TPS1191RB-2-TR STANLEY | Alldatasheet
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SYM. PART NAME MATAL. QTY. ① Photo Transistor Si 1 ② Encapsulant Epoxy Resin 1 ③ Substrate Glass Fabrics 1Outline Dimensions Recommended Pad Unit ：mm Weight ：6.6mg Tolerance：±0.1 Unit：mm Collector Polarity Mark Emitter 2017/10/9 Page 2
(Ta=25℃) (Ta=25℃) VCEO＝10V ICEO MAX. 0.1 μA MIN. 0.7 TYP. 1.0 MAX. 2.4 VCE=5V λp TYP. 900 nm Ic=0,5mA, ☆Ee=10mW/c㎡ VCE(Sat) TYP. 0.1 V Rise time tr TYP. 1.8 μs Fall time ｔｆ TYP. 2.6 μs Longitudinal direction TYP. 110 deg. Lateral direction TYP. 120 deg. Response time Peak sensitivity wavelength Collector-emitter saturation voltage ☆☆VCE＝10V Ic=2mA,Rl=100Ω Angle of sensitivity ⊿θ Unit Iｃ mAVCE=5V ☆Ee=5mW/c㎡ Item Dark current Photo current CharacteristicsSymbolConditions Power dissipation Pc 75 mW Collector-emitter voltage VCEO 30 V Emitter-collector voltage VECO 5 V Collector current IC 20 ｍA Operating temperature Topr -30～+85 ℃ Storage temperature Tstg -40～+100 ℃ UnitItem Symbol Absolute Maximum Ratings ☆ Tungsten filament lamp (color temperature: 2865K) is used. ☆☆ Circuit for measuring response time Absolute Maximum Ratings Electro-Optical Characteristics Specifications 2017/10/9 Page 3
(Ta=25℃) MIN. MAX. B 0.7 1.4 C 1.2 2.4 Ranks Ic(mA) Conditions VCE=5V Ee=5mW/c㎡ Ta=25℃ Radiant Intensity rank of shipped device might be any rank of above 2 ranks(B,C). Specifications Radiant Intensity Rank 2017/10/9 Page 4
Condition : Ta = 25℃ VCE＝5V Spectral Distribution Condition : Ta = 25℃ VCE＝5V Wavelength: (nm) Irradiance vs. Relative photo current Condition : VCE＝５V Irradiance ：Ee（mW/c㎡） Collector-emitter voltage vs. Photo current Condition : Ta=25℃ Collector-emitter voltage VCE(V) Relative radiant intensity: (%) Standard: Ee=5mW/c㎡ Standard tungsten (2,856K) lamp used. Standard tungsten (2,856K) lamp used. Relative photo current: Photo current : Ic(mA) Technical Data Relative radiant intensity: (%) Spatial Distribution Example 2017/10/9 Page 5
Ambient temperature vs. Power dissipation Ambient Temperature : Ta(℃) Collector dissipation: (mV) Ambient temperature - Relative photo current Condition VCE＝５V Ambient Temperature : Ta(℃) Ambient temperature -Dark current Condition : VCEO＝10V Ambient Temperature : Ta(℃) Dark current: (μA) relative photo current Technical Data 2017/10/9 Page 6
【Recommended Reflow Soldering Condition.】 40sec MAX. 150℃～180℃ +1.5～+5℃/s 260℃ MAX. -1.5～-5℃/s 90 ～120sec （Pre-heating） (Soldering） 230℃ MAX. Peak Temperature 1. Reflow Soldering ※ Above temperature profile for the reflow soldering is listed as the temperature of the resin surface of light receiving device. ※ The reflow soldering process should be done up to twice(2 times Max). When second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of device. The second soldering process should not be done until devices have returned to room temperature (by nature-cooling) after first soldering process. ※ Temperature fluctuation to device at pre-heat process shall be minimized. (6℃ MAX.) 3. Manual Soldering (Soldering iron) 4. Other Caution ① During the actual soldering process, make sure that the soldering iron never touch the device (especially the resin part). ② When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV) setting resin with heat shall be recommended. 《The curing condition, Temperature:150℃Max./Time:120sec.Max.》 ③ Please avoid any mechanical stress or any excess vibration after soldering ( when they are not at room temperature) . Soldering condition Recommended Manual Soldering Condition Temperature of Iron Tip 350℃MAX. Soldering Duration, Time 3sec.Max.,1 time 2. Dip soldering Not recommended for this product. 【Soldering Precaution】 2017/10/9 Page 7
④ When device need to repair, please choose any of the 3 methods below. Any mechanical stress or any excess vibration should be avoided no matter which method is used. a) Replace with new device b) Repair immediately after soldering To avoid moisture absorption repair should be finished within 3 hours after soldering under following conditions. Repair should be done only once. Temperature: +5∼+30℃ Humidity:70% MAX. Please note that device should be left at room temperature for natural cooling after soldering. Rapid cooling should be avoided. c) Repair over 3 hours after soldering Baking should be done first before repair. Repair should be done only once under following conditions. Temperature:+60±5℃ 23h MIN. 48h MAX. Soldering condition 2017/10/9 Page 8
Apply correct amount of solder paste to soldering pad to prevent device from getting out of position. (See the diagram below)Especially, please take special care not to let solder paste infiltrate into the insert hole of the light receiving device. ※The proper solder paste thickness is 200 ~ 300μ by stencil printing method . 2~3mg for 1 place by dispense method. However, stencil printing is recommended for its precision paste amount and apply position. (Dash line: recommended soldering pad) 【Mounting】 During mounting process, make sure the pick up nozzle will not bend the device. (Impact force under 4.9N is recommended.) Electrical discharge prevention is recommended in a dry operating environment. Even though the tape use antistatic material , there is still possibility that product stick to the taping material depending on the electric charge amount. Following precautions is recommended. 1) Environment: Electrical potential under 100V by humidity control 2) Peeling speed of tape: 10mm/s or less 3) Others: The use of static eliminator such as ion flow. 【Solder paste】 Recommended mask shape (dispense method) 2017/10/9 Page 9
- Cleaning 2. Warrant period 3. Handling after opened Handling Precaution ① Some chemicals, including Freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. Please review the reference chart below for cleaning. ② The effect of ultrasonic cleaning on the device varies on factors such as the oscillator output, size of PCB and device mounting method. So It is strongly recommended to confirm the practical condition before cleaning. ③ Freon substitute detergent may cause discoloration, cloud or crack on the device surface. So prior confirmation on the practical condition is strongly recommended. ④ In case of water-washing, ensure to use pure water(not city water), and after the washing, immediately apply forced drying to remove the moisture completely from device. ※ Dipping time: 3 minutes MAX. (at room temp.) ※ In case of pure water , please refer to section ④ below. Within 6 months under the following conditions. ・un-opened, +5 ～ +30℃ / 70 % MAX. ① If any device should remain unused temporary or in process, please put it back into moisture -proof packaging , reseal the package and store it under the following conditions to prevent moisture absorption. ② Unpacked devices should be stored under the following conditions. Soldering must be finished within 72h whether they have been restored in moisture-proof bag or not. ③ Should 72h pass after packaging being opened ,or should the desiccant (silica gel) change color ( Blue →Pink), please perform baking before use under the following conditions. ・+60±5℃, 23h MIN. 48h MAX. Freon substitute detergent ・Clean through – 750H ・Pine alpha ST-100S 2017/10/9 Page 10 Cleaning agents Recommended / Not recommended Isopropyl alcohol Recommended Ethyl alcohol Recommended Pure water Recommended Trichloroethylene x Not recommended Chlorothene x Not recommended Acetone x Not recommended Thinner x Not recommended
【Moisture-proof Packaging Specification】 Fastener for re-storage after opening bag Customer's opening position Product Label Heat Sealing position (after product being put in) (Desiccant with indicator for moisture level is enclosed.) A Packaging Specifications SYM. PART NAME MATERIAL REMARKS ① Moisture-proof bag with Aluminum layer PET+Al+PE with ESD protection 2017/10/9 Page 11
【Packing box】 ( RoHS・ELV Compliant ) Note1:The above measure is all the reference value. Note2:Shipping box is selected out of the above table by shipping quantity. Packaging Specifications Box TYPE Outline dimension L × W × H (mm) Capacity of the box Type A 280 × 265 × 45 3 reels Type B 310 × 235 × 265 15 reels Type C 440 × 310 × 265 30 reels Type A Material / box ： Cardboard C5BF Type B,C Material / box ： Cardboard K5AF Partition ： Cardboard K5BF B No. PART NAME MATERIAL REMARKS ② Packing Box Corrugated Cardboard without ESD protection Page : 12 2017/10/9
【Label Specification】 ( acc.to JIS-X0503(Code-39)) Product Label A. Parts number B. Bar-code for parts number C. Parts code (In-house identification code for each parts number) D. Packed parts quantity E. Bar-Code for packed parts quantity F. Lot number & Rank (16 digits) G. Bar-Code for Lot number & Rank Opto Device Label A. Customer Name B. Parts Type C. Parts Code D. Parts Number E. Packed Parts Quantity F. Carton Number G. Shipping Date H. Bar-Code for In-house identification Number <Remark> Bar-code font : acc.to Code-39(JIX0503) Packaging Specifications B A 2017/10/9 Page 13
Lot Number Notational System ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ① - 1digit ： Production Location (Mark identify alphabet) ② - 1digit ： Production Year (Last digit of production Year 2009→9,2010→0,2011→1,･･･) ③ - 2digits ： Production Month (Jan. to Sep. ,should be 01,02,03,･････) ④ - 2digits ： Production Date ⑤ - 3digits ： Serial Number ⑥ - 2digits ： Tape and Reel following Number ⑦ - 2digits ： Luminous Intensity Rank. (If luminous intensity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑧ - 2digits ： Chromaticity Rank (If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑨ - 1digit ： Option Rank (Stanley normally print "-" to indicate) 2017/10/9 Page 14
Taping and Reel Specifications (acc.to JIS-C0806-3） 【Appearance】 Items Specifications Remarks Leader area Cover-tape Cover-tape shall be longer than 400mm without carrier-tape The end of cover-tape shall be held with adhesive tape. Carrier-tape Empty pocket shall be more than 25 pieces. Please refer to the above figures for Taping & reel orientation. Trailer area Empty pocket shall be more than 40 pieces. The end of taping shall be inserted into a slit of the hub. 2017/10/9 Page 15
Taping and Reel Specifications (acc.to ; JIS-C0806-03） 【Qty. per Reel】 【Mechanical strength】 【 Packaging box】 Name of Stanley Electric Co., Ltd., parts number and quantity shall be stated on the surface of box or bag. Note: 3,000parts/reel Cover-tape adhesive strength shall be 0.1 ～1.0N ( The angle between carrier-tape and cover-tape shall be 165 ~ 180 deg. ) Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. Reversed-orientation, Up-side down placing, side placing and out of spec. parts mix shall not be held. 2017/10/9 Page 16
Taping and Reel Specifications (acc.to ; JIS-C0806-03） 【Orientation of device on tape】 【Taping Dimensions】 【Reel Dimensions】 2017/10/9 Page 17
Correspondence to ELV ・ RoHS instruction This product is in compliance with RoHS・ELV . Prohibition substance and it's criteria value of RoHS・ELV are as follows. ・RoHS instruction …… Refer to following (1)～(6). ・ELV instruction ………. Refer to following (1)～(4). Substance Group Name Criteria Value (1) Lead and its compounds 1,000ppm Max (2) Cadmium and its compounds 100ppm Max (3) Mercury and its compounds 1,000ppm Max (4) Hexavalent chromium 1,000ppm Max (5) PBB 1,000ppm Max (6) PBDE 1,000ppm Max 2017/10/9 Page 18
Reliability Testing Result Test Item Standard Test Condition Duration Failure Endurance Operating Test EIAJ ED- 4701/100(101) Ta=25℃ PC=75mW 1,000h 0/15 Humidity Resistance Operating Test EIAJ ED- 4701/100(102) Ta=60℃ RH=90% VCE=5V 1,000h 0/15 High Temperature Operating Test EIAJ ED- 4701/100(105) Ta=85℃ VCE=5V 1,000h 0/15 Low Temperature Operating Test EIAJ ED- 4701/100(103) Ta=-30℃ VCE=5V 1,000h 0/15 Heat Cycle Test EIAJ ED- 4701/200(201) Storage Temperature min.value（30min) ～Ta=Storage Temperature max.value（30min) 5cycles 0/15 High Temperature Shelf Test EIAJ ED- 4701/200(202) Ta=Storage Temperature max.value 1,000h Low Temperature Shelf Test EIAJ ED- 4701/400(403) Ta=Storage Temperature min.value 1,000h Reflow Resistance Test EIAJ ED- 4701/300(301) Preheating ： 150～180℃ 120sec MAX. / Soldering ： 230℃,40Sec MAX. Peak 260℃MAX 2 times 0/15 1. Reliability Testing Result 2. Failure Criteria 2017/10/9 Page 19 Conditions: Each Reliability Test shall be implemented after baking (24Hr at 60℃) and reflow process ( 2 times). Reflow process shall be done after moisture absorption for 72h at 30℃,70% Items Symbols Conditions Failure criteria Photo Current IC EE Value of each product Irradiance of Photo Current VCE Value of each product Collector-emitter Voltage of Photo Current Testing Max. Value ≧Initial Value x 1.2 Testing Min. Value ＜ Initial Value x 0.8 Dark Current ICEO VCEO Value of each product Collector-emitter Voltage of Dark Current Testing Max. Value ≧ Spec. Max. Value x 2.5 External Appearance - - Occurrence of notable decoloration, deformation and cracking
Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2017/10/9 Page : A-20