TRA2525

MR3025 ONSEMI | Alldatasheet

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Technical content

 Semiconductor Components Industries, LLC, 2000 October, 2000 – Rev. 1

1 Publication Order Number:

250 Volts, 25 Amperes

Compact, highly efficient silicon rectifiers for medium–current applications requiring:

• High Current Surge — 400 Amperes @ TJ = 175°C
• Peak Performance @ Elevated Temperature — 25 Amperes
• Low Cost
• Compact, Molded Package for Optimum Efficiency in a Small Case Configuration Mechanical Characteristics
• Finish: All External Surfaces are Corrosion Resistant, and Contact Areas are Readily Solderable
• Polarity: Indicated by Cathode Band
• Weight: 1.8 Grams (Approximately)
• Maximum Temperature for Soldering Purposes: 260°C
• Marking: 2525 or MR3025 MAXIMUM RATINGS Rating Symbol Value Unit DC Blocking Voltage VR 250 Volts Non–Repetitive Peak Reverse Voltage (Halfwave, Single Phase, 60 Hz) VRSM 310 Volts Average Forward Current (Single Phase, Resistive Load, TC = 150°C) IO 25 Amps Non–Repetitive Peak Surge Current (Halfwave, Single Phase, 60 Hz) IFSM 400 Amps Operating Junction Temperature Range TJ –65 to +175 Storage Temperature Range Tstg –65 to +175 Device Package Shipping

ORDERING INFORMATION

http://onsemi.com MR3025 Microde Button 5000 Units/Box Microde Button 5000 Units/Box MICRODE BUTTON CASE 193 MARKING DIAGRAM 2525 = Device Code L = Location Code YY = Year WW = Work Week

2525 LYYWW

MR3025= Device Code L = Location Code YY = Year WW = Work Week MR3025 YYWWL

http://onsemi.com THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance, Junction to Case R θJC 1.0 °C/W

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Min Max Unit Instantaneous Forward Voltage (Note 1.) (IF = 100 Amps, TC = 25°C) VF — 1.18 Volts Reverse Current(1) (VR = 250 V, TC = 25°C) (VR = 250 V, TC = 100°C) IR 250 µA Forward Voltage Temperature Coefficient @ IF = 10 mA VFTC 2* 2* mV/°C 1. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2%. *Typical

Figure 1. Forward Voltage Figure 2. Non–Repetitive Surge Current Figure 3. VF Temperature Coefficient Figure 4. Current Derating Figure 5. Forward Power Dissipation

1 Cycle

Figure 6. Thermal Response Figure 7. Typical Capacitance Figure 8. Forward Recovery Time Figure 9. Reverse Recovery Time

100 C, CAPACITANCE (pF)

situation, the following procedure is recommended. steady state conditions are achieved.

http://onsemi.com Assembly and Soldering Information There are two basic areas of consideration for successful implementation of button rectifiers: 1. Mounting and Handling 2. Soldering Each should be carefully examined before attempting a finished assembly or mounting operation. Mounting and Handling The button rectifier lends itself to a multitude of assembly arrangements, but one key consideration must always be included: One Side of the Connections to the Button Must be Flexible! This stress relief to the button should also be chosen for maximum contact area to afford the best heat transfer — but not at the expense of flexibility. For an annealed copper terminal a thickness of 0.015″ is suggested. Strain Relief Terminal for Button Rectifier Copper Terminal Button Base (Heat Sink Material) The base heat sink may be of various materials whose shape and size are a function of the individual application and the heat transfer requirements. Common Materials Advantages and Disadvantages Steel Copper Aluminum Low Cost: relatively low heat conductivity High Cost: high heat conductivity Medium Cost: medium heat conductivity. Relatively expensive to plate and not all platers can process aluminum. Handling of the button during assembly must be relatively gentle to minimize sharp impact shocks and avoid nicking of the plastic. Improperly designed automatic handling equipment is the worst source of unnecessary shocks. Techniques for vacuum handling and spring loading should be investigated. The mechanical stress limits for the button diode are as follows: Compression Tension Torsion Shear 32 lbs. 32 lbs. 6–inch lbs. 55 lbs.

142.3 Newton

0.68 Newtons–meters

244.7 Newton

Exceeding these recommended maximums can result in electrical degradation of the device. Soldering The button rectifier is basically a semiconductor chip bonded between two nickel–plated copper heat sinks with an encapsulating material of epoxy compound. The exposed metal areas are also tin plated to enhance solderability. In the soldering process it is important that the temperature not exceed 260°C if device damage is to be avoided. Various solder alloys can be used for this operation but two types are recommended for best results: 1. 95% Sn, 5% Sb; melting point 237°C 2. 96.5% tin, 3.5% silver; melting point 221°C 3. 63% tin, 37% lead; melting point 183°C Solder is available as preforms or paste. The paste contains both the metal and flux and can be dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used depends upon the degree of cleaning to be accomplished and is a function of the metal involved. These fluxes range from a mild rosin to a strong acid; e.g., Nickel plating oxides are best removed by an acid base flux while an activated rosin flux may be sufficient for tin plated parts. Since the button is relatively lightweight, there is a tendency for it to float when the solder becomes liquid. To prevent bad joints and misalignment, it is suggested that a weighting or spring loaded fixture be employed. It is also important that severe thermal shock (either heating or cooling) be avoided as it may lead to damage of the die or encapsulant of the part.

http://onsemi.com Button holding fixtures for use during soldering may be of various materials. Stainless steel has a longer use life while black anodized aluminum is less expensive and will limit heat reflection and enhance absorption. The assembly volume will influence the choice of materials. Fixture dimension tolerances for locating the button must allow for expansion during soldering as well as allowing for button clearance. Heating Techniques The following four heating methods have their advantages and disadvantages depending on volume of buttons to be soldered. 1. Belt furnaces readily handle large or small volumes and are adaptable to establishment of “on–line’’ assembly since a variable belt speed sets the run rate. Individual furnace zone controls make excellent temperature control possible. 2. Flame Soldering involves the directing of natural gas flame jets at the base of a heatsink as the heatsink is indexed to various loading–heating– cooling–unloading positions. This is the most economical labor method of soldering large volumes. Flame soldering offers good temperature control but requires sophisticated temperature monitoring systems such as infrared. 3. Ovens are good for batch soldering and are production limited. There are handling problems because of slow cooling. Response time is load dependent, being a function of the watt rating of the oven and the mass of parts. Large ovens may not give an acceptable temperature gradient. Capital cost is low compared to belt furnaces and flame soldering. 4. Hot Plates are good for soldering small quantities of prototype devices. Temperature control is fair with overshoot common because of the exposed heating surface. Solder flow and positioning can be corrected during soldering since the assembly is exposed. Investment cost is very low. Regardless of the heating method used, a soldering profile giving the time–temperature relationship of the particular method must be determined to assure proper soldering. Profiling must be performed on a scheduled basis to minimize poor soldering. The time–temperature relationship will change depending on the heating method used.

http://onsemi.com PACKAGE DIMENSIONS CASE 193–04 ISSUE J A D B F M DIM MIN MAX MIN MAX INCHESMILLIMETERS A 8.43 8.69 0.332 0.342 B 4.19 4.45 0.165 0.175 D 5.54 5.64 0.218 0.222 F 5.94 6.25 0.234 0.246 M 5 NOM 5 NOM ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION CENTRAL/SOUTH AMERICA: Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST) Email: ONlit–spanish@hibbertco.com Toll–Free from Mexico: Dial 01–800–288–2872 for Access – then Dial 866–297–9322 ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support Phone : 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: 001–800–4422–3781 Email: ONlit–asia@hibbertco.com JAPAN : ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone : 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. TRA2525/D NORTH AMERICA Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone : 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com Fax Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada N. American Technical Support: 800–282–9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor – European Support German Phone : (+1) 303–308–7140 (Mon–Fri 2:30pm to 7:00pm CET) Email: ONlit–german@hibbertco.com French Phone : (+1) 303–308–7141 (Mon–Fri 2:00pm to 7:00pm CET) Email: ONlit–french@hibbertco.com English Phone: (+1) 303–308–7142 (Mon–Fri 12:00pm to 5:00pm GMT) Email: ONlit@hibbertco.com EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781 *Available from Germany, France, Italy, UK, Ireland