TRS207IDWRG4

TRS207 TI | Alldatasheet

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(TOP VIEW) DOUT3 DOUT1 DOUT2 RIN1 ROUT1 DIN2 DIN1 GND V CC C1+ C1− DOUT4 RIN2 ROUT2 DIN5 DOUT5 DIN4 DIN3 ROUT3 RIN3 C2− C2+ DESCRIPTION/ORDERING INFORMATION TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 ESD Protection for RS-232 Bus Pins 15-kV Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V V CC Supply Operates up to 120 kbit/s External Capacitors 0.1 μ F Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment The TRS207 consists of five line drivers, three line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/ μ s driver output slew rate. ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of TRS207CDW SOIC DW TRS207C C to C Reel of 2000 TRS207CDWR SSOP DB Reel of 2000 TRS207CDBR RU07C Tube of TRS207IDW SOIC DW TRS207I C to C Reel of 2000 TRS207IDWR SSOP DB Reel of 2000 TRS207IDBR RU07I (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com DIN1 DOUT1 RIN2ROUT2 DIN2 DOUT2 RIN3ROUT3 RIN1ROUT1 5 4 DIN3 DOUT3 DIN4 DOUT4 DIN5 DOUT5 21 20 RS-232 Outputs TTL/CMOS Inputs RS-232 Inputs TTL/CMOS Outputs TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 FUNCTION TABLES xxx Each Driver (1) INPUT OUTPUT DIN DOUT L H H L (1) H high level, L low level Each Receiver (1) INPUT OUTPUT RIN ROUT L H H L Open H (1) H high level, L low level, Open input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) Submit Documentation Feedback

www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions (1) Electrical Characteristics (1) TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (2) 0.3 V Positive output supply voltage range (2) V CC 0.3 V V Negative output supply voltage range (2) 0.3 V Drivers 0.3 0.3 V I Input voltage range V Receivers Drivers V 0.3 0.3 V O Output voltage range V Receivers 0.3 V CC 0.3 Short-circuit duration DOUT Continuous DB package θ JA Package thermal impedance (3) (4) C/W DW package T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. See Figure MIN NOM MAX UNIT Supply voltage 4.5 5.5 V V IH Driver high-level input voltage DIN V V IL Driver low-level input voltage DIN 0.8 V Driver input voltage DIN 5.5 V I V Receiver input voltage TRS207C T A Operating free-air temperature C TRS207I (1) Test conditions are 0.1 μ F at V CC V 0.5 over recommended ranges of supply voltage (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP MAX UNIT I CC Supply current No load, V CC T A C mA (1) Test conditions are 0.1 μ F at V CC V 0.5 Submit Documentation Feedback

www.ti.com DRIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) ESD Protection TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage DOUT at R L k Ω to GND, DIN GND V V OL Low-level output voltage DOUT at R L k Ω to GND, DIN V CC V I IH High-level input current V I V CC 200 μ A I IL Low-level input current V I at V 200 μ A I OS (3) Short-circuit output current V CC 5.5 V O V mA r o Output resistance V CC V+, and V V O V 300 Ω (1) Test conditions are 0.1 μ F at V CC V 0.5 (2) All typical values are at V CC and T A (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L pF to 1000 pF, R L k Ω to k Ω Maximum data rate 120 kbit/s One DOUT switching, See Figure Propagation delay time, C L 2500 pF, R L k Ω t PLH(D) μ s low- to high-level output All drivers loaded, See Figure Propagation delay time, C L 2500 pF, R L k Ω t PHL(D) μ s high- to low-level output All drivers loaded, See Figure C L 150 pF to 2500 pF, R L k Ω to k Ω t sk(p) Pulse skew (3) 300 ns See Figure Slew rate, transition region C L pF to 1000 pF, R L k Ω to k Ω SR(tr) μ s (see Figure V CC V (1) Test conditions are 0.1 μ F at V CC V 0.5 (2) All typical values are at V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. PIN TEST CONDITIONS TYP UNIT DOUT, RIN Human-Body Model kV Submit Documentation Feedback

www.ti.com RECEIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA 3.5 V CC 0.4 V V OL Low-level output voltage I OL 1.6 mA 0.4 V V IT+ Positive-going input threshold voltage V CC T A C 1.7 2.4 V V IT Negative-going input threshold voltage V CC T A C 0.8 1.2 V V hys Input hysteresis IT+ V IT 0.2 0.5 V r i Input resistance V I V to V k Ω (1) Test conditions are 0.1 μ F at V CC V 0.5 (2) All typical values are at V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT t PLH Propagation delay time, low- to high-level output 0.5 μ s C L 150 pF t PHL Propagation delay time, high- to low-level output 0.5 μ s t sk(p) Pulse skew (3) 300 ns (1) Test conditions are 0.1 μ F at V CC V 0.5 (2) All typical values are at V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback

www.ti.com PARAMETER MEASUREMENT INFORMATION 50 Ω TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLH (D) Generator (see Note B) R L RS-232 Output tPHL (D)C L (see Note A) SR(tr)/C00436 V tPHL (D)or tPLH (D) 1.5 V 1.5 V 3 V −3 V 3 V −3 V TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLH (D)tPHL (D) 50% 50% 1.5 V 1.5 V 50 Ω Generator (see Note B) R L RS-232 Output C L (see Note A) TEST CIRCUIT VOLT AGE W AVEFORMS 50 Ω 50%50% −3 V 3 V 1.5 V1.5 V Output Input VOL VOH tPHL (R) Generator (see Note B) tPLH (R) Output C L (see Note A) TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 120 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Slew Rate C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 120 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Pulse Skew C L includes probe and jig capacitance. The pulse generator has the following characteristics: Z O Ω 50% duty cycle, t r ns, t f ns. Figure Receiver Propagation Delay Times Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION DOUT3 1 400 kΩ 5 V DIN3 400 kΩ 5 V 400 kΩ 5 V DOUT520 5 kΩ ROUT222 RIN2

24 DOUT4

5 kΩ ROUT317 RIN3 C4 = 0.1 µF 16 V − C2 = 0.1 µF 16 V C2− C2+ DOUT1 2 400 kΩ 5 V DIN1 7 400 kΩ 5 V DIN2 6 DOUT2 3 RIN1 4 5 kΩ ROUT1 5 C1 = 0.1 µF 6.3 V 11 V+ 10+ 0.1 µF 6.3 V

9 VCC

C1− ² C3 can be connected to VCC or GND. C BYPASS = 0.1µF C3 † TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 Resistor values shown are nominal. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback

www.ti.com Capacitor Selection Electrostatic Discharge (ESD) Protection ESD Test Conditions Human-Body Model (HBM) + DUT R D 1.5 kΩ VHBM 100 pFC S TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 APPLICATION INFORMATION (continued) The capacitor type used for is not critical for proper operation. The TRS207 requires 0.1- μ F capacitors, although capacitors up to μ F can be used without harm. Ceramic dielectrics are suggested for the 0.1- μ F capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on and V Use larger capacitors (up to μ to reduce the output impedance at and V Bypass V CC to ground with at least 0.1 μ In pumps, decouple V CC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1 C4). TI TRS207 devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS-232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of 15-kV when powered down. ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliability report that documents test setup, methodology, and results. The HBM of ESD testing is shown in Figure while Figure shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of concern, and subsequently discharged into the DUT through a 1.5-k Ω resistor. Figure HBM ESD Test Circuit Submit Documentation Feedback

www.ti.com 100 150 200500 1.5 1.0 0.5 0.0 DUT = 10-V 1-Ω Zener Diode VHBM = 2 kV Time (ns) IDUT (A) Machine Model (MM) TRS207 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SLLS809 JUNE 2007 APPLICATION INFORMATION (continued) Figure Typical HBM Current Waveform The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins. Submit Documentation Feedback

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TRS207CDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207CDWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRS207IDWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 Addendum-Page 1

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRS207CDBR SSOP DB 24 2000 346.0 346.0 33.0 TRS207CDWR SOIC DW 24 2000 346.0 346.0 41.0 TRS207IDBR SSOP DB 24 2000 346.0 346.0 33.0 TRS207IDWR SOIC DW 24 2000 346.0 346.0 41.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 2

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

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