TPQH201610TF-R TRANSKO | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 3

Technical content

Rev 1: 09 -18 -2018 Power Inductor SMD (2.0 X 1.6 X 1.0 mm)

FEATURES

  • Miniature Package • Low DCR
  • Low Profile • Halogen Free RoHS compliant SPECIFICATION TPQH201610TF -R24M -R 0.24 ±20% 0.030 4.10 3.90 TPQH201610TF -R47M -R 0.47 ±20% 0.042 3.10 3.00 TPQH201610TF -1R0M -R 1.0 ±20% 0.079 2.10 2.00 TPQH201610TF -1R5M -R 1.5 ±20% 0.140 1.90 1.65 TPQH201610TF -2R2M -R 2.2 ±20% 0.180 1.45 1.50 TPQH201610TF -4R7M -R 4.7 ±20% 0.400 0.90 0.90 TPQH201610TF -100M -R 10 ±20% 0.600 0.70 0.70 DC Resistance Rated DC Current (A) Typ. Part No. Inductance (µH) (Ω ±20%)
  • Measurement frequency of Inductance value : 1MHz, 1V
  • Test Equipment: CH1062A; CH1320 A B C D E G H L mm DIMENSION SOLDER PATTERN SCHEMATIC

Rev 1: 09 -18 -2018 REEL DIMENSIONS (2000 pcs per reel) mm W1 8.00 ±0.1 I 1.75 ±0.1 F 3.50 ±0.1 P0 4.00 ±0.1 G 2.00 ±0.1 P1 4.00 ±0.1 C 3.60 ±0.1 t0 0.25 ±0.05 D 3.28 ±0.1 H 1.28 ±0.1 mm W 178 ±1.5 D 21.0 ±0.8 C 13.0 ±0.5 T1 10.0 +1.5/ -0 N 50.0 Min T2 12.50 ±0.4 E 2.00±0.5

Rev 1: 09 -18 -2018 1.Operating temperature range -40 TO + 105°C (Includes temperature when the coil is heated) 2. External appearance On visual inspection, the coil has no external defects. 3. Terminal strength After soldering. Between copper plate and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 5.0N 60 sec. 4. Insulating resistance Over 100MΩ at 100V D.C. between coil and core. 5. Dielectric strength No dielectric breakdown at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics Inductance coefficient (0~2,000)x10 -6 /°C ( -25~+80°C) inductance deviation within ±5.0%, after 96 hours 7. Humidity characteristics (Moisture Resistance) Inductance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2°C and 1 hour drying under normal condition. 8. Vibration resistance Inductance deviation within ±5%, after vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P -P amplitudes. 9. Shock resistance Inductance deviation within ±5%, after being dropped once with 981m/s 2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260°C, 10 seconds (See recommend reflow) 11. Storage environment Temperature: 0°C~35°C; -40°C ~ 105°C (after PCB) Humidity Range: 50% ~ 70% RH 12. Use components within 12 months. If 12 months or more have elapsed, check solderability before use. LEAD -FREE HEAT ENDURANCE TEST LEAD -FREE RECOMMENDED REFLOW RELIABILITY TEST Transko Electronics, Inc reserves the right to make changes to the product (s), service (s), and specification (s) described herein without notice. See “Terms of Sale” for details on our website.