TPS82670_12 TI | Alldatasheet

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0.1 1 10 100 1000 I - Load Current - mAO Power Loss - mW Efficiency - % V = 3.6 V, V = 1.8 V I O Efficiency PFM/PWM Operation Power Loss PFM/PWM Operation VIN SW FB MODE GND EN VOUT

1.8 V @ 600mA

L VIN 2.3 V .. 4.8 V CO MODE SELECTIONENABLE DC/DC Converter GND TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 600-mA,HIGH-EFFICIENCYMicroSiP™ STEP-DOWNCONVERTER(PROFILE<1.0mm) Check for Samples: TPS82670 ,TPS82671 ,TPS82672 ,TPS82673 ,TPS82674 ,TPS82675 ,TPS82676 ,TPS82677 ,TPS826711 ,TPS826745 , TPS826765 1FEATURES DESCRIPTION 23• 90% Efficiencyat5.5MHz Operation The TPS8267x deviceisa complete600mA, DC/DC

  • 17μA QuiescentCurrent step-down power supply intended for low-power applications.Included in the package are the• Wide VIN Range From 2.3Vto4.8V switching regulator,inductor and input/output• 5.5MHz RegulatedFrequency Operation capacitors.No additionalcomponents arerequiredto• Spread Spectrum, PWM Frequency Dithering finishthedesign.
  • Best inClass Load and LineTransient The TPS8267x is based on a high-frequency
  • ±2% TotalDC VoltageAccuracy synchronousstep-downdc-dcconverteroptimizedfor battery-powered portable applications. The• Automatic PFM/PWM Mode Switching MicroSiPTM DC/DC converteroperatesata regulated• Low RippleLight-LoadPFM Mode 5.5-MHz switchingfrequencyand entersthe power-• ≥35dB VIN PSRR (1kHz to10kHz) save mode operationatlightloadcurrentstomaintain
  • InternalSoftStart,120-µs Start-UpTime highefficiencyovertheentireloadcurrentrange.
  • IntegratedActivePower-Down Sequencing The PFM mode extendsthe batterylifeby reducing (Optional) the quiescentcurrentto 17μA (typ)duringlightload operation.For noise-sensitiveapplications,thedevice• CurrentOverload and Thermal Shutdown has PWM spread spectrum capabilityprovidingaProtection lowernoiseregulatedoutput,as wellas low noiseat• Sub 1-mm ProfileSolution theinput.These features,combined withhighPSRR
  • TotalSolutionSize<6.7mm 2 and AC load regulationperformance,make this devicesuitabletoreplacea linearregulatortoobtain betterpower conversionefficiency.APPLICATIONS
  • CellPhones, Smart-Phones The TPS8267x ispackaged ina compact (2.3mm x 2.9mm) and low profile(1.0mm) BGA package• DigitalTV, WLAN, GPS and Bluetooth™ suitableforautomatedassemblyby standardsurfaceApplications mount equipment.• POL Applications Figure1. TypicalApplication Figure2. Efficiencyvs.Load Current Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2MicroSiPisa trademarkofTexas Instruments. 3Bluetoothisa trademarkofBluetoothSIG,Inc. UNLESS OTHERWISE NOTED this document contains Copyright© 2010–2012,Texas InstrumentsIncorporatedPRODUCTION DATA informationcurrentas of publicationdate. Products conform to specificationsper the terms of Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. ORDERING INFORMATION (1) PART OUTPUT DEVICE PACKAGETA ORDERING (3) NUMBER VOLTAGE (2) SPECIFIC FEATURE MARKING PWM Spread SpectrumModulation TPS82670 1.86V Low PFM OutputRippleVoltage TPS82670SIP YK OutputCapacitorDischarge PWM Spread SpectrumModulationTPS82671 1.8V TPS82671SIP RALow PFM OutputRippleVoltage PWM Spread SpectrumModulation TPS826711 1.8V Low PFM OutputRippleVoltage TPS826711SIP YW OutputCapacitorDischarge PWM Spread SpectrumModulationTPS82672 1.5V TPS82672SIP WDLow PFM OutputRippleVoltage PWM Spread SpectrumModulation TPS82673 1.26V Low PFM OutputRippleVoltage TPS82673SIP YL OutputCapacitorDischarge PWM Spread SpectrumModulation TPS82674 1.2V Low PFM OutputRippleVoltage TPS82674SIP SW -40°C to85°C OutputCapacitorDischarge PWM Spread SpectrumModulation TPS826745 1.225V Low PFM OutputRippleVoltage TPS826745SIP B5 OutputCapacitorDischarge PWM Spread SpectrumModulationTPS82675 1.2V TPS82675SIP RBLow PFM OutputRippleVoltage PWM Spread SpectrumModulation TPS82676 1.1V Low PFM OutputRippleVoltage TPS82676SIP TU OutputCapacitorDischarge TPS82677 1.2V OutputCapacitorDischarge TPS82677SIP SK PWM Spread SpectrumModulationTPS82678 (4) 1.35V TPS82678SIP TNOutputCapacitorDischarge PWM Spread SpectrumModulation TPS826765 1.05V Low PFM OutputRippleVoltage TPS826765SIP AN OutputCapacitorDischarge (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. (2) Internaltappointsareavailabletofacilitateoutputvoltagesin25mV increments. TPS82671SIPT) toorderquantitiesof250 parts. (4) ProductPreview

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TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 ABSOLUTE MAXIMUM RATINGS overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) VALUE UNIT MIN MAX VoltageatVIN(2)(3) –0.3 6 V VI VoltageatVOUT (3) –0.3 3.6 V VoltageatEN, MODE (3) –0.3 VIN + 0.3 V Power dissipation Internallylimited TA Operatingtemperaturerange(4) –40 85 °C TINT (max) Maximum internaloperatingtemperature 125 °C Tstg Storagetemperaturerange –55 125 °C Human body model 2 kV ESD rating(5) Charge devicemodel 1 kV Machine model 200 V (1) Stressesbeyond thoselistedunderabsolutemaximum ratingsmay cause permanentdamage tothedevice.These arestressratings onlyand functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunderrecommended operating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Operationabove 4.8Vinputvoltageforextendedperiodsmay affectdevicereliability. (3) Allvoltagevaluesarewithrespecttonetworkgroundterminal. (4) Inapplicationswhere highpower dissipationand/orpoorpackage thermalresistanceispresent,themaximum ambienttemperaturemay have tobe derated.Maximum ambienttemperature(TA(max))isdependenton themaximum operatingtemperature(TINT(max)),the maximum power dissipationofthedeviceintheapplication(PD(max)),and thejunction-to-ambientthermalresistanceofthepart/package intheapplication(θJA),as givenby thefollowingequation:TA(max)= TJ(max)–(θJA X PD(max)).To achieveoptimum performance,itis recommended tooperatethedevicewitha maximum internaltemperatureof105°C. (5) The human body model isa 100-pFcapacitordischargedthrougha 1.5-kΩ resistorintoeach pin.The machine model isa 200-pF capacitordischargeddirectlyintoeach pin. THERMAL INFORMATION TPS8267xSIP THERMAL METRIC (1)(2) SIP UNITS

8 PINS

θJA Junction-to-ambient(top)thermalresistance 125 Junction-to-ambient(bottom)thermalresistance 70 θJCtop Junction-to-case(top)thermalresistance θJB Junction-to-boardthermalresistance °C/W ψJT Junction-to-topcharacterizationparameter ψJB Junction-to-boardcharacterizationparameter θJCbot Junction-to-case(bottom)thermalresistance (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . (2) Thermaldatahave been measured usingTI's 4-layerevaluationboard. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT VIN Inputvoltagerange 2.3 4.8(1) V IO Outputcurrentrange TPS82671 toTPS826765 0 600 mA TPS82670 toTPS82676 0 2.5 µFTPS826711, TPS826765Additionaloutputcapacitance(PFM/PWM operation)(2) TPS82677, TPS82678 0 4 µF Additionaloutputcapacitance(PWM operation)(2) 0 7 µF TA Ambienttemperature –40 +85 °C TJ Operatingjunctiontemperature –40 +125 °C (1) Operationabove 4.8Vinputvoltageforextendedperiodsmay affectdevicereliability. (2) Incertainapplicationslargercapacitorvaluescan be tolerable,see outputcapacitorselectionsectionformore details. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com

ELECTRICAL CHARACTERISTICS

Minimum and maximum valuesareatVIN = 2.3Vto5.5V,VOUT = 1.8V,EN = 1.8V,AUTO mode and TA = –40°C to85°C; CircuitofParameterMeasurement Informationsection(unlessotherwisenoted).TypicalvaluesareatVIN = 3.6V,VOUT = 1.8V,EN = 1.8V,AUTO mode and TA = 25°C (unlessotherwisenoted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY CURRENT IO = 0mA. Devicenotswitching 17 40 μA IQ Operatingquiescentcurrent IO = 0mA. PWM operation 5.8 mA ISD Shutdown current EN = GND 0.5 5 μA UVLO Undervoltagelockoutthreshold 2.05 2.1 V PROTECTION Thermalshutdown 140 °C Thermalshutdownhysteresis 10 °C ILIM Peak InputCurrentLimit 1100 mA Inputcurrentlimitundershort-circuitISC VO shortedtoground 13.5 mAconditions ENABLE, MODE VIH High-levelinputvoltage 1.0 V VIL Low-levelinputvoltage 0.4 V Ilkg Inputleakagecurrent InputconnectedtoGND orVIN 0.01 1.5 μA OSCILLATOR fSW Oscillatorfrequency IO = 0mA. PWM operation 4.9 5.45 6.0 MHz OUTPUT TPS82670 2.5V≤ VI≤ 4.8V,0mA ≤ IO ≤ 600 mA 0.98×VNOM VNOM 1.03×VNOM VTPS82671 PFM/PWM operation TPS826711 2.5V≤ VI≤ 5.5V,0mA ≤ IO ≤ 600 mATPS82672 0.98×VNOM VNOM 1.04×VNOM VPFM/PWM operationTPS82673 TPS82674 TPS826745RegulatedDC 2.5V≤ VI≤ 5.5V,0mA ≤ IO ≤ 600 mATPS82675VOUT 0.98×VNOM VNOM 1.02×VNOM Voutputvoltage PWM operationTPS82676 TPS626765 2.5V≤ VI≤ 4.8V,0mA ≤ IO ≤ 600 mA 0.98×VNOM VNOM 1.04×VNOM VPFM/PWM operationTPS82677 TPS82678 2.5V≤ VI≤ 5.5V,0mA ≤ IO ≤ 600 mA 0.98×VNOM VNOM 1.02×VNOM VPWM operation Lineregulation VI= VO + 0.5V(min2.5V)to5.5V,IO = 200 mA 0.23 %/V Load regulation IO = 0mA to600 mA. PWM operation –0.00085 %/mA Feedback inputresistance 480 kΩ TPS82671 IO = 1mA, VO = 1.8V 19 mV PPTPS826711 TPS82673 TPS82674 IO = 1mA, VO = 1.2V 16 mV PPTPS826745 Power-savemode TPS82675ΔVO ripplevoltage TPS82676 IO = 1mA, VO = 1.1V 16 mV PP TPS826765 IO = 1mA, VO = 1.05V 16 mV PP TPS82677 IO = 1mA, VO = 1.2V 25 mV PP TPS82678 IO = 1mA, VO = 1.35V 25 mV PP TPS82671Start-uptime IO = 0mA, Time fromactiveEN toVO 120 μsTPS826711 Dischargeresistor rDIS forpower-down Devicesfeaturingactivedischarge 70 150 Ω sequence

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(TOP VIEW) SIP-8 (BOTTOM□VIEW) C2GND MODE VOUT GND VIN EN C2GND EN VIN GNDC1 VOUT MODE TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 PIN ASSIGNMENTS PIN DESCRIPTIONS PIN I/O DESCRIPTION NAME NO. VOUT A1 O Power outputpin.Applyoutputloadbetween thispinand GND. VIN A2,A3 I The VIN pinssupplycurrenttotheTPS8267x internalregulator. Thisistheenablepinofthedevice.Connectthispintogroundtoforcetheconverterinto EN B2 I shutdownmode. PullthispintoVItoenablethedevice.Thispinmust notbe leftfloatingand must be terminated. Thisisthemode selectionpinofthedevice.Thispinmust notbe leftfloatingand must be terminated. MODE = LOW: The deviceisoperatinginregulatedfrequencypulsewidthmodulationmodeMODE B1 I (PWM) athigh-loadcurrentsand inpulsefrequencymodulationmode (PFM) atlightload currents. MODE = HIGH: Low-noisemode isenabledand regulatedfrequencyPWM operationisforced. GND C1, C2, C3 – Ground pin. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

L VIN CO MODE SELECTIONENABLE DC/DC Converter GND VOUT Gate Driver Anti Shoot -Through Power Save Mode Feedback Divider Frequency Control L GND Soft -Start EN VIN Current Limit Detect Undervoltage Lockout Bias Supply Bandgap Thermal Shutdown Negative Inductor Current Detect VIN MODE V = 0.8 VREF VREF CI 1µH C 4.7µF O Switching VOUT DC/DC CONVERTER 2.2µF TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM PARAMETER MEASUREMENT INFORMATION

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0.1 1 10 100 1000 I - Load Current - mAO Efficiency - % V = 1.8 VO V = 2.7 V PFM/PWM Operation I V = 3.6 V PFM/PWM Operation I V = 4.2 V PFM/PWM Operation I V = 3.6 V Forced PWM Operation I 100 0.1 1 10 100 1000 I - Load Current - mAO Efficiency - % V = 1.2 VO V = 2.7 V PFM/PWM Operation I V = 3.6 V PFM/PWM Operation I V = 4.2 V PFM/PWM Operation I V = 3.6 V Forced PWM Operation I TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 TYPICAL CHARACTERISTICS TableofGraphs FIGURE vs Load current 3,4 η Efficiency vs Inputvoltage 5 Peak-to-peakoutputripplevoltage vs Load current 6,7,8 VO DC outputvoltage vs Load current 9,10,11 Combined line/loadtransient 12,13response 14,15,16,17Load transientresponse 18,19,20 AC loadtransientresponse 21 22,23,24,25Load transientresponse 26,27,28 AC loadtransientresponse 29 PFM/PWM boundaries vs Inputvoltage 30,31 IQ Quiescentcurrent vs Inputvoltage 32 fs PWM switchingfrequency vs Inputvoltage 33 Start-up 34,35 PSRR Power supplyrejectionratio vs.Frequency 36 Spuriousoutputnoise(PFM mode) vs.Frequency 37 Spuriousoutputnoise(PWM mode) vs.Frequency 38 Outputspectralnoisedensity vs.Frequency 39 EFFICIENCY EFFICIENCY vs vs LOAD CURRENT LOAD CURRENT Figure3. Figure4. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

0 25 50 75 100 125 150 175 200 225 250 275 300 I - Load Current - mAO V - Peak-to-Peak Output Ripple Voltage - mVO V = 2.7 VI V = 3.6 VI V = 4.5 VI V = 1.2 V (TPS82677)O 0 20 40 60 80 100 120 140 160 180 200 I - Load Current - mAO V - Peak-to-Peak Output Ripple Voltage - mV O V = 2.7 VI V = 4.5 VI V = 3.6 VI PFM/PWM Operation V = 1.2 V (TPS82675)O Efficiency - % V - Input Voltage - VI I = 300 mAO I = 100 mAO I = 10 mAO I = 1 mAO V = 1.8 V PFM/PWM Operation O 0 20 40 60 80 100 120 140 160 180 200 I - Load Current - mAO V - Peak-to-Peak Output Ripple Voltage - mV O V = 1.8 V (TPS82671)O V = 2.7 VI V = 4.5 VI V = 3.6 VI PFM/PWM Operation TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) EFFICIENCY PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE vs vs INPUT VOLTAGE LOAD CURRENT Figure5. Figure6. PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE vs vs LOAD CURRENT LOAD CURRENT Figure7. Figure8.

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1.176 1.188 1.2 1.212 1.224 0.1 1 10 100 1000 I - Load Current - mAO V - Output Voltage - VO V = 1.2 V (TPS82677) PFM/PWM Operation O V = 4.5 VI V = 3.6 VI V = 2.7 VI 3.3V to 3.9V Line Step V = 1.8 V (TPS82671)O MODE = Low 30 to 300 mA Load Step 1.764 0.1 I - Load Current - mAO V = 1.8 V (TPS82671) PFM/PWM Operation O V = 2.7 VI V = 4.5 VI V = 3.6 VI 1 10 100 1000 1.782 1.800 1.818 1.836 V - Output Voltage - V O 1.176 0.1 I - Load Current - mAO V = 1.2 V (TPS82675) PFM/PWM Operation O V = 2.7 VI V = 4.5 VI V = 3.6 VI 1 10 100 1000 1.188 1.2 1.212 1.224 V - Output Voltage - V O TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 TYPICAL CHARACTERISTICS (continued) DC OUTPUT VOLTAGE DC OUTPUT VOLTAGE vs vs LOAD CURRENT LOAD CURRENT Figure9. Figure10. DC OUTPUT VOLTAGE vs LOAD CURRENT COMBINED LINE/LOAD TRANSIENT RESPONSE Figure11. Figure12. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

MODE = Low 50 to 350 mA Load Step V = 3.6 V, V = 1.8 V (TPS82671) I O MODE = Low 50 to 350 mA Load Step V = 2.7 V, V = 1.8 V (TPS82671) I O MODE = Low 30 to 150 mA Load Step 2.7V to 3.3V Line Step V = 1.8 V (TPS82671)O MODE = Low 5 to 150 mA Load Step V = 3.6 V, V = 1.8 V (TPS82671) I O TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) LOAD TRANSIENT RESPONSE IN COMBINED LINE/LOAD TRANSIENT RESPONSE PFM/PWM OPERATION Figure13. Figure14. LOAD TRANSIENT RESPONSE IN LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION PFM/PWM OPERATION Figure15. Figure16.

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MODE = Low 150 to 500 mA Load Step V = 2.7 V, V = 1.8 V (TPS82671) I O MODE = Low 150 to 500 mA Load Step V = 4.5 V, V = 1.8 V (TPS82671) I O MODE = Low 50 to 350 mA Load Step V = 4.5 V, V = 1.8 V (TPS82671) I O MODE = Low V = 3.6 V, V = 1.8 V (TPS82671) I O 150 to 500 mA Load Step TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 TYPICAL CHARACTERISTICS (continued) LOAD TRANSIENT RESPONSE IN LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION PFM/PWM OPERATION Figure17. Figure18. LOAD TRANSIENT RESPONSE IN LOAD TRANSIENT RESPONSE PFM/PWM OPERATION IN PFM/PWM OPERATION Figure19. Figure20. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

MODE = Low V = 3.6 V, V = 1.2 V I O 50 to 350 mA Load Step MODE = Low V = 2.7 V, V = 1.2 V I O 50 to 350 mA Load Step MODE = Low V = 3.6 V, V = 1.8 V (TPS82671) I O 5 to 300 mA Load Sweep MODE = Low V = 3.6 V, V = 1.2 V I O 5 to 150 mA Load Step TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) LOAD TRANSIENT RESPONSE AC LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION Figure21. Figure22. LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION IN PFM/PWM OPERATION Figure23. Figure24.

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MODE = Low V = 2.7 V, V = 1.2 V I O 150 to 500 mA Load Step MODE = Low V = 4.5 V, V = 1.2 V I O 150 to 500 mA Load Step MODE = Low 50 to 350 mA Load Step MODE = Low V = 3.6 V, V = 1.2 V I O 150 to 500 mA Load Step TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 TYPICAL CHARACTERISTICS (continued) LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION IN PFM/PWM OPERATION Figure25. Figure26. LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION IN PFM/PWM OPERATION Figure27. Figure28. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

V -□Input□Voltage□-□VI I -□Quiescent□Current□- AQ /c109 T =□85°CA T =□25°CA T =□-40°CA 100 120 140 I - Load Current - mAO V - Input Voltage - VI The switching mode changes at these borders Always PWM Always PFM PWM to PFM Mode Change PFM to PWM Mode Change V = 1.2 V (TPS82674)O 100 120 140 I - Load Current - mAO V - Input Voltage - VI The switching mode changes at these borders Always PWM Always PFM PWM to PFM Mode Change PFM to PWM Mode Change V = 1.8 V (TPS82671)O MODE = Low V = 3.6 V, V = 1.2 V I O 5 to 300 mA Load Sweep TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) AC LOAD TRANSIENT RESPONSE PFM/PWM BOUNDARIES Figure29. Figure30. QUIESCENT CURRENT vs PFM/PWM BOUNDARIES INPUT VOLTAGE Figure31. Figure32.

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0.01 0.1 1 10 100 1000 f - Frequency - kHz PSRR - Power Supply Rejection Ratio - dB I = 10 mA PFM Operation O I = 400 mA PWM Operation O I = 150 mA PWM Operation O V = 3.6 V, V = 1.8 V (TPS82671) I O MODE = Low V = 3.6 V, V = 1.8 V (TPS82671), I O R = 100L Ω 5.5 4.5 3.5 2.5 V - Input Voltage - VI f - Switching Frequency - MHzS I = 150 mAO I = 500 mAO I = 400 mAO I = 300 mAO V = 1.8 VO MODE = Low V = 3.6 V, V = 1.8 V (TPS82671), I O I = 0 mAO TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 TYPICAL CHARACTERISTICS (continued) PWM SWITCHING FREQUENCY vs INPUT VOLTAGE START-UP Figure33. Figure34. POWER SUPPLY REJECTION RATIO vs START-UP FREQUENCY Figure35. Figure36. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

0.1 0.01 0.001 0.1 1 10 100 1000 f - Frequency - kHz V = 3.6 VIN V = 1.8 V (TPS82671)OUT I = 10 mA (PFM Mode)OUT I = 150 mA (PWM Mode)OUT Output Spectral Noise Density - Hz µV/V 0 10 3.5 m 3 m 2.5 m 2 m 1.5 m 1 m 500 /c109 50 n Spurious Output Noise (PFM Mode) - V f - Frequency - MHz Span = 1 MHz 5 m 4.5 m 5 m V = 1.8 V (TPS82671), R = 150 O L Ω V = 3.6 VI V = 2.7 VI V = 4.2 VI 0 40 300 /c109 250 /c109 200 /c109 150 /c109 100 /c109 50 /c109 5 n Spurious Output Noise (PWM Mode) - V f - Frequency - MHz Span = 4 MHz 350 /c109 400 /c109 450 /c109 V = 1.8 V (TPS82671), R = 12 O L Ω 500 /c109 V = 2.7 VI V = 4.2 VI V = 3.6 VI TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) SPURIOUS OUTPUT NOISE (PFM MODE) SPURIOUS OUTPUT NOISE (PWM MODE) vs vs FREQUENCY FREQUENCY Figure37. Figure38. OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY Figure39.

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PFM□Mode□at□Light□Load PFM□Ripple PWM□Mode□at□Heavy□LoadNominal□DC□Output□Voltage TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 DETAILED DESCRIPTION OPERATION The TPS8267x isa stand-alone,synchronous,step-downconverter.The converteroperatesata regulated5.5- MHz frequencypulsewidthmodulation(PWM) at moderate to heavy loadcurrents.At lightloadcurrents,the TPS8267x converteroperatesinpower-savemode withpulsefrequencymodulation(PFM). The converteruses a uniquefrequency-lockedring-oscillatingmodulatortoachievebest-in-classloadand line response.One key advantageof the non-lineararchitectureisthatthereisno traditionalfeed-backloop.The loopresponsetochange inVO isessentiallyinstantaneous,whichexplainsthetransientresponse.Althoughthis typeof operationnormallyresultsina switchingfrequencythatvarieswithinputvoltageand loadcurrent,an internalfrequencylockloop (FLL) holds the switchingfrequencyconstantover a largerange of operating conditions. Combined withbest-in-classloadand line-transientresponsecharacteristics,the low quiescentcurrentof the device(approximately17μA) helpsto maintainhighefficiencyat lightloadwhilethatcurrentpreservesa fast transientresponseforapplicationsthatrequiretightoutputregulation. The TPS8267x integratesan inputcurrentlimitto protectthe deviceagainstheavy loador shortcircuitsand featuresan undervoltagelockoutcircuitto preventthe devicefrom misoperationat low inputvoltages.Fully functionaloperationispermitteddown to2.1Vinputvoltage. POWER-SAVE MODE Ifthe loadcurrentdecreases,the converterenterspower-savemode automatically.Duringpower-savemode, the converteroperatesindiscontinuouscurrent,(DCM) single-pulsePFM mode, which producesa low output ripplecompared withotherPFM architectures. When inpower-savemode, theconverterresumes itsoperationwhen theoutputvoltagefallsbelow thenominal voltage.The converterramps up the outputvoltagewitha minimum of one pulseand goes intopower-save mode when theoutputvoltageiswithinitsregulationlimits. The IC exitsPFM mode and entersPWM mode when the outputcurrentcan no longerbe supportedinPFM mode. As a consequence,theDC outputvoltageistypicallypositionedapproximately0.5% above thenominal outputvoltage.The transitionbetween PFM and PWM isseamless. Figure40. OperationinPFM Mode and TransfertoPWM Mode MODE SELECTION The MODE pin selectsthe operatingmode of the device.Connectingthe MODE pin to GND enables the automaticPWM and power-savemode operation.The converteroperatesinregulatedfrequencyPWM mode at moderate toheavy loads,and operatesinPFM mode duringlightloads.Thistypeofoperationmaintainshigh efficiencyovera wideloadcurrentrange. Pullingthe MODE pin high forcesthe converterto operatein PWM mode even at light-loadcurrents.The advantage is thatthe convertermodulates itsswitchingfrequencyaccordingto a spread spectrum PWM modulationtechniquethatallowssimplefilteringoftheswitchingharmonicsinnoise-sensitiveapplications.Inthis mode, theefficiencyislowerwhen compared tothepower-savemode duringlightloads. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

c c ƒ= ƒ /c68/c100 c ƒ m δ ƒm = ƒ /c180 /c40 /c41 /c40 /c41 hmfB ffmfB fmh mcfm /c215/c43/c215/c215/c61 /c43/c68 /c215/c61/c43/c215/c215/c61 )(212 /c40 /c41 )(212 mcfm ffmfB /c43/c68 /c215/c61/c43/c215/c215/c61 0□dBV 0□dBVref FENV,PEAK /c68 fc /c68 fc Non-modulated□harmonic Side-band□harmonics window□after□modulation TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com For additionalflexibility,itispossibletoswitchfrompower-savemode toPWM mode duringoperation.Thistype ofoperationallowsefficientpower management by adjustingtheoperationoftheconvertertothespecificsystem requirements. SPREAD SPECTRUM, PWM FREQUENCY DITHERING The goalofspreadspectrumarchitectureistospreadouttheemittedRF energyovera largerfrequencyrange so thatany resultingelectromagneticinterference(EMI)issimilartowhitenoise.The end resultisa spectrum thatiscontinuousand lowerinpeak amplitude.Spread spectrummakes iteasiertocomply withEMI standards. Italsomakes iteasiertocomply withthepower supplyripplerequirementsincellularand non-cellularwireless applications.Radio receiversare typicallysusceptibleto narrowband noise that is focused on specific frequencies. Switchingregulatorscan be particularlytroublesomeinapplicationswhere electromagneticinterference(EMI)is a concern.Switchingregulatorsoperateon a cycle-by-cyclebasistotransferpower toan output.Inmost cases, the frequencyof operationiseitherfixedor regulated,based on the outputload.Thismethod of conversion createslargecomponents of noiseat the frequencyof operation(fundamental)and multiplesof the operating frequency(harmonics). The spread spectrum architecturevariesthe switchingfrequencyby approximately±10% of the nominal switchingfrequency,therebysignificantlyreducesthepeak radiatedand conductingnoiseon boththeinputand outputsupplies.The frequencyditheringscheme ismodulatedwitha triangleprofileand a modulationfrequency fm . Figure41.Spectrum ofa Frequency Modulated Figure42.Spread Bands ofHarmonics in Sin.Wave withSinusoidalVariationinTime Modulated Square Signals(1) Figure41 and Figure42 show thataftermodulationthesidebandharmonicisattenuatedwhen compared tothe non-modulatedharmonic,and when theharmonicenergyisspreadintoa certainfrequencyband.The higherthe modulationindex(mf)thelargertheattenuation. (1) With: fc isthecarrierfrequency(i.e.nominalswitchingfrequency) fm isthemodulatingfrequency(approx.0.016*fc) δ isthemodulationratio(approx0.1) (2) (1) Spectrumillustrationsand formulae(Figure41 and Figure42)copyrightIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 47,NO.3,AUGUST 2005.See REFERENCES Sectionforfullcitation.

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/c40 /c41 /c40 /c41m c mB = 2 1 + m = 2 + /c166/c180 /c166 /c180 /c180 /c68 /c166 /c166 TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 The maximum switchingfrequencyislimitedby theprocessand by theparametermodulationratio(δ),together withfm ,which isthebandwidthoftheside-bandharmonicsaround thecarrierfrequencyfc.The bandwidthofa frequencymodulatedwaveform isapproximatelygivenby theCarson’s ruleand can be summarized as: (3) fm < RBW: The receiverisnot ableto distinguishindividualside-bandharmonics;so,severalharmonicsare added intheinputfilterand themeasured valueishigherthanexpectedintheoreticalcalculations. fm > RBW: The receiverisabletoproperlymeasure each individualside-bandharmonicseparately,so thatthe measurements match thetheoreticalcalculations. SOFT START The TPS8267x has an internalsoft-startcircuitthatlimitsthe in-rushcurrentduringstart-up.Thiscircuitlimits inputvoltagedropwhen a batteryora high-impedancepower sourceisconnectedtotheinputoftheMicroSiP™ DC/DC converter. The soft-startsystem progressivelyincreasesthe switchingon-timefrom a minimum pulse-widthof 35ns as a functionoftheoutputvoltage.Thismode ofoperationcontinuesforapproximately100μs aftertheenable.Ifthe outputvoltagedoes notreachitstargetvaluewithinthesoft-starttime,thesoft-starttransitionstoa second mode ofoperation. Ifthe outputvoltagerisesabove approximately0.5V,the converterincreasesthe inputcurrentlimitand thus enablesthepower supplytocome up properly.The start-uptimemainlydepends on thecapacitancepresentat theoutputnode and theloadcurrent. ENABLE The TPS8267x devicestartsoperationwhen EN isset high and startsup withthe softstartas previously described.Forproperoperation,theEN pinmust be terminatedand must notbe leftfloating. PullingtheEN pinlow forcesthedeviceintoshutdown.Inthismode, allinternalcircuitsare turnedoffand the VIN currentreducestothedeviceleakagecurrent,whichistypicallya few hundrednanoamps. The TPS8267x devicecan activelydischargethe outputcapacitorwhen itturnsoff.The integrateddischarge resistorhas a typicalresistanceof100 Ω.The requiredtimetoramp down theoutputvoltagedepends on the loadcurrentand thecapacitancepresentattheoutputnode. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com

APPLICATION INFORMATION

Because of the pulsatinginputcurrentnatureof the buck converter,a low ESR inputcapacitorisrequiredto preventlargevoltagetransientsthatcan cause misbehaviorofthedeviceor interferenceinothercircuitsinthe system. For most applications,the inputcapacitorthatis integratedintothe TPS8267x should be sufficient.Ifthe applicationexhibitsa noisyor erraticswitchingfrequency,experimentwithadditionalinputceramiccapacitance tofinda remedy. The TPS8267x uses a tinyceramicinputcapacitor.When a ceramiccapacitoriscombined withtraceor cable inductance,such as froma walladapter,a loadstepattheoutputcan induceringingattheVIN pin.Thisringing can coupletotheoutputand be mistakenas loopinstabilityorcan even damage thepart.Inthiscircumstance, additional"bulk"capacitance,such as electrolyticor tantalum,should be placed between the inputof the converterand the power sourceleadto reduce ringingthatcan occurbetween the inductanceof the power sourceleadsand C I. OUTPUT CAPACITOR SELECTION The advanced,fast-response,voltagemode, controlscheme oftheTPS8267x allowstheuse ofa tinyceramic outputcapacitor(CO ).Formost applications,theoutputcapacitorintegratedintheTPS8267x issufficient. At nominalloadcurrent,thedeviceoperatesinPWM mode; theoveralloutputvoltagerippleisthesum ofthe voltagestepthatiscaused by the outputcapacitorESL and the ripplecurrentthatflowsthroughthe output capacitorimpedance.At lightloads,the outputcapacitorlimitsthe outputripplevoltageand providesholdup duringlargeloadtransitions. The TPS8267x isdesignedas a Point-Of-Load(POL) regulator,to operatestand-alonewithoutrequiringany additionalcapacitance.Addinga 2.2μF ceramicoutputcapacitor(X7R orX5R dielectric)generallyworks froma converterstabilitypointofview,butdoes notnecessarilyhelptominimizetheoutputripplevoltage. For bestoperation(i.e.optimum efficiencyovertheentireloadcurrentrange,properPFM/PWM autotransition), theTPS8267xSIP requiresa minimum outputripplevoltageinPFM mode. The typicaloutputvoltagerippleisca. 1% of the nominaloutputvoltageVO . The PFM pulsesare timecontrolledresultingina PFM outputvoltage rippleand PFM frequencythatdepends (firstorder)on the capacitanceseen at the MicroSiPTM DC/DC converter'soutput. Inapplicationsrequiringadditionaloutputbypass capacitorslocatedclosetotheload,careshouldbe takento ensure properoperation.Ifthe converterexhibitsmarginalstabilityor erraticswitchingfrequency,experiment withadditionallowvalueseriesresistance(e.g.50 to100m Ω)intheoutputpathtofinda remedy. Because thedamping factorintheoutputpathisdirectlyrelatedtoseveralresistiveparameters(e.g.inductor DCR, power-stagerDS(on), PWB DC resistance,loadswitchesrDS(on) … ) thatare temperaturedependant,the convertersmalland largesignalbehaviormust be checked overtheinputvoltagerange,loadcurrentrangeand temperaturerange. The easiestsanitytestistoevaluate,directlyattheconverter’s output,thefollowingaspects:

  • PFM/PWM efficiency
  • PFM/PWM and forcedPWM loadtransientresponse Duringtherecoverytimefroma loadtransient,theoutputvoltagecan be monitoredforsettlingtime,overshootor ringingthathelpsjudgetheconverter’s stability.Withoutany ringing,theloophas usuallymore than45° ofphase margin.

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Copper Trace ThicknessSolder Mask Thickness M0200-01 TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 www.ti.com SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 LAYOUT CONSIDERATION Inmaking thepad sizefortheSiP LGA balls,itisrecommended thatthelayoutuse non-solder-maskdefined (NSMD) land.With thismethod, the soldermask openingismade largerthan the desiredlandarea,and the openingsizeisdefinedby thecopperpad width.Figure43 shows theappropriatediametersfora MicroSiPTM layout. Figure43. Recommended Land PatternImage and Dimensions SOLDER PAD SOLDER MASK (5) COPPER STENCIL (6) COPPER PAD STENCIL THICKNESSDEFINITIONS (1)(2)(3)(4) OPENING THICKNESS OPENING (1) Circuittracesfromnon-solder-maskdefinedPWB landsshouldbe 75μm to100μm wideintheexposed areainsidethesoldermask opening.Widertracewidthsreducedevicestandoffand affectreliability. (2) Bestreliabilityresultsareachievedwhen thePWB laminateglasstransitiontemperatureisabove theoperatingtherangeofthe intendedapplication. (3) Recommend solderpasteisType 3 orType 4. (4) Fora PWB usinga Ni/Ausurfacefinish,thegoldthicknessshouldbe lessthan0.5mm toavoida reductioninthermalfatigue performance. (5) Soldermask thicknessshouldbe lessthan20 μm on topofthecoppercircuitpattern. (6) Forbestsolderstencilperformanceuse lasercutstencilswithelectropolishing.Chemicallyetchedstencilsgiveinferiorsolderpaste volume control. SURFACE MOUNT INFORMATION The TPS8267x MicroSiP™ DC/DC converteruses an open frame constructionthatis designed fora fully automatedassemblyprocessand thatfeaturesa largesurfaceareaforpickand placeoperations.See the"Pick Area"inthepackage drawings. Package heightand weighthave been kepttoa minimum therebytoallowtheMicroSiP™ devicetobe handled similarlytoa 0805 component. See JEDEC/IPC standardJ-STD-20bforreflowrecommendations. Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

E TOP VIEW BOTTOM VIEW YMLA1 LSBCC TPS82670,TPS82671,TPS82672,TPS82673,TPS82674 TPS82675,TPS82676,TPS82677,TPS826711,TPS826745,TPS826765 SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com THERMAL INFORMATION The dietemperatureoftheTPS8267x must be lowerthanthemaximum ratingof125°C, so careshouldbe taken inthelayoutofthecircuittoensuregood heatsinkingoftheTPS8267x. To estimatethejunctiontemperature,approximatethepower dissipationwithintheTPS8267x by applyingthe typicalefficiencystatedinthisdatasheettothedesiredoutputpower;or,by takinga power measurement ifyou have an actualTPS8267x deviceand TPS82671EVM evaluationmodule.Then calculatetheinternaltemperature riseof the TPS8267x above the surfaceof the printedcircuitboard by multiplyingthe TPS8267x power dissipationby thethermalresistance. The actualthermalresistanceoftheTPS8267x totheprintedcircuitboard depends on thelayoutofthecircuit board,butthethermalresistancegivenintheThermalInformationTablecan be used as a guide. Threebasicapproachesforenhancingthermalperformancearelistedbelow:

  • Improvethepower dissipationcapabilityofthePCB design.
  • Improvethethermalcouplingofthecomponent tothePCB.
  • Introduceairflowintothesystem. PACKAGE SUMMARY SIP PACKAGE Code:
  • CC — Customer Code (device/voltagespecific)
  • YML — Y:Year,M: Month,L:Lottracecode
  • LSB — L:Lottracecode,S:Sitecode,B:Board locator MicroSiPTM DC/DC MODULE PACKAGE DIMENSIONS The TPS8267x deviceisavailableinan 8-bump ballgridarray(BGA) package.The package dimensionsare:
  • D = 2.30±0.05mm
  • E = 2.90±0.05mm REFERENCES "EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques",in IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4,NO. 3,AUGUST 2005,pp 569-576 by Josep Balcells,AlfonsoSantolaria,AntonioOrlandi,DavidGonz ález,JavierGago.

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REVISION HISTORY

Note:Page numbers ofcurrentversionmay differformpreviousversions. Changes from Original(October2010)toRevisionA Page Changes from RevisionA (April2011)toRevisionB Page Changes from RevisionB (August 2011)toRevisionC Page Changes from RevisionC (November 2011)toRevisionD Page Changes from RevisionD (April2012)toRevisionE Page Changes from RevisionE (November 2012)toRevisionF Page Copyright© 2010–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLinks:TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826745 TPS826765

www.ti.com 24-Jan-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples TPS82670SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 YK TXI670 TPS82670SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YK TXI670 TPS826711SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YW TXI671 TPS826711SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YW TXI671 TPS82671SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RA TXI671 TPS82671SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RA TXI671 TPS82672SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 WD TXI672 TPS82672SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 WD TXI672 TPS82673SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YL TXI673 TPS82673SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YL TXI673 TPS826745SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 TPS826745SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 TPS82675SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RB TXI675 TPS82675SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RB TXI675 TPS826765SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 AN TXI676 TPS826765SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 AN TXI676 TPS82676SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 TU TXI676

www.ti.com 24-Jan-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples TPS82676SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 TU TXI676 TPS82677SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 SK TXI677 TPS82677SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 SK TXI677 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. 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