE LOGIC) Submit Documentation Feedback

www.ti.com TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 Table 1-Mbit/s RS-232 Parts SUPPLY PART TEMPERATURE DRIVER RECEIVER ESD V CC FEATURE PIN/PACKAGE NO. RANGE NO. NO. (V) 15-kV Air-Gap, 16-pin SOIC, TRSF3221E 8-kV Contact, 3.3 or Auto-powerdown SSOP, TSSOP 15-kV HBM 15-kV Air-Gap, 16-pin SOIC, TRSF3232E 8-kV Contact, 3.3 or Low pin count SSOP, TSSOP 15-kV HBM 8-kV Air-Gap, Auto-powerdown plus, TRS3227 8-kV Contact, 3.3 or 16-pin SSOP ready signal 15-kV HBM 16-pin SOIC, TRSF3221 15-kV HBM 3.3 or Auto-powerdown SSOP, TSSOP C to C Auto-powerdown, 20-pin SOIC, TRSF3223 15-kV HBM 3.5 or enable signal SSOP, TSSOP Enable, 20-pin SOIC, TRSF3222 15-kV HBM 3.3 or powerdown signal SSOP, TSSOP 16-pin SOIC, TRSF3232 15-kV HBM 3.3 or Low pin count SSOP, TSSOP 28-pin SOIC, TRSF3238 15-kV HBM 3.3 or Auto-powerdown plus SSOP, TSSOP 28-pin SOIC, TRSF3243 15-kV HBM 3.3 or Auto-powerdown SSOP, TSSOP 15-kV Air-Gap, 16-pin SOIC, TRSF3221E 8-kV Contact, 3.3 or Auto-powerdown SSOP, TSSOP 15-kV HBM 15-kV Air-Gap, 16-pin SOIC, TRSF3232E 8-kV Contact, 3.3 or Low pin count SSOP, TSSOP 15-kV HBM 8-kV Air-Gap, Auto-powerdown plus, TRS3227 8-k V Contact, 3.3 or 16-pin SSOP ready signal 15-kV HBM 16-pin SOIC, TRSF3221 15-kV HBM 3.3 or Auto-powerdown SSOP, TSSOP C to C Auto-powerdown, 20-pin SOIC, TRSF3223 15-kV HBM 3.3 or enable signal SSOP, TSSOP Enable, 20-pin SOIC, TRSF3222 15-kV HBM 3.3 or powerdown signal SSOP, TSSOP 16-pin SOIC, TRSF3232 15-kV HBM 3.3 or Low pin count SSOP, TSSOP 28-pin SOIC, TRSF3238 15-kV HBM 3.3 or Auto-powerdown plus SSOP, TSSOP 28-pin SOIC, TRSF3243 15-kV HBM 3.3 or Auto-powerdown SSOP, TSSOP Submit Documentation Feedback

www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions (1) Electrical Characteristics (1) TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (2) 0.3 V Positive output supply voltage range (2) 0.3 V V Negative output supply voltage range (2) 0.3 V V Supply voltage difference (2) V Driver FORCEOFF FORCEON, EN 0.3 V I Input voltage range V Receiver Driver 13.2 13.2 V O Output voltage range V Receiver INVALID 0.3 V CC 0.3 DB package θ JA Package thermal impedance (3) (4) C/W PW package 108 T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. See Figure MIN NOM MAX UNIT V CC 3.3 V 3.3 3.6 Supply voltage V V CC V 4.5 5.5 V CC 3.3 V Driver and control V IH DIN, FORCEOFF FORCEON, EN V high-level input voltage V CC V 2.4 Driver and control V IL DIN, FORCEOFF FORCEON, EN 0.8 V low-level input voltage V I Driver and control input voltage DIN, FORCEOFF FORCEON 5.5 V V I Receiver input voltage V TRSF3221EI T A Operating free-air temperature C TRSF3221EC (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT I I Input leakage current FORCEOFF FORCEON, EN 0.01 μ A No load, Auto-powerdown disabled 0.3 mA FORCEOFF and FORCEON at V CC Supply current Powered off No load, FORCEOFF at GND I CC A No load, FORCEOFF at V CC μ A Auto-powerdown enabled FORCEON at GND, All RIN are open or grounded (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback

www.ti.com DRIVER SECTION Switching Characteristics (1) ESD Protection TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage DOUT at R L k Ω to GND, DIN GND 5.4 V V OL Low-level output voltage DOUT at R L k Ω to GND, DIN V CC 5.4 V I IH High-level input current V I V CC 0.01 μ A I IL Low-level input current V I at GND 0.01 μ A V CC 3.6 V O V Short-circuit output I OS mA current (3) V CC 5.5 V O V r o Output resistance V CC V+, and V V O V 300 10M Ω V O V CC V to 3.6 V I off Output leakage current FORCEOFF GND μ A V O V CC 4.5 V to 5.5 V (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L 1000 pF 250 Maximum data rate R L k Ω C L 250 pF, V CC V to 4.5 V 1000 kbit/s (see Figure C L 1000 pF, V CC 4.5 V to 5.5 V 1000 t sk(p) Pulse skew (3) C L 150 pF to 2500 pF, R L k Ω to k Ω See Figure 100 ns Slew rate, SR(tr) transition region V CC 3.3 R L k Ω to k Ω C L 150 pF to 1000 pF 150 μ s (see Figure (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. TERMINAL TEST CONDITIONS TYP UNIT NAME NO. HBM DOUT IEC 61000-4-2 Contact Discharge kV IEC 61000-4-2 Air-Gap Discharge Submit Documentation Feedback

www.ti.com RECEIVER SECTION Switching Characteristics (1) ESD Protection TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA V CC 0.6 V V CC 0.1 V V V OL Low-level output voltage I OL 1.6 mA 0.4 V V CC 3.3 V 1.6 2.4 V IT+ Positive-going input threshold voltage V V CC V 1.9 2.4 V CC 3.3 V 0.6 1.1 V IT Negative-going input threshold voltage V V CC V 0.8 1.4 V hys Input hysteresis IT+ V IT 0.5 V I off Output leakage current FORCEOFF V 0.05 μ A r i Input resistance V I V to V k Ω (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS TYP (2) UNIT t PLH Propagation delay time, low- to high-level output C L 150 pF, See Figure 150 ns t PHL Propagation delay time, high- to low-level output C L 150 pF, See Figure 150 ns t en Output enable time C L 150 pF, R L k Ω See Figure 200 ns t dis Output disable time C L 150 pF, R L k Ω See Figure 200 ns t sk(p) Pulse skew (3) See Figure ns (1) Test conditions are 0.1 μ F at V CC 3.3 V 0.3 0.047 μ 0.33 μ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. TERMINAL TEST CONDITIONS TYP UNIT NAME NO. HBM RIN IEC 61000-4-2 Contact Discharge kV IEC 61000-4-2 Air-Gap Discharge Submit Documentation Feedback

www.ti.com AUTO-POWERDOWN SECTION Switching Characteristics TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 abc Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN MAX UNIT Receiver input threshold V T+(valid) FORCEON GND, FORCEOFF V CC 2.7 V for INVALID high-level output voltage Receiver input threshold V T (valid) FORCEON GND, FORCEOFF V CC 2.7 V for INVALID high-level output voltage Receiver input threshold V T(invalid) FORCEON GND, FORCEOFF V CC 0.3 0.3 V for INVALID low-level output voltage I OH mA, FORCEON GND, V OH INVALID high-level output voltage V CC 0.6 V FORCEOFF V CC I OL 1.6 mA, FORCEON GND, V OL INVALID low-level output voltage 0.4 V FORCEOFF V CC over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TYP (1) UNIT t valid Propagation delay time, low- to high-level output μ s t invalid Propagation delay time, high- to low-level output μ s t en Supply enable time 100 μ s (1) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback

www.ti.com PARAMETER MEASUREMENT INFORMATION 50 W TEST CIRCUIT VOLT AGE W AVEFORMS −3 V−3 V

3 V3 V

(see Note B) R L 3 V FORCEOFF RS-232 Output tTHLC L (see Note A) SR(tr)/C00436 V t THL or tTLH NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr10 ns, tf ≤ 10 ns. FORCEON 3 V 50 W TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLH Generator (see Note B) R L 3 V FORCEOFF RS-232 Output tPHLC L (see Note A) NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr10 ns, tf ≤ 10 ns. 50% 50% 1.5 V 1.5 V FORCEON 3 V TEST CIRCUIT VOLT AGE W AVEFORMS 50 W −3 V 3 V Output Input VOL VOH tPHLGenerator (see Note B) tPLH Output C L (see Note A) EN = VCC NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. 1.5 V 1.5 V 50% 50% TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 Figure Driver Slew Rate Figure Driver Pulse Skew Figure Receiver Propagation Delay Times Submit Documentation Feedback

www.ti.com TEST CIRCUIT VOLT AGE W AVEFORMS

50 WGenerator

(see Note B)

3 V or 0 V

(S1 at GND) 3 V 0 V 0.3 V Output Input 0.3 V EN NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. C. tPLZ and tPHZ are the same as tdis. D. tPZL and tPZH are the same as ten. 1.5 V 1.5 V 50% tPHZ (S1 at GND) tPLZ (S1 at VCC ) 50% tPZL (S1 at VCC ) R L VCC GND C L (see Note A) Output TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 PARAMETER MEASUREMENT INFORMATION (continued) Figure Receiver Enable and Disable Times Submit Documentation Feedback

www.ti.com TEST CIRCUIT (see Note B) FORCEOFF ROUT FORCEON Auto- powerdown INVALID DOUTDIN C L = 30 pF (see Note A) ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ 2.7 V −2.7 V 0.3 V −0.3 V 0 V Valid RS-232 Level, INVALID High Indeterminate Indeterminate If Signal Remains Within This Region For More Than 30 ms, INVALID Is Low† Valid RS-232 Level, INVALID High † Auto-powerdown disables drivers and reduces supply current to 1 mA. NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. VOLT AGE W AVEFORMS 3 V2.7 V −2.7 V INVALID Output Receiver Input tvalid 0 V 0 V −3 V VCC 0 V ≈V+ 0 V ≈V− VCC ten 50% VCC 50% VCC 2.7 V −2.7 V 0.3 V 0.3 V tinvalid Supply Voltages EN = GND TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 PARAMETER MEASUREMENT INFORMATION (continued) Figure INVALID Propagation Delay Times and Driver Enabling Time Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION C BYPASS = 0.1 mF Auto- powerdown VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 mF 0.047 mF 0.1 mF 0.1 mF 0.33 mF 0.47 mF VCC vs CAPACITOR V ALUES FORCEOFF VCC GND C1+ C2+ C1− C2− DOUT FORCEON DIN INVALID ROUT EN RIN 5 kW C3 (1) (1) C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. TRSF3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS822 JULY 2007 Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback

www.ti.com 11-Nov-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TRSF3221ECDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT21EC TRSF3221ECDBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT21EC TRSF3221ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT21EC TRSF3221ECDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT21EC TRSF3221ECPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT21EC TRSF3221ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 RT21EC TRSF3221EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 RT21EI TRSF3221EIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 RT21EI TRSF3221EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 RT21EI TRSF3221EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 RT21EI TRSF3221EIRGTR PREVIEW VQFN RGT 16 3000 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.

www.ti.com 11-Nov-2020 Addendum-Page 2 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2018 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3221ECPWR TSSOP PW 16 2000 367.0 367.0 35.0 TRSF3221EIPWR TSSOP PW 16 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2018 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 14X 0.65 4.55 16X 0.30 0.19 TYP6.6 6.2

1.2 MAX

0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 5.1 4.9 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 8 9 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 8 9

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

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