TPS1105WA-TR

TPS1105WA-TR STANLEY | Alldatasheet

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・Industrial equipment : Light curtains, sensor for security equipment, photoelectric sensor ・Consumer equipment : Remote controller, disk detectors (CD/DVD/Blu-ray) etc. 2018.10.8

Unit :mm Weight :7.81mg Tolerance :±0.1 Outline Dimensions Recommended Pad Unit :mm Page : 2 NO. PART NAME MATERIAL QTY. ① Photo transistor Si 1 ② Mold resin Epox y resin 1 ③ Substrate Glass fabrics 1 PCB 2018.10.8

λp ※2 VCE = 10V, Ic = 2mA, RL = 100Ω VCollector-Emitter Saturation Voltage VCE(Sat) Ic = 0.5mA, ※1 Ee = 10mW/cm2 - mA nm 850 ITEM SYMBOL Dark Current μA MIN. VCE = 5V, ※1 Ee = 5mW/cm2 TYP. MAX. -ICEO 0.1 (Ta=25℃) VCEO = 10V CONDITIONS UNIT 11.0 μｓ Ic 4.8Photocurrent Peak Wavelength 0.1 - ※1 Color temperature of light source : Use 2,856Kelvin tungsten filament lamp 2.6Fall Time Rise Time 19.0 --- ※2 Response time test circuit 【 Electro-Optical Characteristics 】 μｓtr - 1.8 - tf Specifications Page : 3 VVECO Collector-Emitter Voltage VCEO 12 V Power Dissipation Pc 75 (Ta=25℃) Emitter-Collector Voltage 20 mA ITEM SYMBOL MAXIMUM RATINGS UNIT mW 【 Absolute Maximum Ratings 】 Collector Current Ic Operating Temperature Topr -30 ～ +85 ℃ Storage Temperature Tstg -40 ～ +100 ℃ VCE=5V Ee=5mW/cm2 Ta=25℃ 4.8 MIN. C MAX.Rank 8.4 【 Sorting for Photo current 】 D 16.8 9.6 Photo Current Ic（ｍA) Conditions Photo Transistors shall be sorted out into the following ranks.2018.10.8

-100 -50 0 50 100 -30 -60 -90 Wavelength vs. Relative Sensitivity Condition: VCE=5V, Ta = 25℃ Wavelength: (nm) Spatial Distribution Condition: VCE = 5V, Ta = 25℃ Relative Photocurrent : (%) Technical Data Page : 4 Relative Sensitivity 0 50 100 50 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 400 500 600 700 800 900 1,000 1,100 y x x direction / y direction : same shape 2018.10.8

Page : 5 Soldering condition 【Soldering Precaution】 (acc.to:EIAJ-4701/300) Page : 5 2018.10.8 1. Heat stress during soldering will influence the reliability of Photo detectors, however that effect will vary on heating method. Also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount device). 2. Photo detector parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. Please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials. 3. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin surface. Temperature distribution varies on heating method, PCB material, other components in the assembly, and mounting density . Please do not repeat the heating process in Reflow process more than twice. Note 1 Temperature Profile for the reflow should be set to the surface temperature of resin which is on the top of Photo detector. This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of Photo detector. The second soldering process should not be done until Photo detectors have returned to room temperature (by nature-cooling) after first soldering process. 【Recommended reflow soldering condition】 40sec MAX. 150℃ to 180℃ +1.5 to +5℃/s 260℃ MAX. -1.5 to -5℃/s 90℃ to 120sec （Pre-heating） (Soldering） 230℃ Peak temperature

Page : 6 Soldering Condition Page : 6 2018.10.8 4. If soldering manually, Stanley recommends using a soldering iron equipped with temperature control. During the actual soldering process, make sure that the soldering iron never touches the Photo detector itself, and avoid the Photo detector's electrode heating temperature reaching above the heating temperature of the solder pad. All repairs must be performed only once in the same spot, and please avoid reusing components. 5. In soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. Also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV) setting resin with heat shall be recommended. 《The curing condition, Temperature:150℃Max./Time:120sec.Max.》 7. The products cannot be used for hand soldering and dipping (Through the Wave) soldering. 8. Isopropyl alcohol is recommended for cleaning. Some chemicals, including Freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. Please review the reference chart below for cleaning. If water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. Cleaning agents Recommended / Not recommended Isopropyl alcohol  Recommended Ethyl alcohol  Recommended Pure water  Recommended Trichloroethylene x Not recommended Chlorothene x Not recommended Acetone x Not recommended Thinner x Not recommended 【Recommended Manual Soldering Condition】 Temperature of Iron Tip 350℃MAX. Soldering Duration, Time 3sec.Max.,1 time

【 Other Precautions 】 Page : 7 2018.10.8 1. Stanley LED products have semiconductor characteristics and are designed to ensure high reliability. However, the performance may vary depending on usage conditions. 2. Absolute Maximum Ratings are set to prevent our products from failing due to excess stress( temperature, current, voltage, etc.). Usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum rating s simultaneously. 3. In order to ensure high reliability from our products, variable factors that arise in actual usage conditions should be taken it to account for designing. ( Derating of TYP., MAX Forward Voltage, etc.) 4. Please insert Straight Protective Resistors into the circuit in order to stabilize LED operation and to prevent the device from igniting due to excess current. 5. Please check the actual performance in the assembly because the Specification Sheets are described for our device only. 6. The products are designed to perform without failure in the recommended usage conditions. However, please take the necessary precautions to prevent fire, injury, and other damages from these unexpected failures. 7. The products are manufactured to be used for ordinary electronic equipment. Please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 8. The formal specification sheets shall be valid only by exchange of documents signed by both parties.

This product is baked (moisture removal) before packaging, and is shipped in moisture -proof packaging (as shown below) to minimize moisture absorption during transportation and storage. However, with regard to storing the products, Stanley recommends the use of dry-box under the following conditions is recommended. Moisture -proof bag as the packaging is made of anti-static material but packaging box is not. The package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is 【maximum 72h】. If the device needs to be soldered twice, both soldering must be completed within the 168h. If any components should remain after their use, please seal the package and store them under the conditions described in the 【 Recommended Storage Condition 】. This product must be required to perform baking process (moisture removal) for at least 23h,not exceed for 48h, at 60+±5 degrees Celsius if following conditions apply. 1. In the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2. In the case of time is passed for 72h after the package is opened once. Baking process should be performed after LED having been taken out of the package. Baking may be performed in the tape-reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. Please handle only once it has returned to room temperature. Provided that, baking process shall be 2 times MAX. 【Time elapsed after Package Opening.】 In the case of the package unopened , 6 months under 【 Recommended Storage Condition 】. Please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. 【Recommended Storage Condition / Products Warranty Period 】 Temperature +5～30℃ Humidity Under 70% Page : 8 2018.10.8

Baking LED under recommended condition Product Mounting Unused-product remained Return to moisture-proof package and seal Finished Reopen the moisture-proof package Flow chart：Package Opening to Mounting Stored under recommended condition Moisture-proof package first time opening Allowable leaving time exceeded (*) Discoloration of silica gel Packaging Specification 【Moisture-proof Packaging Specification】 Fastener for re-storage after opening bag Customer's opening position Product Label (Desiccant with indicator for moisture level is enclosed.) A NO. PART NAME MATELRIAL REMARKS ① Moisture-proof bag with Aluminum layer PET+Al+PE with ESD protection 【Flow Chart-package Opening to Mounting】 Heat Sealing position (after product being put in) Allowable leaving time means the maximum allowable leaving time after opening package, which depends on each LED type. The allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. When judging if the allowable leaving time has exceeded or not, please subtract the soldering time. The allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. Page : 9 2018.10.8

B 【 Packing box 】 (RoHS2・ELV Compliant) The above measure is all the reference value. Box for shipment is selected out of the above table, according to the shipping quantity. Packaging Specifications Type A Material / box ： Cardboard C5BF Type B,C Material / box ： Cardboard K5AF Partition ： Cardboard K5AF Box TYPE Outline dimension L × W × H (mm) Capacity of the box Type A 280 × 265 × 45 3 reels Type B 310 × 235 × 265 15 reels Type C 440 × 310 × 265 30 reels Page : 10 No. PART NAME MATELRIAL REMARKS ② Packing Box Corrugated Cardboard without ESD protection2018.10.8

【Label Specification】 ( acc.to JIS-X0503(Code-39) ) Product label A. Parts number B. Bar-code for parts number C. Parts code (In-house identification code for each parts number) D. Packed parts quantity E. Bar-Code for packed parts quantity F. Lot number & Rank (refer to Lot Number Notational System for details ) G. Bar-Code for Lot number & Rank Opto device label A. Customer Name B. Parts Type C. Parts Code D. Parts Number E. Packed Parts Quantity F. Carton Number G. Shipping Date H. Bar-Code for In-house identification Number <Remarks> Bar-code font : acc.to Code-39(JIS-X0503) Packaging Specifications B A Page : 11 2018.10.8

Taping and Reel Specifications (acc.to JIS-C0806-03) 【Appearance】 Items Specifications Remarks Leader area Cover-tape Cover-tape shall be longer than 400mm without carrier-tape The end of cover-tape shall be held with adhesive tape. Carrier-tape Empty pocket shall be more than 25 pieces. Please refer to the above figure for Taping & reel orientation . Trailer area Empty pocket shall be more than 40 pieces. The end of taping shall be inserted into a slit of the hub. Page : 12 Note "-TR" means Emitter side of LEDs should be placed on the sprocket-hole side. 2018.10.8

Taping and Reel Specifications (acc.to JIS-C0806-03) 2,000parts/reel Cover-tape adhesive strength shall be 0.1 ～1.0N ( An angle between carrier-tape and cover-tape shall be170 deg. ) Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 25mm. Reversed-orientation, Up-side down placing, side placing and out of spec. parts mix shall not be held . 【Qty. per Reel】 【Mechanical strength】 【Others】 Page : 13 2018.10.8

【Taping Dimensions】 【Reel Dimensions】 Taping and Reel Specifications (acc.to JIS-C0806-03) Unit :mm Page : 14 Center hole Center hole 9±0.3 11.4±0.1 NO. PART NAME REMARKS Carrier-tape Cover-tape Conductive Grade Anti-Static Grade Anti-Static GradeCarrier-reel 2018.10.8

Lot Number Notational System ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ Page : 15 ① - 1digit ： Production Location (Mark identify alphabet) ② - 1digit ： Production Year (Last digit of production Year 2020→0, 2021→1, 2022→2, 2023→3 ･･･) ③ - 2digits ： Production Month (Jan. to Sep. ,should be 01,02,03 ･･･) ④ - 2digits ： Production Date ⑤ - 3digits ： Serial Number ⑥ - 2digits ： Tape and Reel following Number ⑦ - 2digits ： Photocurrent Rank. (If Photocurrent rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑧ - 2digits ： Chromaticity Rank (If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑨ - 1digit ： Option Rank (Stanley normally print "-" to indicate) 2018.10.8

Page : 16 Correspondence to RoHS2 / ELV instruction No. ThresholdSubstances 0.1% (1,000ppm) Lead and its compounds Mercury and its compounds 0.1% (1,000ppm) 0.01% (100ppm) Cadmium and its compounds This product is in compliance with RoHS2 / ELV. 0.1% (1,000ppm) DEHP : Bis (2-ethylhexyl) phthalate 0.1% (1,000ppm) BBP : Butyl benzyl phthalate 0.1% (1,000ppm) DBP : Dibutyl phthalate 0.1% (1,000ppm) DIBP : Diisobutyl phthalate Prohibition substance and it's criteria value of RoHS2 / ELV are as follows. ・RoHS2 instruction … Refer to following 1 to 10. ・ELV instruction … Refer to following 1 to 4. 0.1% (1,000ppm) Hexavalent chromium compounds 0.1% (1,000ppm) PBB : Polybrominated Biphenyls 0.1% (1,000ppm) PBDE : Polybrominated Biphenyl Ethers 2018.10.8

Reliability Testing Condition Failure Criteria Page : 17 Heat Cycle Test Storage Temp. Min, value（30min.） to Storage Temp. Max,value（30min.） 5cycle Reflow Resistance Test Moisture Soak ：Ta=30℃, RH=70%, 72h Preheating ： 150 to 180℃ 120sec. Max. Soldering ： 230 to 260℃ 40sec. Max. High Temperature Operational Test Ta=85℃, 1,000h , VCE=5V Low Temperature Operational Test Ta=-30℃, 1,000h , VCE=5V Low Temperature Shelf Test Ta=Storage Temp. Min., value t=1,000h High Temperature Shelf Test Ta=Storage Temp. Max., value t=1,000h Endurance Operational Test Ta=25℃, 1,000h , Pc=75mW Humidity-Resistance Operational Test Ta=60℃, RH=90% , 1,000h , VCE=5V Test Item Test Condition VCE = 5V , Ee = 5mw/c㎡Ic Test Condition Failure Criteria Initial value × 0.7 < Ic < Initial value × 1.3 VCE = 5VID Notable, discoloration, deformation and cracking ID < 0.1μA Symbol Photo current Dark current － － Item Cosmetic appearance2018.10.8

Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com/en Page : 18 2018.10.8