TR0636E-20027 HIROSE | Alldatasheet
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IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT APPROVED TY. ARAI CHECKED TM.MATSUO PREPARED TY.TAKADA HIROSE ELECTRIC CO., LTD.
[1] Objective To evaluate BGA shearing force by comparing Initial state and Post 3500 thermal cycle in accordance with IPC-9701. [2] Specimens Type Product Assembly State # of specimens Type_1 IT3D-300S-BGA (57) Virgin Initial 3 Type_2 IT3D-300S-BGA (57) Reworked Initial 3 Type_3 IT3D-300S-BGA (57) Virgin Post 3500 cycles Type_4 IT3D-300S-BGA (57) Reworked Post 3500 cycles Fig.1 [3] Test period From: 2007-09-12 To : 2008-01-18 [4] Test Equipment Test equipment Model Manufacture Insertion and withdrawal force tester AG-IS Shimazu Remarks *Type_3, Type_4 are assembled as Fig.1. *The test board design is based on IPC-9701 specification. *Thickness of the PCB: 3.3mm
- Requirements The failure mode for the sheared balls shall be either bulk solder failure or copper pad lift-off. Intermetallic failure is unacceptable. 2. Conditions 2-1 Test Condition 2-2 BGA Shearing Force 0.3mm space * Speed: 500 micrometer /second Test cycle : 3500 cycles Test PCB IT3D-300S-BGA(57) CONNECTOR Sample Insertion and withdrawal force tester (+10 / 0 0C ) ( 0 / -100C )
- Results 4-1 BGA Shearing Force UNIT: KN No. Type-1 Type-2 Type-3 Type-4 State Initial Post 3500 thermal cycles Assembly Virgin Reworked Virgin Reworked 1 1.22 1.18 1.21 1.13 2 1.18 1.16 1.13 0.91 3 1.25 1.18 1.13 1.11 MAX 1.25 1.18 1.21 1.13 MIN 1.18 1.16 1.13 0.91 AVG 1.22 1.17 1.16 1.05 4-2 Failure Mode No intermetallic failure was found in all specimens. Copper pad lift-off was found in the sheared area. Details are shown in the following pages.
Type-1 (Initial) Virgin Type-2 (Initial) Reworked Copper Pad lift-off Copper Pad lift-off
Type-3 (Post 3500 thermal cycles) Virgin Type-4 (Post 3500 thermal cycles) Reworked Copper Pad lift-off Copper Pad lift-off