TR0636E-10026 HIROSE | Alldatasheet
Document overview
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- PDF pages: 21
Technical content
Datasheet sections
- 1 OVERVIEW
- 2 TEST OBJECTIVES
- 3 THERMAL CYCLING TEST PROCEDURE
- 4 TEST VEHICLES
- 4.1 Connector Type
- 4.2 Test Vehicle Configuration
- 4.3 Virgin or Reworked
- 4.4 Test Variations
- 4.5 Number of Test Vehicles and Connectors
- 5 ASSEMBLY CONDITIONS
- 5.1 Test Board Design Detail
- 5.2 Test Vehicle Assembly
- 5.3 Rework
- 5.4 X-ray Inspection
- 5.5 Continuity Check
- 6 THERMAL CYCLING TEST PROCESS
- 6.1 Preconditioning by Isothermal Aging
- 6.2 Thermal Cycle Temperature Profile Requirement
- 6.3 Thermal Cycling Test Execution
- 6.4 Measurement
- 6.5 Failure Criteria
- 6.6 Identifying for Failure Connector(s) and Failure Point(s)
- 6.7 Rerouting with Jumper Wire
- 6.8 Test Duration
- 6.9 Test Result
- 7 SOLDER BALL SHEAR TEST
- 7.1 Measurement Method
- 7.2 Failure Mode
- 7.3 Test Result
- 8 REVISION RECORD
- 10 Attachment _2 : TR0636E-20027 BGA SHEARING TEST REPORT
- 11 Attachment _3: TR0636E-20033 CROSS SECTIONING REPORT
IT3 Thermal Cycling Test TR0636E-10026 - 1 - IT3 Thermal Cycling Test Report (Solder type: Sn63 Pb37) Approved. TY. ARAI June/23rd/2008 Checked . TM. MATSUO June/23rd /2008 Prepared. TY. TAKADA June/23rd /2008 Hirose Electric Co., Ltd.
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1 OVERVIEW
The following test report is to be considered official documentation for results found during thermal cycle testing of the IT3 series BGA connector system. BGA connection is becoming a key technology for current and next generation high-speed transmission. It is crucial to perform accelerated life time testing to both simulate actual applications and prove BGA attachment reliability. All processes described herein, including test board design and thermal cycling test conditions, are based on and conform to IPC-9701. All assembly and re-work processes were performed by Jabil Circuit, Inc. (San Jose, Ca., hereafter ‘Jabil’), and thermal cycling was performed by Trace Laboratories, Inc.(Chicago, Il.). This document includes all processes and test procedures followed, along with who and where they were performed.
2 TEST OBJECTIVES
The test samples and processes were prepared to simulate various applications that included: Both virgin and rework assemblies, connector configurations, and both single and multiple connector mounts.
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3 THERMAL CYCLING TEST PROCEDURE
Test Report (9) Solder Ball Sheer Test Report (10) Cross Sectioning Report (11) Jabil Trace Labs Virgin assembly (5.2) Test samples (4.5) Rework (5.3) X-ray inspection (5.4) Thermal cycling test (6) Thermal cycling test start (6.3) Continuity check (5.5) X-ray inspection (5.4) Eutectic Eutectic Suspend thermal cycling test. Detect failure points. (6.6) Rerouting to skip the failure points with jumper wire (6.7) Test duration (6.8) 3500 cycles No (Pass) Monitor the resistance increase to initial resistance (6.4) Resume Test Terminate test NO (Failure): More than 50 % of all solder joints Yes (Failure): Five consecutive reading scans or more20 % or more increase to the initial resistance is detected for five consecutive reading scans (6.5) Failure points =< 50% (6.5) Continuity check (5.5) Test samples (4.5) YES (Pass) Cross Section at BGA joints Solder ball sheer test (7) Two combinations of assembled test samples [1 virgin, 1 reworked] Jabil Hirose
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4 TEST VEHICLES
The following parameters were applied to simulate various manufacturing and connector usage situations.
4.1 Connector Type
Mezzanine Connector: Hirose IT3 series Receptacle IT3M-300S-BGA(57)…Mounted on Mother Board IT3D-300S-BGA(57)…Mounted on Daughter Card Interposer assembly IT3-300P-17H(03)…17 mm Stacking Height IT3-300P-32H(03)…32 mm Stacking Height IT3 Connector
4.2 Test Vehicle Configuration
Boards were designed to a thickness of 3.3 mm (125 mils) per IPC-9701
4.2.1 Multiple Connector Mount
In many applications, multiple connectors are mounted on one daughter card which can create potential alignment issues and different stresses on solder joints. This test covers multiple connector mounting in various configurations. Config. 1 Config. 2 Config. 3 Config. 4 Numbers of connectors / Daughter card 1 2 2 4 Remarks Individual X Direction(2 CN) Y Direction(2CN) Quad(4 CN) Receptacle Interposer Assembly
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4.2.2 Test Board Examples
IT3 mezzanine connectors were assembled to the board and tested . Each test board has four IT3 connectors Mother Board 300 mm 300 mm IT3M-300S-BGA (57) 300 mm 300 mm IT3D-300S-BGA (57) Daughter Card（Config.4）
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4.2.3 Test Board Configurations
Config. 1 ---One connector per daughter card Config. 2 ---Two connectors per daughter card (X direction) Spacer Position Spacer Position
IT3 Thermal Cycling Test TR0636E-10026 - 8 - Config. 3 ---Two connectors per daughter card (Y direction) Config. 4 --- Four connectors per daughter card Spacer Position Spacer Position
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4.3 Virgin or Reworked
To simulate the actual assembly process, both “Virgin” and “Reworked” board samples were tested. Assembly was done by Jabil, using industry standard assembly /rework equipment and processes. Virgin Reworked Test Board Virgin Reuse after connector removal Connector Virgin Virgin
4.4 Type of Solder
Solder Ball on Connector Eutectic Eutectic Solder Paste Eutectic Eutectic
4.5 Number of Test Vehicles and Connectors
For 3.3mm (125 mil) thick test boards, the following number of connectors were used. Note: 12/4 represents 12 Virgin and 4 Reworked Height Config 1 Config 2 Config 3 Config 4 Total # of Connectors 17H 6/2 6/2 6/2 6/2 24/8 IT3-300S 32H 6/2 6/2 6/2 6/2 24/8 Totals 12/4 12/4 12/4 12/4 48/16
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5 ASSEMBLY CONDITIONS
5.1 Test Board Design Detail
Test Board Design Details per IPC-9701 Item Requirement Remarks 1 Thickness 3.3mm (125 mils) per IPC-9701 － 2 # of Metal Layers 16 layers －
3 Layer
Structure See Fig. 1 on the next page －
4 PCB Material High Tg FR-4 IS-410/NP-150TL
5 Ground Layer Remaining 70% copper mesh
Ground plane on even # layers
6 Signal Layer Remaining 30% copper weave
Signal traces on odd # layers
7 Daisy Chain On top layer only －
8 Pad and Via Pads for probing on the bottom
For failure analysis purposes, pads are connected by jumper cable to continue rest of the cycles if any failure is found. Simulate mechanical strength of actual PCBs with vias.
9 Surface Finish High Tg OSP (Organic solderability
preservative) Passed IPC-S-804B solderability test IPC-TM-650 insulation resistance test IPC-6012(0.75%) warp and twist test
10 Pad Type NSMD (Non-solder mask defined) －
11 Copper
Outer layer: 35 microns Inner ground: 35 microns Inner signal: 18 microns
12 Trace Width 200 microns (8 mils)
150 microns (6 mils) minimum (IPC-9701) 13 # of Connectors 10 connectors per board maximum － Note: Test boards were designed to measure electrical continuity using the daisy chain circuit only. Vias were not connected to any specific signal or ground layers. Neither ground contacts nor ground layers are connected anywhere.
IT3 Thermal Cycling Test TR0636E-10026 - 11 - * 16 Layers in Total Fig. 1 PCB Layer Structure Fig. 2 BGA Land Design Layer Footprint type Top Daisy chain 2nd Ground layer 3rd Signal layer Type A 4th Ground layer 5th Signal layer Type B 6th Ground layer 7th Signal layer Type A 8th Ground layer 9th Signal layer Type B 10th Ground layer 11th Signal layer Type A 12th Ground layer 13th Signal layer Type B 14th Ground layer 15th Signal layer Type A Bottom Via test points Top layer (daisy chained) Ground (meshed. 70% copper) Signal (weaved 30% copper) Bottom layer (Probing pads for failure analysis and jumper cable) IT3* – 300S-BGA Foot Pattern 270-φ0.65+/-0.05 (Solder Mask)
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5.2 Test Vehicle Assembly
Hirose provided assembly/rework process information, that was then adapted by Jabil to conform to industry standard practices. All connectors were assembled / reworked at Jabil.
5.2.1 Virgin Assembly Parameters
Process parameters followed for testing. Items Requirements Type of Reflow Equipment Mass-reflow conveyor furnaces Pre Conditioning Dry package Stencil Thickness = 0.127 mm (0.005’’) Frame size X= 736.6 mm, Y= 736.6 mm (29’’ x 29’’) Open area ratio : 90% aperture size by area Solder Ball Composition Sn63 : Pb37 Solder Paste Composition (Supplier Part Number) Sn63 : Pb37 (Kester EP 256 no-clean Eutectic solder paste) Process Parameters DEK-265GSX Automatic screen printer Printing speed = 1’’/second Stencil snap off = 0 Reflow Temperature Profile See details on the next page. Reflow Atmosphere Nitrogen
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5.3 Rework
“Rework” consists of a series of processes, such as removal of connector by using rework equipment (i.e., SRT), PCB cleaning and placement/reflow of a new connector using rework equipment.
5.3.1 Rework Parameters
Type of Reflow Equipment Hot air rework station Stencil Thickness = 0.127 mm (0.005’’) Open area ratio : 90% aperture size by area Solder Ball Composition Sn63 : Pb37 Solder PasteComposition Sn63 : Pb37 (Kester EP 256 no-clean Eutectic solder paste) Rework Atomosphere Nitrogen
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5.4 X-ray Inspection Test Board Design Detail
X-ray inspection after assembly was conducted. All connectors passed the X-ray inspection before thermal cycling. X ray Photo : IT3D-300S-BGA (57)
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5.5 Continuity Check
Final assembly, including mounting interposer assembly / daughter cards and board spacers, was performed to complete the daisy-chain circuit prior to performing the continuity check. Cross section _ AA Resistance Per Connector Chain IT3 Interposer Height Resistance 17 mm height 25 to 29 32 mm height 38 to 42 Unit : Ohm * Resistance includes one connector assembly plus PCB trace. R A A
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6 THERMAL CYCLING TEST PROCESS
Thermal cycling test performed conforms to IPC-9701 (JESD22-A-104-B).
6.1 Preconditioning by Isothermal Aging
Test specimens were subjected to an accelerated thermal aging (e.g. 24 hours at 100 qC (-0/+5 qC)) in air to simulate a reasonable use period and to accelerate such possible processes as solder gain, growth, intermetallic compound growth or oxidation. Test specimens were stored at room temperature following the artificial aging process and before commencing the thermal cycling test.
6.2 Thermal Cycle Chamber Profile
Dummy boards and connectors were employed to simulate expected thermal mass A minimum of 4 thermal couples near connectors on at least 2 boards Thermal cycle profile Tmax = 100 oC (+10 / 0 oC ) Tmin = 0 oC ( 0 / -10 oC) Ramp rate = Approximately 10 oC/min (10% to 90% of test temperature range) Dwell time = 5 to 10 min (Holding time of maximum and minimum temperature) 5 successful cycles were performed before commencing test. Time 100Temperature (qC) Upper Dwell Time Ts (max) Lower Dwell Time Nominal Ts (min) w/Tolerance Cycle Time Ts Nominal Ts (max) w/Tolerance Ts (min) 'T Cyclic Range
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6.3 Thermal Cycling Test Execution
Measured Thermal Cycle Profile Thermocouple Locations IT3-assembled test board (Refer to 4.2.2 Test board example for test board details.) Door TC5 TC3 TC4 TC1 --- AIR TC6 TC2 Chamber_1 TL 544 Chamber_2 TL 745 Air temperature (Blue Line) Air temperature (Yellow Line)
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6.4 Measurement
Chamber temperature profile was continuously monitored and recorded during the test. Electrical resistance was monitored and recorded continuously. Maximum scan interval of all chains was one minute during test.
6.5 Failure Criteria
Failure was claimed when a 20% resistance increase to initial resistance was monitored for five consecutive reading scans. Failure points could not exceed 50 %.
6.6 Identifying Failed Connector(s) and Failure Point(s)
Failed connectors or failed points were identified by probing connector and specific test points and daisy chain test points located on the bottom of all test boards. Failure point(s) and number of cycles were recorded, when failure(s) occurred.
6.7 Rerouting with Jumper Wire
Once failure and location was detected, rerouting of the effected area was required. Jumper wires (AWG32, 60mm in length, pre-stripped and tinned) provided by Hirose were inserted approximately 2 mm into the appropriate through-holes and then soldered to complete the bypass.
6.8 Test Duration
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6.9 Test Result
See attached document "07-29834-R1 PRINTED CIRCUIT BOARDS TEMPERATURE CYCLE" prepared by Trace Laboratories, Inc. for more details. No failure was observed up to 3,500 temperature cycles. Board # Initial Resistance Final Resistance Failure cycle & Resistance Configuration Conn-1 Conn-2 Conn-3 Conn-4 MB-001 40.9 40.1 No failure Config-1 Virgin Virgin Virgin Virgin MB-002 26.5 25.8 No failure Config-1 Virgin Virgin Virgin Virgin MB-003 40.2 39.7 No failure Config-2 Virgin Virgin Virgin Virgin MB-004 26.0 25.6 No failure Config-2 Virgin Virgin Virgin Virgin MB-005 39.9 39.6 No failure Config-3 Virgin Virgin Virgin Virgin MB-006 25.7 25.2 No failure Config-3 Virgin Virgin Virgin Virgin MB-007 40.2 39.8 No failure Config-4 Virgin Virgin Virgin Virgin MB-008 26.5 26.1 No failure Config-4 Virgin Virgin Virgin Virgin MB-009 41.1 40.1 No failure Config-1 Virgin Virgin Reworked Reworked MB-010 27.5 26.5 No failure Config-1 Virgin Virgin Reworked Reworked MB-011 41.0 40.4 No failure Config-2 Virgin Virgin Reworked Reworked MB-012 26.0 26.6 No failure Config-2 Virgin Virgin Reworked Reworked MB-013 39.8 41.1 No failure Config-3 Reworked Virgin Virgin Reworked MB-014 26.9 27.5 No failure Config-3 Reworked Virgin Virgin Reworked MB-015 40.6 41.5 No failure Config-4 Reworked Virgin Virgin Reworked MB-016 26.4 26.9 No failure Config-4 Reworked Virgin Virgin Reworked Unit：ohm Measurement Result
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7 SOLDER BALL SHEAR TEST
Ball shear qualification conforms to IPC-9701. The minimum shear force is defined as the mean minus 3 sigma, for a minimum of three connectors
7.1 Measurement Method
Force is applied to the edge of the connector so that the balls receive the shearing force. The height of shearing tool should exceed the height of the connector surface of 50μm minimum. Test speed: 500 micrometer / second
7.2 Failure Mode
The failure mode for the sheared balls is defined as either a bulk solder failure or copper pad lift-off. An intermetallic failure between contacts and balls is unacceptable.
7.3 Test Result
See the attachment "TR0636E-20027 : IT3D(M)-300S-BGA (57) BGA shearing force test report" No intermetallic failure between contacts and balls was observed in both Initial and Post 3500 cycles specimens.
IT3 Thermal Cycling Test TR0636E-10026 - 21 - 8. REVISION RECORD Revision no. Description (Major changes) Date Initial release June. 23rd , 2008