2410TD EATON | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

High current time-delay SMT Brick fuse Product features

  • 2410 (6125 metric) surface mount package
  • Time-delay
  • Designed to UL248
  • Overcurrent protection of systems up to

250 Vac/60 Vdc

  • Current rating: 500 mA to 7 .0 A
  • High inrush withstand capability
  • Moisture sensitivity level: (MSL): 1

Applications

  • Power supplies
  • Servers
  • LED lighting drivers
  • Appliances and white goods
  • LCD monitor/backlight inverters
  • Vac chip-on-board (COB) lighting
  • Industrial electronics and computing Agency information cURus Recognition file number: E19180 Environmental compliance HALOGEN HFFREE TR1- 2410TD 7 -R Packaging code Family code Ampere rating RoHS compliant Ordering part number Packaging prefix TR1-(1000 parts on a 8.66” diameter tape and reel, 1 reel per box) PK-(1000 parts on a 8.66” diameter tape and reel, 10 reels per carton)

High current time-delay SMT Brick fuse www.eaton.com/electronicsElectrical characteristics Amp Rating % of Amp rating Opening time 500 mA to 7 A 100 4 hours mimimum 500 mA to 7 A 200 1 to 60 seconds Product specifications Current rating Voltage rating Voltage rating Interrupting rating1 at rated voltage (A) Interrupting rating1 at rated voltage (A) Typical DC cold resistance2 Typical voltage drop Part number (A) (Vac) (Vdc) (Vac) (Vdc) (ohm) (mV) Part marking 2410TD500-R 0.5 250 60 50 50 0.4025 245 T0.5 2410TD750-R 0.75 250 60 50 50 0.235 250 T0.75 2410TD1-R 1 250 60 50 50 0.168 256 T1 2410TD1-5-R 1.5 250 60 50 50 0.063 125 T1.5 2410TD2-R 2 250 60 50 50 0.048 133 T2 2410TD2-5-R 2.5 250 60 50 50 0.035 130 T2.5 2410TD3-R 3 250 60 50 50 0.0263 97 T3 2410TD3-5-R 3.5 250 60 50 50 0.0195 95 T3.5 2410TD4-R 4 250 60 50 50 0.0185 106 T4 2410TD5-R 5 250 60 50 50 0.0133 100 T5 2410TD7-R 7 250 60 50 50 0.0087 99 T7 1. AC Interrupting rating (measured at designated voltage, 100% power factor random closing); DC Interrupting rating (measured at designated voltage, time constant of less than 50 microseconds, battery source) 2. DC Cold Resistance measured at <10% of rated current in the ambient temperature of +25 °C Dimensions- mm Drawing not to scale Recommended pad layout General specifications Operating temperature: -55 °C to +125 °C with proper derating factor applied Soldering heat resistance: MIL-STD-202 method 210 Solderability test: J-STD-002, method B1 Thermal shock: MIL-STD-202 method 107, -55 °C/+125 °C. 200 cycles Humidity bias: MIL-STD-202 method 103, 1000 hours Vibration: MIL-STD-202F method 204 Mechanical shock: MIL-STD-202 method 213, condition A Life test: MIL-STD-202 method 108, test condition D

High current time-delay SMT Brick fuse www.eaton.com/electronics Packaging information - mm 1000 parts per 8.66” diameter reel (EIA-481 compliant) Drawing not to scale Dimension millimeter W 16.00 A0 2.95 B0 6.30 K0 3.00 P0 4.00 P 8.00 P2 2.00 T 0.35 E 1.80 F 7.50 D 1.50 D1 1.50 Reel dimension- mm Dimension millimeter A 220 B 58 D 13 E 2.3 W 21 T 1.6 T emperature derating curve Percentage of current rating T emperature (°C)

High current time-delay SMT Brick fuse www.eaton.com/electronics Current vs. time curve Current (A) Time (seconds) I2t vs time curve Time (seconds) I2t (A2s) I2t vs current curveI2t (A2s) Current (A) 0.1 100 1000 0.11 10 1001 000 77AA 55AA44AA 33..55AA 33AA 22..55AA 22AA 11..55AA 11AA 775500mmAA 550000mmAA

High current time-delay SMT Brick fuse www.eaton.com/electronics Temperature Time Tsmin Tsmax Tstyp Tp tp First Wave Second Wave Preheat area Cool down area Reference EN 61760-1:2006 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat • Temperature min. (T smin) 100 °C 100 °C

  • Temperature typ. (Tstyp) 120 °C 120 °C
  • Temperature max. (Tsmax) 130 °C 130 °C
  • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150 °C max. 150 °C max. Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 °C to 25 °C 4 minutes 4 minutes Manual solder +350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended. Wave solder profile

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Cleveland, OH 44122 United States Eaton.com/electronics © 2022 Eaton All Rights Reserved Printed in USA Publication No. ELX1195 BU-ELX22055 May 2022 2410TD High current time-delay SMT Brick fuse Technical Data ELX1 195 Effective May 2022 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Reference J-STD-020 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp up rate TL to Tp 3 °C/ second max. 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 °C of the specified classification temperature (T c) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) free solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C