TRM-900-NT

TRM-868-NT LINX | Alldatasheet

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Warning: Linx radio frequency ("RF") products may be used to control machinery or devices remotely, including machinery or devices that can cause death, bodily injuries, and/or property damage if improperly or inadvertently triggered, particularly in industrial settings or other applications implicating life-safety concerns. No Linx Technologies product is intended for use in any application without redundancies where the safety of life or property is at risk. The customers and users of devices and machinery controlled with RF products must understand and must use all appropriate safety procedures in connection with the devices, including without limitation, using appropriate safety procedures to prevent inadvertent triggering by the user of the device and using appropriate security codes to prevent triggering of the remote controlled machine or device by users of other remote controllers. Do not use this or any Linx product to trigger an action directly from the data line or RSSI lines without a protocol or encoder/ decoder to validate the data. Without validation, any signal from another unrelated transmitter in the environment received by the module could inadvertently trigger the action. This module does not have data validation built in. All RF products are susceptible to RF interference that can prevent communication. RF products without frequency agility or hopping implemented are more subject to interference. This module does not have frequency agility built in, but the developer can implement frequency agility with a microcontroller and the example code in Linx Reference Guide RG-00101. Do not use any Linx product over the limits in this data guide. Excessive voltage or extended operation at the maximum voltage could cause product failure. Exceeding the reflow temperature profile could cause product failure which is not immediately evident. Do not make any physical or electrical modifications to any Linx product. This will void the warranty and regulatory and UL certifications and may cause product failure which is not immediately evident. ! Table Of Contents

1 Description

1 Features

2 Ordering Information

2 Absolute Maximum Ratings

3 Electrical Specifications

6 Typical Performance Graphs

11 Module Description

11 Theory of Operation

12 Pin Assignments

12 Pin Descriptions

14 Sending Data

14 The Data Input

15 The Data Output

15 Using the RSSI Line

16 Using the T/R_SEL Input

16 Using the Low Power Features

17 Using the READY Output

17 Using the LVL_ADJ Line

18 Baud Band Selection

19 Channel Selection

20 European Transmission Rules

23 Typical Applications

24 Power Supply Requirements

24 Antenna Considerations

25 Protocol Guidelines

26 Interference Considerations

27 Pad Layout

27 Board Layout Guidelines

29 Microstrip Details

– –1

Description

The NT Series transceiver module is designed for bi-directional wireless data transfer. The 868MHz version is suitable for European operation and the 900MHz version is suitable for North and South America. The modules have an outstanding range of up to 3,000 feet (914 meters, line of sight). Low power states optimize current consumption for battery-powered devices. The modules have two interfaces for data transfer. The first uses a standard Universal Asynchronous Receiver Transmitter (UART) with a simple built-in protocol that supports data rates of 9.6kbps or 56kbps (see Reference Guide 00102). The other option is a transparent interface that bypasses the protocol engine and directly modulates the RF carrier. This supports data rates of up to 300kbps. The basic configuration settings are done in hardware through the logic state of several pins on the module. Optionally the UART interface can be used for software configuration, also giving access to additional features. The modules are capable of generating +12.5dBm into 50-ohms and have a typical sensitivity of −113dBm. Housed in a compact reflow-compatible SMD package, the transceivers require no external RF components except an antenna, greatly simplifiying integration and lowering assembly costs.

Features

• Long range
• Low cost
• Low power consumption
• No programming required
• 8 parallel selectable channels
• Transparent data transfer
• Data rates up to 300kbps
• RSSI and READY output signals
• Power saving options (POWER_DOWN, STANDBY)
• Adjustable output power level
• No external RF components required
• Wide temperature range
• Compact surface mount package
• No production tuning required NT Series Transceiver Module Data Guide Revised 2/9/2018 0.131" 0.630" 1.150" NT Series Transceiver TRM-900-NT NT Series Transceiver TRM-900-NT Lot FX9nnnLot FX9nnn Figure 1: Package Dimensions

30 Production Guidelines

30 Hand Assembly

30 Automated Assembly

32 General Antenna Rules

34 Common Antenna Styles

36 Regulatory Considerations

38 Achieving a Successful RF Implementation

39 Helpful Application Notes From Linx

– – – –4 5 NT Series Transceiver Specifications Parameter Symbol Min. Typ. Max. Units Notes Logic Low VOL 0.3 0.4 VDC Logic High VOH VCC–0.4 0.5*VCC VDC POWER_DOWN Logic Low VI 0.8 VDC Logic High VIH 2 5.5 VDC Input Logic Low VIL 0.8 VDC Logic High VIH 2 5.5 VDC Output Logic Low VOL 0.6 VDC Logic High VOH VCC–0.7 VCC VDC 1. Measured at 3.3V VCC 2. Measured at 25ºC 3. Guaranteed by design 4. Characterized but not tested 5. At the band’s low data rate; BER=10–3 6. Into a 50-ohm load 7. PO=+12.5dBm (max output power) 8. Module is not busy performing other tasks 9. Time starts when supply voltage reaches VCC minimum 10. 68 / 101 channels through the serial interface 11. Baud Band is a user selected setting that determines filter settings, max data rate, receiver sensitivity and transmitter frequency deviation. See Baud Band Selection for more details. NT Series Transceiver Specifications Parameter Symbol Min. Typ. Max. Units Notes RSSI Dynamic Range 60 dB Transmitter Section Output Power PO −15.5 +12.5 dBm 6 Output Power Control Range 28 dB Harmonic Emissions PH −42 –36 dBc 7 Frequency Deviation Baud Band = 1 ±30 kHz 3,11 Baud Band = 2 ±55 kHz 3,11 Baud Band = 3 ±80 kHz 3,11 Baud Band = 4 ±120 kHz 3,11 Antenna Port RF In/Out Impedance RIN 50 Ω Environmental Operating Temp. Range −40 +85 ºC Storage Temp. Range −55 +125 ºC Timing Receiver Turn-On Time Via VCC 5.0 6 ms 4,9 Via Power Down 5.0 6 ms 4,9 Via Standby 0.6 1 ms 4,8 Transmitter Turn-On Time Via VCC 5.0 6 ms 4,9 Via Power Down 5.0 6 ms 4,9 Via Standby 0.7 1 ms 4,8 TX to RX Switch Time 0.7 1 ms 4,8 RX to TX Switch Time 0.7 1 ms 4,8 Channel Change Time 0.6 1 ms 4,8 Baud Band Change Time 4.0 5 ms 4,8 Interface Section DATA_IN Logic Low VIL 0.3 0.2*VCC VDC Logic High VIH 0.7*VCC 0.5*VCC VDC DATA_OUT Figure 4: Electrical Specifications Warning: This product incorporates numerous static-sensitive components. Always wear an ESD wrist strap and observe proper ESD handling procedures when working with this device. Failure to observe this precaution may result in module damage or failure.

– – – –12 13 GND NC GND GND NC NC GND DATA_IN DATA_OUT NC NC NC GND NC GND ANTENNA 83 7 TRPT/PKT CHN_SEL0 GND GND NC NC CMD_DATA_BAUD CMD_DATA_TYPE CMD_DATA_OUT READY CHN_SEL1 CHN_SEL2 LVL_ADJ NC NC NC 16 29 GND T/R_SEL BAUD0 STANDBY VCC POWER_DOWN GND BAUD1 RSSI GND GND CMD_DATA_IN 22 23 Pin Descriptions Pin Number Name Description 1, 3, 6, 11, 17, 22, 23, 28, 34, 39, 42, 44 GND Ground 2, 4, 5, 7, 8, 16, 32, 33, 35, 36, 40, 41 NC No Connection 9 TRPT / PKT 1,2 Transparent/Packet Data Select. Pull high or float. Pin Assignments Pin Descriptions A low-power onboard communications processor performs the radio control and management functions. An interface processor performs the higher level functions and controls the serial and hardware interfaces. This block also includes voltage translation to allow the internal circuits to operate at a low voltage to conserve power while enabling the interface to operate over the full external voltage. This prevents hardware damage and communication errors due to voltage level differences. While operation is recommended from 3.3V to 5.0V, the transceiver can operate down to 2.5V. Figure 21: NT Series Transceiver Pinout (Top View) Pin Descriptions Pin Number Name Description

10 CHN_SEL0 1 Parallel Channel Select 0

12 CHN_SEL1 1 Parallel Channel Select 1

13 CHN_SEL2 1 Parallel Channel Select 2

14 LVL_ADJ 1

Level Adjust. This line sets the transmitter output power level. Pull high or leave open for the high- est power; connect to GND through a resistor to lower the power.

15 READY

Ready. This line is low when the transceiver is ready to communicate and high when it is busy. This line can be used for hardware handshaking on the command port.

18 T/R_SEL 1

Transmit/Receive Select. Pull this line low to place the transceiver into receive mode. Pull it high to place it into transmit mode. 19 BAUD0 1 Baud Rate Select 0. This line and BAUD1 set the over-the-air data rate and filter bandwidths. 20 BAUD1 1 Baud Rate Select 1. This line and BAUD0 set the over-the-air data rate and filter bandwidths.

21 RSSI

Received Signal Strength Indicator. This line outputs an analog voltage that is proportional to the strength of the received signal. Updated once a second.

24 POWER_DOWN

Power Down. Pulling this line low places the module into a low-power state. The module will not be functional in this state. Pull high for normal operation.

25 VCC Supply Voltage

26 STANDBY 1

Standby. Pull this line high or leave floating to put the module into low-power standby mode. Pull to GND for normal operation. 27 CMD_DATA_IN 2 Command Data In. Pull high for normal operation. 29 CMD_DATA_OUT 2 Command Data Out. Do not connect for normal operation. 30 CMD_DATA_TYPE 2 Command Data Type. Pull low for normal operation. 31 CMD_DATA_BAUD 2 Command Data Baud. Pull low for normal operation. 37 DATA_OUT Received Data Output. This line outputs the demodulated digital data. 38 DATA_IN Transmit Data Input. This line accepts the data to be transmitted.

43 ANTENNA 50-ohm RF Antenna Port

1. These lines have an internal 100kΩ pull-up resistor 2. Contact Linx for more information Figure 22: NT Series Transceiver Pin Descriptions

– – – –14 15 Sending Data The NT Series transceiver module has two interfaces for sending data. One interface uses a UART to pass data in and out of the module. The modules put the data into a packet and take care of the transmission, reception and error check. This is a very low level over-the-air protocol and does not have any networking capabilites built in, but these capabilities can be added in a microcontroller outside the module. This interface and the protocol are detailed in RG-101 (NT Series Command Data Interface Reference Guide) and RG-102 (NT Series Transceiver Wireless UART Reference Guide). This guide details the modules transparent interface. Through this interface the module does not encode or packetize the data in any manner. The data present on the DATA_IN line is used to modulate the transmitter. The received data is output on the DATA_OUT line and the transmit/receive state is controlled with the T/R_SEL line. This transparency gives the designer great freedom in software and protocol development, allowing the creation of unique and proprietary data structures. This mode also allows the use of PWM and non-standard baud rate data. The READY line outputs a logic low when the module is ready for use and logic high when it is busy. It can be used as hardware flow control to send streaming data and ensure that data is not missed. The Data Input Transmit Mode is enabled when the T/R_SEL line is logic high. The data on the DATA_IN line is transmitted over the air. The DATA_IN line may be directly connected to virtually any digital peripheral, including microcon- trollers and encoders. It can be used with any data that transitions from 0V to VCC peak amplitude within the specified data rate range of the selected baud band. While it is possible to send data at higher rates, the internal filters will cause severe roll-off and attenuation. Many RF products require a fixed data rate or place tight constraints on the mark/space ratio of the data being sent. The transceiver architecture eliminates such considerations and allows virtually any signal, including PWM, Manchester, and NRZ data, to be sent at rates from 1kbps to 300kbps. The Data Output Receive Mode is enabled when the T/R_SEL line is logic low. The demodulated data is output on the DATA_OUT line. Like the DATA_IN line, this line may be directly connected to virtually any digital peripheral such as a microcontroller or decoder. It is important to note that the transceiver does not provide squelching of the DATA_OUT line when in receive mode. This means that in the absence of a valid transmission, the DATA_OUT line switches randomly. This noise can be handled in software by implementing a noise tolerant protocol as described in Linx Application Note AN-00160 (Figure 44). Using the RSSI Line The receiver’s Received Signal Strength Indicator (RSSI) line serves a variety of functions. This line has a dynamic range of 64dB and outputs a voltage proportional to the incoming signal strength. The RSSI Voltage vs. Input Power graph in the Typical Performance Graphs section shows the relationship between the RSSI voltage and the incoming signal power. This voltage is updated once a second. This line has a high impedance and an external buffer may be required for some applications. It should be noted that the RSSI levels and dynamic range will vary from part to part. It is also important to remember that RSSI output indicates the strength of any in-band RF energy and not necessarily just that from the intended transmitter; therefore, it should be used only to qualify the presence and level of a signal. Using RSSI to determine distance or data validity is not recommended. The RSSI output can be utilized during testing or even as a product feature to assess interference and channel quality by looking at the RSSI level with all intended transmitters shut off. The RSSI output can also be used in direction-finding applications, although there are many potential perils to consider in such systems. Finally, it can be used to save system power by “waking up” external circuitry when a transmission is received or crosses a certain threshold. The RSSI output feature adds tremendous versatility for the creative designer.

– – – –16 17 Using the T/R_SEL Input The transmit/receive select (T/R_SEL) line is used to switch the transceiver between transmit and receive mode. If it is pulled low, the transceiver exits transmit mode and enters receive mode. Alternatively, if the line is pulled high, the transceiver exits receive mode and enters transmit mode. The READY output switches high during the change and returns low when the module is ready to receive or transmit data. None of the other operating modes are affected by the change. The data rate and channel settings remain as set. Using the Low Power Features The Power Down (POWER_DOWN) line can be used to completely power down the transceiver module without the need for an external switch. This line allows easy control of the transceiver power state from external components, such as a microcontroller. The module is not functional while in power down mode. Similar to the POWER_DOWN line, the Standby (STANDBY) line can be used to put the transceiver into a low-power sleep mode. This line has an internal pull-up, so when it is held high or left floating, the transceiver enters a low power (2.6mA) state. When the STANDBY line is pulled to ground, the module is fully active. During Standby, all operating modes are deactivated. The READY output is high during standby. Standby has a higher current consumption than Power Down but a faster wake-up time. By periodically activating the transceiver, sending data, then powering down or entering standby, the transceiver’s average current consumption can be greatly reduced, saving power in battery-operated applications. Warning: Pulling any of the module inputs high while in Power Down can partially activate the module, increasing current consumption and potentially placing it into an indeterminate state that could lead to unpredictable operation. Pull all inputs low before pulling POWER_DOWN low to prevent this issue. Lines that may be hardwired (for example, the BAUD lines) can be connected to the POWER_DOWN line so that they are lowered when POWER_DOWN is lowered. Using the READY Output The Ready (READY) line can be used to monitor the status of the module. It is logic high while the transceiver is busy and logic low when the transceiver is ready to transmit or receive data. This allows the line to be used as hardware flow control. It is logic high when in Standby, but is logic low in Power Down since the entire module is off. Using the LVL_ADJ Line The Level Adjust (LVL_ADJ) line allows the transceiver’s output power to be easily adjusted for range control, lower power consumption or to meet legal requirements. This is done by placing a resistor to ground on LVL_ADJ to form a voltage divider with an internal 100kΩ resistor. When the transceiver powers up, the voltage on this line is measured and the output power level is set accordingly. When LVL_ADJ is connected to VCC or floating, the output power and current consumption are the highest. When connected to ground, the output power and current are the lowest. The power is digitally controlled in 58 steps providing approximately 0.5dB per step. See the Typical Performance Graphs section (Figures 5–19) for a graph of the output power vs. LVL_ADJ resistance. This line is very useful during regulatory testing to compensate for antenna gain or other product-specific issues that may cause the output power to exceed legal limits. A variable resistor to ground can be temporarily used so that the test lab can precisely adjust the output power to the maximum level allowed by law. The variable resistor’s value can be noted and a fixed resistor substituted for final testing. Even in designs where attenuation is not anticipated, it is a good idea to place resistor pads connected to LVL_ADJ and ground so that it can be used if needed. Figure 23 on the following page shows the 1% tolerance resistor value that is needed to activate each power level. Warning: The LVL_ADJ line uses a resistor divider to create a voltage that determines the output power. Any additional current sourcing or sinking can change this voltage and result in a different power level. The power level should be checked to confirm that it is set as expected.

– – – –26 27 Pad Layout The pad layout diagram in Figure 32 is designed to facilitate both hand and automated assembly. Board Layout Guidelines The module’s design makes integration straightforward; however, it is still critical to exercise care in PCB layout. Failure to observe good layout techniques can result in a significant degradation of the module’s performance. A primary layout goal is to maintain a characteristic 50-ohm impedance throughout the path from the antenna to the module. Grounding, filtering, decoupling, routing and PCB stack-up are also important considerations for any RF design. The following section provides some basic design guidelines which may be helpful. During prototyping, the module should be soldered to a properly laid-out circuit board. The use of prototyping or “perf” boards will result in poor performance and is strongly discouraged. Likewise, the use of sockets can have a negative impact on the performance of the module and are discouraged. The module should, as much as reasonably possible, be isolated from other components on your PCB, especially high-frequency circuitry such as crystal oscillators, switching power supplies, and high-speed bus lines. When possible, separate RF and digital circuits into different PCB regions. Make sure internal wiring is routed away from the module and antenna and is secured to prevent displacement. Figure 32: Recommended PCB Layout Interference Considerations The RF spectrum is crowded and the potential for conflict with other unwanted sources of RF is very real. While all RF products are at risk from interference, its effects can be minimized by better understanding its characteristics. Interference may come from internal or external sources. The first step is to eliminate interference from noise sources on the board. This means paying careful attention to layout, grounding, filtering and bypassing in order to eliminate all radiated and conducted interference paths. For many products, this is straightforward; however, products containing components such as switching power supplies, motors, crystals and other potential sources of noise must be approached with care. Comparing your own design with a Linx evaluation board can help to determine if and at what level design-specific interference is present. External interference can manifest itself in a variety of ways. Low-level interference will produce noise and hashing on the output and reduce the link’s overall range. High-level interference is caused by nearby products sharing the same frequency or from near-band high-power devices. It can even come from your own products if more than one transmitter is active in the same area. It is important to remember that only one transmitter at a time can occupy a frequency, regardless of the coding of the transmitted signal. This type of interference is less common than those mentioned previously, but in severe cases it can prevent all useful function of the affected device. Although technically not interference, multipath is also a factor to be understood. Multipath is a term used to refer to the signal cancellation effects that occur when RF waves arrive at the receiver in different phase relationships. This effect is a particularly significant factor in interior environments where objects provide many different signal reflection paths. Multipath cancellation results in lowered signal levels at the receiver and shorter useful distances for the link.

– – – –30 31 Production Guidelines The module is housed in a hybrid SMD package that supports hand and automated assembly techniques. Since the modules contain discrete components internally, the assembly procedures are critical to ensuring the reliable function of the modules. The following procedures should be reviewed with and practiced by all assembly personnel. Hand Assembly Pads located on the bottom of the module are the primary mounting surface (Figure 35). Since these pads are inaccessible during mounting, castellations that run up the side of the module have been provided to facilitate solder wicking to the module’s underside. This allows for very quick hand soldering for prototyping and small volume production. If the recommended pad guidelines have been followed, the pads will protrude slightly past the edge of the module. Use a fine soldering tip to heat the board pad and the castellation, then introduce solder to the pad at the module’s edge. The solder will wick underneath the module, providing reliable attachment. Tack one module corner first and then work around the device, taking care not to exceed the times in Figure 36. Automated Assembly For high-volume assembly, the modules are generally auto-placed. The modules have been designed to maintain compatibility with reflow processing techniques; however, due to their hybrid nature, certain aspects of the assembly process are far more critical than for other component types. Following are brief discussions of the three primary areas where caution must be observed. CastellationsPCB Pads Soldering Iron Tip Solder Figure 35: Soldering Technique Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow stage. The reflow profile in Figure 37 should not be exceeded because excessive temperatures or transport times during reflow will irreparably damage the modules. Assembly personnel need to pay careful attention to the oven’s profile to ensure that it meets the requirements necessary to successfully reflow all components while still remaining within the limits mandated by the modules. The figure below shows the recommended reflow oven profile for the modules. Shock During Reflow Transport Since some internal module components may reflow along with the components placed on the board being assembled, it is imperative that the modules not be subjected to shock or vibration during the time solder is liquid. Should a shock be applied, some internal components could be lifted from their pads, causing the module to not function properly. Washability The modules are wash-resistant, but are not hermetically sealed. Linx recommends wash-free manufacturing; however, the modules can be subjected to a wash cycle provided that a drying time is allowed prior to applying electrical power to the modules. The drying time should be sufficient to allow any moisture that may have migrated into the module to evaporate, thus eliminating the potential for shorting damage during power-up or testing. If the wash contains contaminants, the performance may be adversely affected, even after drying. 125°C 185°C 217°C 255°C 235°C 60 12030 1501 80 2102 40 2703 00 3303 6009 0 100 150 200 250

300 Recommended RoHS Profile

Recommended Non-RoHS Profile 180°C Temperature (oC) Time (Seconds) Figure 37: Maximum Reflow Temperature Profile Warning: Pay attention to the absolute maximum solder times. Figure 36: Absolute Maximum Solder Times Absolute Maximum Solder Times Hand Solder Temperature: +427ºC for 10 seconds for lead-free alloys Reflow Oven: +255ºC max (see Figure 37)

– – – –36 37 Regulatory Considerations When working with RF, a clear distinction must be made between what is technically possible and what is legally acceptable in the country where operation is intended. Many manufacturers have avoided incorporating RF into their products as a result of uncertainty and even fear of the approval and certification process. Here at Linx, our desire is not only to expedite the design process, but also to assist you in achieving a clear idea of what is involved in obtaining the necessary approvals to legally market a completed product. For information about regulatory approval, read AN-00142 on the Linx website or call Linx. Linx designs products with worldwide regulatory approval in mind. In the United States, the approval process is actually quite straightforward. The regulations governing RF devices and the enforcement of them are the responsibility of the Federal Communications Commission (FCC). The regulations are contained in Title 47 of the United States Code of Federal Regulations (CFR). Title 47 is made up of numerous volumes; however, all regulations applicable to this module are contained in Volume 0-19. It is strongly recommended that a copy be obtained from the FCC’s website, the Government Printing Office in Washington or from your local government bookstore. Excerpts of applicable sections are included with Linx evaluation kits or may be obtained from the Linx Technologies website, www.linxtechnologies.com. In brief, these rules require that any device that intentionally radiates RF energy be approved, that is, tested for compliance and issued a unique identification number. This is a relatively painless process. Final compliance testing is performed by one of the many independent testing laboratories across the country. Many labs can also provide other certifications that the product may require at the same time, such as UL, CLASS A / B, etc. Once the completed product has passed, an ID number is issued that is to be clearly placed on each product manufactured. Questions regarding interpretations of the Part 2 and Part 15 rules or the measurement procedures used to test intentional radiators such as Linx RF modules for compliance with the technical standards of Part 15 should be addressed to: Federal Communications Commission Equipment Authorization Division Customer Service Branch, MS 1300F2

7435 Oakland Mills Road

Columbia, MD, US 21046 Phone: + 1 301 725 585 | Fax: + 1 301 344 2050 Email: labinfo@fcc.gov ETSI Secretaria 650, Route des Lucioles

06921 Sophia-Antipolis Cedex

Phone: +33 (0)4 92 94 42 00 Fax: +33 (0)4 93 65 47 16 International approvals are slightly more complex, although Linx modules are designed to allow all international standards to be met. If the end product is to be exported to other countries, contact Linx to determine the specific suitability of the module to the application. All Linx modules are designed with the approval process in mind and thus much of the frustration that is typically experienced with a discrete design is eliminated. Approval is still dependent on many factors, such as the choice of antennas, correct use of the frequency selected and physical packaging. While some extra cost and design effort are required to address these issues, the additional usefulness and profitability added to a product by RF makes the effort more than worthwhile. Note: Linx RF modules are designed as component devices that require external components to function. The purchaser understands that additional approvals may be required prior to the sale or operation of the device, and agrees to utilize the component in keeping with all laws governing its use in the country of operation.

Linx Technologies is continually striving to improve the quality and function of its products. For this reason, we reserve the right to make changes to our products without notice. The information contained in this Data Guide is believed to be accurate as of the time of publication. Specifications are based on representative lot samples. Values may vary from lot-to-lot and are not guaranteed. “Typical” parameters can and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any product for use in any specific application. It is the customer’s responsibility to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK. Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF CUSTOMER’S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX TECHNOLOGIES. The limitations on Linx Technologies’ liability are applicable to any and all claims or theories of recovery asserted by Customer, including, without limitation, breach of contract, breach of warranty, strict liability, or negligence. Customer assumes all liability (including, without limitation, liability for injury to person or property, economic loss, or business interruption) for all claims, including claims from third parties, arising from the use of the Products. The Customer will indemnify, defend, protect, and hold harmless Linx Technologies and its officers, employees, subsidiaries, affiliates, distributors, and representatives from and against all claims, damages, actions, suits, proceedings, demands, assessments, adjustments, costs, and expenses incurred by Linx Technologies as a result of or arising from any Products sold by Linx Technologies to Customer. Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application, other than the repair, replacement, or refund limited to the original product purchase price. Devices described in this publication may contain proprietary, patented, or copyrighted techniques, components, or materials. Under no circumstances shall any user be conveyed any license or right to the use or ownership of such items. ©2018 Linx Technologies. All rights reserved. The stylized Linx logo, Wireless Made Simple, WiSE, CipherLinx and the stylized CL logo are trademarks of Linx Technologies. Linx Technologies

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