2410FA EATON | Alldatasheet

Document overview

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Technical content

High current fast-acting SMT Brick fuse Product features

  • 2410 (6125 metric) surface mount package
  • Fast acting
  • Designed to UL248
  • Current rating: 500 mA to 15 A
  • Moisture sensitivity level: (MSL): 1

Applications

  • Power supplies
  • Servers
  • LED lighting drivers
  • Appliances and white goods
  • LCD monitor/backlight inverters
  • Vac chip-on-board (COB) lighting
  • Industrial electronics and computing Agency information cURus Recognition file number: E19180 Environmental compliance HALOGEN HFFREE TR1- 2410FA 2-5 -R Packaging code Family code Ampere rating RoHS compliant Ordering part number Pb Packaging prefix TR1-(1000 parts on a 7” diameter tape and reel)

High current fast-acting SMT Brick fuse www.eaton.com/electronicsElectrical characteristics Amp rating % of Amp rating Opening time 500 mA to 15 A 100 4 hours minimum 500 mA to 15 A 200 5 seconds maximum Product specifications Current rating Voltage rating Interrupting rating1 at rated voltage (A) Typical DC cold resistance2 Typical voltage drop Part number (A) (Vac) (Vdc) (Vac) (Vdc) (mΩ) (mV) Part marking 2410FA500-R 0.5 125 125 50 50 281 185 .500 2410FA800-R 0.8 125 125 50 50 137 150 .800 2410FA1-R 1 125 125 50 50 105 140 .1 2410FA1-5-R 1.5 125 125 50 50 62 125 .1.5 2410FA2-R 2 125 125 50 50 27 96 .2 2410FA2-5-R 2.5 125 125 50 50 18.2 60 .2.5 2410FA3-R 3 125 125 50 50 17.8 86 .3 2410FA4-R 4 125 125 50 50 12.9 85 .4 2410FA5-R 5 125 125 50 50 10.2 81 .5 2410FA6-3-R 6.3 125 125 50 50 7.7 80 .6.3 2410FA7-R 7 125 125 50 50 7.2 80 .7 2410FA8-R 8 125 125 50 50 6.3 78 .8 2410FA10-R 10 125 125 50 50 5.1 77 .10 2410FA12-R 12 125 125 50 50 3.95 76 .12 2410FA15-R 15 125 125 50 50 3.15 75 .15 1. AC Interrupting Rating (measured at designated voltage, 100% power factor); DC Interrupting Rating (measured at designated voltage, time constant of less than 50 microseconds, battery source) 2. DC Cold Resistance measured at <10% of rated current in the ambient temperature of +25 °C Dimensions- mm Drawing not to scale Recommended pad layout Minimum copper Ratings A B C layer thickness 7 A and below 4.0 3.0 2.6 35 µm 8 A to 10 A 4.0 3.0 2.6 70 µm 12 A to 15 A 4.0 3.76 2.6 70 µm

High current fast-acting SMT Brick fuse www.eaton.com/electronics Packaging information - mm 1000 parts per 7” diameter reel (EIA-481 compliant) Drawing not to scale Dimension millimeter W 12.00 F 5.50 E1 1.75 E2 N/A P0 4.00 P1 4.00 P2 2.00 D0 1.50 D1 1.50 A0 3.00 B0 7.00 K0 3.00 T 0.30 Reel dimension- mm General specifications Operating temperature: -55 °C to +125 °C with proper derating factor applied Solderability test: J-STD-002, method B1, Steam aging 1 hour, Solder temperature + 255 ±5 °C, solder immersion time 5 s Thermal shock: MIL-STD-202 method 107G, -55 °C/+125 °C. 100 cycles Humidity bias: MIL-STD-202 method 103, 1000 hours +85 °C/85% RH Vibration: MIL-STD-202G method 201, 2 hours each of 3 orientations. Test from 10-55 Hz for 1 minute Mechanical shock: MIL-STD-202 method 213, Figure 1 of Method 213. Condition C 100 g 6 ms Dimension millimeter A 178.0 ± 2.0 B 3.0 ± 0.3 C 13.7 + 0.5/-0.2 D N/A N 60 + 0.5/-0 W1 13 + 2.0/-0 W2 18.4 maximum W3 N/A

High current fast-acting SMT Brick fuse www.eaton.com/electronics T emperature derating curve Current vs. time curve 0.5 A to 1 .5 A and 2.5 A Derating factor T emperature (°C) Current (A) Time (seconds) Current vs. time curve

2 A and 3 A and 4 A to 15 A

Current (A) Time (seconds)

High current fast-acting SMT Brick fuse www.eaton.com/electronics I2t vs. time curve 0.5 A to 1 .5 A and 2.5 A Time (seconds) I2t vs time curve Time (seconds) I2t (A2s) I2t (A 2s) I2t vs. current curve 0.5 A to 1 .5 A and 2.5 A Current (A) I2t vs current curve Current (A) I2t (A2s) I2t (A 2s)

High current fast-acting SMT Brick fuse www.eaton.com/electronics Temperature Time Tsmin Tsmax Tstyp Tp tp First Wave Second Wave Preheat area Cool down area Reference EN 61760-1:2006 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat • Temperature min. (T smin) 100 °C 100 °C

  • Temperature typ. (Tstyp) 120 °C 120 °C
  • Temperature max. (Tsmax) 130 °C 130 °C
  • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150 °C max. 150 °C max. Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 °C to 25 °C 4 minutes 4 minutes Manual solder +350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended. Wave solder profile

1000 Eaton Boulevard

Cleveland, OH 44122 United States Eaton.com/electronics © 2022 Eaton All Rights Reserved Printed in USA Publication No. ELX1196 BU-ELX22056 May 2022 Technical Data ELX1 196 Effective May 2022 2410FA High current fast-acting SMT Brick fuse Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Reference J-STD-020 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp up rate TL to Tp 3 °C/ second max. 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 °C of the specified classification temperature (T c) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) free solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C