TRM-868-DP1203

TRM-YYY-DP1203 LINX | Alldatasheet

Document overview

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• PDF pages: 15

Technical content

1 Description

1 Features

1 Applications

2 Ordering Information

2 Absolute Maximum Ratings

2 Electrical Specifications

4 Pin Assignments

5 Pin Descriptions

6 Functional Description

6 Operating Modes

7 Serial Control Interface

9 Typical Applications

9 XE1203F Configuration Registers

10 Power Supply Requirements

10 Antenna Considerations

11 Interference Considerations

12 Pad Layout

12 Board Layout Guidelines

14 Microstrip Details

15 Helpful Application Notes from Linx

16 Production Guidelines

16 Hand Assembly

16 Automated Assembly

18 General Antenna Rules

20 Common Antenna Styles

22 Regulatory Considerations

– –1

Description

The TRM-xxx-DP1203 is a complete Radio Transceiver Module operating in the 433, 868 and 915MHz license free ISM (Industrial Scientific and medical) frequency bands. The TRM-xxx-DP1203 offers the unique advantage of high data rate communication up to 152.3kbps. The radio module is suitable for applications seeking to satisfy the European (ETSI EN300-220-1 and EN301 439-3) or the North American (FCC part 15.247 and 15.249) regulatory standards. The TRM-xxx-DP1203 modules can be used in any environment where wireless remote connection is an advantage. They are perfect for complex wireless networks involving high speed data rate applications.

Features

• True UART to antenna solution
• 433/868/925MHz
• No RF knowledge required
• 30.5mm x 18.5mm
• Direct Digital Interface
• Fully assembled and tested
• Surface mount
• Supply voltage 2.4V–3.6V
• Frequency synthesizer step size of 500Hz
• Data rate up to 153.2kbps
• Output power is programmable up to 15dBm
• High Rx 0.1% sensitivity down to –113dBm at 4.8kbps
• Current consumption TX = 62mA at 15dBm, RX = 14mA
• Digital RSSI (Received Signal Strength Indicator)
• Digital FEI (Frequency Error Indicator)

Applications

• Home automation
• Process, access and building controls
• Home appliance interconnections TRM-xxx-DP1203 Data Guide 0.73” (18.50mm) 1.20” (30.50mm) 0.110” (2.80mm) Figure 1: Package Dimensions Revised 3/18/2015 Warning: Linx radio frequency ("RF") products may be used to control machinery or devices remotely, including machinery or devices that can cause death, bodily injuries, and/or property damage if improperly or inadvertently triggered, particularly in industrial settings or other applications implicating life-safety concerns. No Linx Technologies product is intended for use in any application without redundancies where the safety of life or property is at risk. The customers and users of devices and machinery controlled with RF products must understand and must use all appropriate safety procedures in connection with the devices, including without limitation, using appropriate safety procedures to prevent inadvertent triggering by the user of the device and using appropriate security codes to prevent triggering of the remote controlled machine or device by users of other remote controllers. Do not use this or any Linx product to trigger an action directly from the data line or RSSI lines without a protocol or encoder/ decoder to validate the data. Without validation, any signal from another unrelated transmitter in the environment received by the module could inadvertently trigger the action. This module does not have data validation built in. All RF products are susceptible to RF interference that can prevent communication. RF products without frequency agility or hopping implemented are more subject to interference. This module does not have frequency agility built in, but the developer can implement frequency agility with a microcontroller. Do not use any Linx product over the limits in this data guide. Excessive voltage or extended operation at the maximum voltage could cause product failure. Exceeding the reflow temperature profile could cause product failure which is not immediately evident. Do not make any physical or electrical modifications to any Linx product. This will void the warranty and regulatory and UL certifications and may cause product failure which is not immediately evident.

– – – –4 5 Pin Assignments Figure 5: DP1203 Series Transceiver Pin Assignments (Top View) 321 10 11 21TX GND RX PATTERN DATAIN DATA DCLK CLKOUT SCK SI SO GND VCCP VCCA GND VCC EN SWITCH GND ANTENNA GND Pin Descriptions Pin Name I/O Description

1 GND Ground

2 ANTENNA I/O 50-ohm RF Antenna Port

3 GND — Ground

4 VCCP — Supply Voltage / advised NC

5 VCCA — Supply Voltage

6 GND — Ground

7 VCC — Supply Voltage

8 EN I 3-wire Interface Communication Enable

Signal.

9 SWITCH I/O

Selects between two pre-configured states, e.g. transmit and receive. The states are determined by the SWParam register.

10 GND I Ground

11 GND I Ground

12 SO O Data output of the 3-wire interface

13 SI I Data input of the 3-wire interface

14 SCK I Data clock of the 3-wire interface

15 CLKOUT O Programmable Clock Output:

FXTAL divided by 4, 8, 16 or 32

16 DCLK O Receiver Data Clock

17 DATA I/O

Transmitter Data Input and Receiver Data Output. This is a bi-directional line that changes based on the module’s TX/RX state. This line can be set to the receiver data output only by disabling the bidirectional data in the ADParam register.

18 DATAIN I

Transmitter Data Input. This line is the transmitter data input when bidirectional data is disabled using the ADParam register. This line is not used when bidirectional data is enabled.

19 PATTERN O

Output of the Pattern Recognition Block. This line goes high when the module detects a received bit pattern that matches a pattern stored in the Pattern configuration register.

20 RX I

Antenna Switch RX Select. Set high for receive mode; must be set opposite the TX line

21 TX I

Antenna Switch TX Select. Set high for transmit mode; must be set opposite the RX line. Figure 6: DP1203 Series Transceiver Pin Descriptions Pin Descriptions

– – – –12 13 Pad Layout The pad layout diagram in Figure 17 is designed to facilitate both hand and automated assembly. Board Layout Guidelines The module’s design makes integration straightforward; however, it is still critical to exercise care in PCB layout. Failure to observe good layout techniques can result in a significant degradation of the module’s performance. A primary layout goal is to maintain a characteristic 50-ohm impedance throughout the path from the antenna to the module. Grounding, filtering, decoupling, routing and PCB stack-up are also important considerations for any RF design. The following section provides some basic design guidelines. During prototyping, the module should be soldered to a properly laid-out circuit board. The use of prototyping or “perf” boards results in poor performance and is strongly discouraged. Likewise, the use of sockets can have a negative impact on the performance of the module and is discouraged. The module should, as much as reasonably possible, be isolated from other components on your PCB, especially high-frequency circuitry such as crystal oscillators, switching power supplies, and high-speed bus lines. When possible, separate RF and digital circuits into different PCB regions. Make sure internal wiring is routed away from the module and antenna and is secured to prevent displacement. 0.072” (1.83mm) 0.787” (2.00mm) 0.100” (2.54mm) 0.697” (17.70mm) 0.200” (5.08mm) 0.047” (1.20mm) 0.098” (2.50mm) 0.113” (2.87mm) 0.728” (18.50mm) 1.200” (30.50mm) 0.016” (0.40mm) Figure 17: Recommended PCB Layout Do not route PCB traces directly under the module. There should not be any copper or traces under the module on the same layer as the module, just bare PCB. The underside of the module has traces and vias that could short or couple to traces on the product’s circuit board. The Pad Layout section shows a typical PCB footprint for the module. A ground plane (as large and uninterrupted as possible) should be placed on a lower layer of your PC board opposite the module. This plane is essential for creating a low impedance return for ground and consistent stripline performance. Use care in routing the RF trace between the module and the antenna or connector. Keep the trace as short as possible. Do not pass it under the module or any other component. Do not route the antenna trace on multiple PCB layers as vias add inductance. Vias are acceptable for tying together ground layers and component grounds and should be used in multiples. Each of the module’s ground pins should have short traces tying immediately to the ground plane through a via. Bypass caps should be low ESR ceramic types and located directly adjacent to the pin they are serving. A 50-ohm coax should be used for connection to an external antenna. A 50-ohm transmission line, such as a microstrip, stripline or coplanar waveguide should be used for routing RF on the PCB. The Microstrip Details section provides additional information. In some instances, a designer may wish to encapsulate or “pot” the product. There are a wide variety of potting compounds with varying dielectric properties. Since such compounds can considerably impact RF performance and the ability to rework or service the product, it is the responsibility of the designer to evaluate and qualify the impact and suitability of such materials.

– – – –16 17 Production Guidelines The module is housed in a hybrid SMD package that supports hand and automated assembly techniques. Since the modules contain discrete components internally, the assembly procedures are critical to ensuring the reliable function of the modules. The following procedures should be reviewed with and practiced by all assembly personnel. Hand Assembly Pads located on the bottom of the module are the primary mounting surface (Figure 21). Since these pads are inaccessible during mounting, castellations that run up the side of the module have been provided to facilitate solder wicking to the module’s underside. This allows for very quick hand soldering for prototyping and small volume production. If the recommended pad guidelines have been followed, the pads will protrude slightly past the edge of the module. Use a fine soldering tip to heat the board pad and the castellation, then introduce solder to the pad at the module’s edge. The solder will wick underneath the module, providing reliable attachment. Tack one module corner first and then work around the device, taking care not to exceed the times in Figure 22. Automated Assembly For high-volume assembly, the modules are generally auto-placed. The modules have been designed to maintain compatibility with reflow processing techniques; however, due to their hybrid nature, certain aspects of the assembly process are far more critical than for other component types. Following are brief discussions of the three primary areas where caution must be observed. CastellationsPCB Pads Soldering Iron Tip Solder Figure 21: Soldering Technique Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow stage. The reflow profile in Figure 23 should not be exceeded because excessive temperatures or transport times during reflow will irreparably damage the modules. Assembly personnel need to pay careful attention to the oven’s profile to ensure that it meets the requirements necessary to successfully reflow all components while still remaining within the limits mandated by the modules. The figure below shows the recommended reflow oven profile for the modules. Shock During Reflow Transport Since some internal module components may reflow along with the components placed on the board being assembled, it is imperative that the modules not be subjected to shock or vibration during the time solder is liquid. Should a shock be applied, some internal components could be lifted from their pads, causing the module to not function properly. Washability The modules are wash-resistant, but are not hermetically sealed. Linx recommends wash-free manufacturing; however, the modules can be subjected to a wash cycle provided that a drying time is allowed prior to applying electrical power to the modules. The drying time should be sufficient to allow any moisture that may have migrated into the module to evaporate, thus eliminating the potential for shorting damage during power-up or testing. If the wash contains contaminants, the performance may be adversely affected, even after drying. 125°C 185°C 217°C 255°C 235°C 60 12030 1501 80 2102 40 2703 00 3303 6009 0 100 150 200 250

300 Recommended RoHS Profile

Recommended Non-RoHS Profile 180°C Temperature (oC) Time (Seconds) Figure 23: Maximum Reflow Temperature Profile Warning: Pay attention to the absolute maximum solder times. Figure 22: Absolute Maximum Solder Times Absolute Maximum Solder Times Hand Solder Temperature: +225ºC for 10 seconds Reflow Oven: +225ºC max (see Figure 34)

– – – –22 23 Regulatory Considerations When working with RF, a clear distinction must be made between what is technically possible and what is legally acceptable in the country where operation is intended. Many manufacturers have avoided incorporating RF into their products as a result of uncertainty and even fear of the approval and certification process. Here at Linx, our desire is not only to expedite the design process, but also to assist you in achieving a clear idea of what is involved in obtaining the necessary approvals to legally market a completed product. For information about regulatory approval, read AN-00142 on the Linx website or call Linx. Linx designs products with worldwide regulatory approval in mind. In the United States, the approval process is actually quite straightforward. The regulations governing RF devices and the enforcement of them are the responsibility of the Federal Communications Commission (FCC). The regulations are contained in Title 47 of the United States Code of Federal Regulations (CFR). Title 47 is made up of numerous volumes; however, all regulations applicable to this module are contained in Volume 0-19. It is strongly recommended that a copy be obtained from the FCC’s website, the Government Printing Office in Washington or from your local government bookstore. Excerpts of applicable sections are included with Linx evaluation kits or may be obtained from the Linx Technologies website, www.linxtechnologies.com. In brief, these rules require that any device that intentionally radiates RF energy be approved, that is, tested for compliance and issued a unique identification number. This is a relatively painless process. Final compliance testing is performed by one of the many independent testing laboratories across the country. Many labs can also provide other certifications that the product may require at the same time, such as UL, CLASS A / B, etc. Once the completed product has passed, an ID number is issued that is to be clearly placed on each product manufactured. Questions regarding interpretations of the Part 2 and Part 15 rules or the measurement procedures used to test intentional radiators such as Linx RF modules for compliance with the technical standards of Part 15 should be addressed to: Federal Communications Commission Equipment Authorization Division Customer Service Branch, MS 1300F2

7435 Oakland Mills Road

Columbia, MD, US 21046 Phone: + 1 301 725 585 | Fax: + 1 301 344 2050 Email: labinfo@fcc.gov ETSI Secretaria 650, Route des Lucioles

06921 Sophia-Antipolis Cedex

Phone: +33 (0)4 92 94 42 00 Fax: +33 (0)4 93 65 47 16 International approvals are slightly more complex, although Linx modules are designed to allow all international standards to be met. If the end product is to be exported to other countries, contact Linx to determine the specific suitability of the module to the application. All Linx modules are designed with the approval process in mind and thus much of the frustration that is typically experienced with a discrete design is eliminated. Approval is still dependent on many factors, such as the choice of antennas, correct use of the frequency selected and physical packaging. While some extra cost and design effort are required to address these issues, the additional usefulness and profitability added to a product by RF makes the effort more than worthwhile. Note: Linx RF modules are designed as component devices that require external components to function. The purchaser understands that additional approvals may be required prior to the sale or operation of the device, and agrees to utilize the component in keeping with all laws governing its use in the country of operation.

Linx Technologies is continually striving to improve the quality and function of its products. For this reason, we reserve the right to make changes to our products without notice. The information contained in this Data Guide is believed to be accurate as of the time of publication. Specifications are based on representative lot samples. Values may vary from lot-to-lot and are not guaranteed. “Typical” parameters can and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any product for use in any specific application. It is the customer’s responsibility to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK. Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF CUSTOMER’S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX TECHNOLOGIES. The limitations on Linx Technologies’ liability are applicable to any and all claims or theories of recovery asserted by Customer, including, without limitation, breach of contract, breach of warranty, strict liability, or negligence. Customer assumes all liability (including, without limitation, liability for injury to person or property, economic loss, or business interruption) for all claims, including claims from third parties, arising from the use of the Products. The Customer will indemnify, defend, protect, and hold harmless Linx Technologies and its officers, employees, subsidiaries, affiliates, distributors, and representatives from and against all claims, damages, actions, suits, proceedings, demands, assessments, adjustments, costs, and expenses incurred by Linx Technologies as a result of or arising from any Products sold by Linx Technologies to Customer. Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application, other than the repair, replacement, or refund limited to the original product purchase price. Devices described in this publication may contain proprietary, patented, or copyrighted techniques, components, or materials. Under no circumstances shall any user be conveyed any license or right to the use or ownership of such items. ©2015 Linx Technologies. All rights reserved. The stylized Linx logo, Wireless Made Simple, WiSE, CipherLinx and the stylized CL logo are trademarks of Linx Technologies. Linx Technologies

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