TRF4000 TI | Alldatasheet

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Technical content

SLWS050 – MAY 1999 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Downconverter for 1.9-GHz CDMA

Applications

/C00680.5-Micron GaAs MESFET Technology /C0068Operates from 2.7-V to 3.3-V Supply /C0068High Third-Order Intercept Point Mixer /C0068On-Chip Buffer Amplifier to Minimize Mixer Drive Requirements /C006814-Pin Plastic Surface-Mount TSSOP PowerPAD  (PWP)

description

The TRF4000 personal communications system (PCS) RF downconverter is a gallium arsenide (GaAs) integrated circuit housed in a 14-pin plastic surface-mount, thin-shrink small outline package (TSSOP). It is suitable for 1.9-GHz code-division multiple-access (CDMA) applications and is composed of a local oscillator (LO) buffer amplifier, an RF preamplifier, a mixer, and a differential IF amplifier. These devices have no built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the gates. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated. NC NC MIXERIN VDD LO_IN NC NC NC NC IFOUT/V DD NC IFXOUT/V DD VDD NC PWP PACKAGE (TOP VIEW) NC – No internal connection PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  1999, Texas Instruments Incorporated

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5LO_IN MIXERIN 3 Mixer IF Amplifier RF Preamplifier VDD application circuit L1L2 L3C1 MIXERIN VDD LO_IN L5 C4 VDD VDD IFOUT/VDD IFXOUT/V DD L1 = 10 nH L2 = 8.2 nH L3 = 6.8 nH L4 = 6.8 nH L5 = 150 nH L6 = 150 nH L7 = 150 nH L8 = 150 nH C1 = .01 µF C2 = .01 µF C3 = .01 µF C4 = 5 pF C5 = 5 pF C6 = 100 pF C7 = 100 pF C8 = 1.5 pF C9 = 1.5 pF TRF4000 NOTES: A. All ports matched to 50 Ω B. Backside must be connected to ground.

SLWS050 – MAY 1999 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. I/O DESCRIPTION MIXERIN 3 I Mixer input LO_IN 5 I Local oscillator input IFOUT/VDD 12 I/O Intermediate frequency in-phase output (+) and connection to VDD IFXOUT/V DD 10 I/O Intermediate frequency quadrature output (–) and connection to VDD NC 1, 2, 6, 7, 8, 11, 13, No internal connection VDD 4, 9 I Supply Voltage absolute maximum ratings over operating free-air temperature range (unless otherwise noted) † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions MIN MAX UNIT Supply voltage, VDD 2.7 3.3 V Operating free-air temperature, TA –30 80 °C

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electrical characteristics over recommended operating free-air temperature range, VDD = 2.7 V, fIF = 185 MHz mixer PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT Input frequency range (MIXERIN) 1930 1990 MHz Local oscillator frequency range (LO_IN) 2115 2175 MHz Intermediate frequency (IFOUT, IFXOUT) 185 MHz Gain 10.5 12 13.5 dB Noise figure 9.7 10.7 dB Input VSWR (MIXERIN) (see Note 1) 50 Ω 1.5:1 Differential output impedance (IFOUT, IFXOUT) 20 mA required to achieve mixer current 330 Ω Input 1-dB gain compression point (MIXERIN) –11 dBm Input third-order intercept point (MIXERIN) fLO = 2145 MHz, fRF = 1960 MHz –2.1 0.5 dBm Input power (LO_IN) –12.5 –10.5 –8.5 dBm Input VSWR (LO_IN) (see Note 1) 1.7:1 † Typical values are at TA = 25°C. NOTE 1: VSWR = Voltage standing wave ratio current consumption over recommended operating free-air temperature range and VDD = 2.7 V MIN TYP † MAX UNIT Total current consumption 30 35 mA † Typical values are at TA = 25°C.

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APPLICATION INFORMATION

VDD – Supply Voltage – V 9.5 7.5 8.5 2.7 3.0 3.3 NF – Noise Figure – dB 10.5 NOISE FIGURE vs SUPPLY VOLTAGE –30°C 25°C 80°C

2145 MHz LO Frequency

–10.5 dBm LO Drive Figure 2 fLO – LO Frequency – MHz 9.5 8.5 7.5 2115 2145 2175 NF – Noise Figure – dB 10.5 11.5 NOISE FIGURE vs LO FREQUENCY –30°C 25°C 80°C 2.7V VDD –10.5 dBm LO Drive Figure 3 PLO – LO Drive Level – dBm –12.5 –10.5 –8.5 NF – Noise Figure – dB NOISE FIGURE vs LO DRIVE LEVEL –30°C 25°C 80°C 2.7V VDD Figure 4 VDD – Supply Voltage – V 12.5 10.5 11.5 2.7 3.0 3.3 G – Gain – dB 13.5 GAIN vs SUPPLY VOLTAGE –30°C 14.5 –10.5 dBm LO Drive 80°C 25°C

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fLO – LO Frequency – MHz 12.5 10.5 11.5 2115 2145 2175 G – Gain – dB 13.5 GAIN vs LO FREQUENCY –30°C 25°C 80°C 2.7V VDD –10.5dBm LO Drive Figure 6 PLO – LO Drive Level – dBm –12.5 –10.5 –8.5 G – Gain – dB GAIN vs LO DRIVE LEVEL –30°C 25°C 80°C 2.7V VDD

SLWS050 – MAY 1999 7POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA PWP (R-PDSO-G) PowerPAD  PLASTIC SMALL-OUTLINE PACKAGE 4073225/E 03/97 0,50 0,75 0,25 0,15 NOM Thermal Pad (See Note C) Gage Plane 2824 7,70 7,90 6,40 6,60 9,60 9,80 6,60 6,20 0,19 4,50 4,30 0,15 A 0,30 1,20 MAX 1614 5,10 4,90 PINS 4,90 5,10 DIM A MIN A MAX 0,05 Seating Plane 0,65 0,10 M0,10 0°–8° 20-PIN SHOWN NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This solderable pad is electrically and thermally connected to the backside of the die and possibly selected leads. The maximum pad size on the printed circult board should be equal to the package body size – 2,0mm. PowerPAD is a trademark of Texas Instruments Incorporated.

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright  1999, Texas Instruments Incorporated