TPL9202 TI | Alldatasheet
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BO_OUTZ OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 GND BO V IN 5VOUT SCLK NCS MOSI RST RDELAY EN1 NC PWP P ACKAGE (TOP VIEW) NC – No□internal□connection DESCRIPTION/ORDERING INFORMATION TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 Electrical Applicances Eight Low-Side Drivers With Internal Clamp for Inductive Loads and Current Limiting for Air Conditioning Units Self Protection Ranges Seven Outputs are Rated at 150 mA and Dishwashers Controlled Through Serial Interface Refrigerators One Output Rated at 150 mA and Microwaves Controlled Through Serial Interface and Washing Machines Dedicated Enable Pin General-Purpose Interface Circuit Allowing 5-V Regulated Power Supply With Microcontroller Interface to Relays, Electric Motors, LEDs, and Buzzers 200-mA Load Capability at V IN Max of V Internal Voltage Supervisory for Regulated Output Serial Communications for Control of Eight Low-Side Drivers Enable/Disable Input for OUT1 5-V or 3.3-V I/O Tolerant for Interface to Microcontroller Programmable Power On-Reset Delay Before RST Asserted High, Once V Is Within Specification ms Typ) Programmable Deglitch Timer Before RST Is Asserted Low (40 µ s Typ) Programmable Brown-Out Feature Thermal Shutoff for Self Protection The power supply provides regulated 5-V output to power the system microcontroller and drive eight low-side switches. The brown-out detection output (BO_OUTZ) warns the system if there is a temporary drop in the supply voltage, so the system can prevent potentially hazardous situations. A serial communications interface controls the eight low-side outputs; each output has an internal snubber circuit to absorb the inductive load at turn OFF. Alternatively, the system can use a fly-back diode to V IN to help recirculate the energy in an inductive load at turn OFF. ORDERING INFORMATION T A PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING Reel of 2000 TPL9202PWPR C to 125 C PowerPAD PWP IC9202 Tube of TPL9202PWP Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 PINOUT CONFIGURATION NO. NAME I/O
DESCRIPTION
BO_OUTZ O Brown-out indicator OUT1 O Low-side output OUT2 O Low-side output OUT3 O Low-side output OUT4 O Low-side output OUT5 O Low-side output OUT6 O Low-side output OUT7 O Low-side output OUT8 O Low-side output GND I Ground NC No connection EN1 I Enable/disable for OUT1 R DELAY O Power-up reset delay (1) RST I/O Power-on reset output (open drain) MOSI I Serial data input NCS I Chip select SCLK I Serial clock for data synchronization OUT O Regulated output V IN I Unregulated input voltage source BO I Brown-out input threshold setting (1) Terminal can be used as an input or an output. Submit Documentation Feedback
www.ti.com OUT1□at 150□mA OUT2□at□150□mA OUT3□at□150□mA OUT4□at□150□mA OUT5□at□150□mA OUT6□at□150□mA OUT7□at□150□mA OUT8□at□150□mA Gate□Drive and□Control Voltage Supervisor Comp Bandgap Ref Vref Vref 1.2□V Comp Gate□Control for□Outputs 1□Through□8 EN1 NCS SCLK MOSI 7–18□V VIN RDELAY 5□V 5□kΩ RST RDELAY BO_OUTZ OUT8 OUT8 OUT7 OUT7 OUT6 OUT6 OUT5 OUT5 OUT4 OUT4 OUT3 OUT3 OUT2 OUT2 OUT1 OUT1 EN1 NCS SCLK MOSI VIN BO Serial Register Parallel Register Enables OUT1 GND GND 10□V (2□W) Ω Iconst PMOS Optional,□dependent on□heat-management implementation (see□Note A) 5VOUT RST 100□kΩ 100□kΩ 100□kΩ 50□kΩ Recommended 6□V BO_OUTZ TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 FUNCTIONAL BLOCK DIAGRAM The resistor and Zener diode are required if there is insufficient thermal management allocation. Submit Documentation Feedback
www.ti.com DETAILED V IN and the regulated output is within V over the operating conditions. The open-drain power-on reset RST pin remains low until the regulator exceeds the set threshold, and the timer value set by the capacitor on the reset delay DELAY pin expires. If both of these conditions are satisfied, RST is asserted high. This signifies to the microcontroller that serial communications can be initiated to the TPL9202. The serial communications is an 8-bit format, with data transfer synchronized using a serial clock from the microcontroller. A single register controls all the outputs (one bit per output). The default value is zero (OFF). If an output requires pulse width modulation (PWM) function, the register must be updated at a rate faster than the desired PWM frequency. OUT1 can be controlled by serial input from the microcontroller or with the dedicated enable (EN1) pin. If EN1 is pulled low or left open, the serial input through the shift register controls OUT1. If EN1 is pulled high, OUT1 always is turned on, and the serial input for OUT1 is ignored. The brown-out (BO) input is a resistor divided from the input supply and is used to determine if the supply voltage drops to undesired levels. If the input drops below the programmed value, BO_OUTZ is pulled low, and all outputs are disabled. Once the input supply line returns to the minimum desired level, the outputs are enabled to the previous programmed states. If RST is asserted, all outputs are turned OFF internally, and the input register is reset to all zeroes. The microcontroller must write to the register to turn the outputs ON again. Submit Documentation Feedback
www.ti.com Absolute Maximum Ratings (1) Dissipation Ratings Recommended Operating Conditions TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 MIN MAX UNIT V IN V I(unreg) Unregulated input voltage (2) (3) V BO EN1, MOSI, SCLK, and NCS V I(logic) Logic input voltage (2) (3) V RST and R DELAY V O Low-side output voltage OUT1 OUT8 16.5 V OUTn ON and shorted to V IN I LIMIT Output current limit (4) 350 mA with low impedance θ JA Thermal impedance, junction to ambient (5) C/W θ JC Thermal impedance, junction to top of package (5) C/W θ JP Thermal impedance, junction to thermal pad (5) 1.4 C/W P D Continuous power dissipation (6) 3.7 W ESD Electrostatic discharge (7) kV T A Operating ambient temperature range 125 C T stg Storage temperature range 125 C T lead Lead temperature Soldering, s 260 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. (3) Absolute negative voltage on these pins must not go below 0.5 (4) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed ms. (5) The thermal data is based on using 1-oz copper trace with JEDEC 51-5 test board for PWP. (6) The data is based on ambient temperature of C max. (7) The Human Body Model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. T A C DERATING FACTOR T A 125 C PACKAGE POWER RATING ABOVE T A C POWER RATING PWP 3787 mW 30.3 mW/ C 757 mW MIN MAX UNIT V IN V I(unreg) Unregulated input voltage V BO (as seen by external resistor network) V I(logic) Logic input voltage EN1, RST and R DELAY MOSI, SCLK, and NCS 5.25 V T A Operating ambient temperature 125 C Submit Documentation Feedback
www.ti.com Electrical Characteristics TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 T A C to 125 V IN V to V (unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT Supply Voltage and Current V IN (2) Input voltage V Enable low, OUT1 OUT8 OFF I IN Input supply current mA Enable high, OUT1 OUT8 ON Logic Inputs (MOSI, NCS, SCLK, and EN1) V IL Logic input low level I IL 100 µ A 0.8 V V IH Logic input high level I IL 100 µ A 2.4 V Reset RST V OL Logic level output I OL 1.6 mA 0.4 V V OH (3) Logic level output 5-k Ω pullup to V CC V CC 0.8 V V H Disabling reset threshold 5-V regulator ramps up 4.25 4.5 V V L Enabling reset threshold 5-V regulator ramps down 3.3 3.75 V V HYS Threshold hysteresis 0.12 0.5 V Reset Delay DELAY I OUT Output current µ A t DW Reset delay timer C nF ms t UP Reset capacitor to low level C nF µ s Output (OUT1 OUT8) V OL Output ON I OUTn 150 mA 0.4 0.7 V I OH Output leakage V OH Max of 16.5 V µ A Regulator Output (5V OUT I 5VOUT mA to 200 mA, V IN V to OUT Output supply 4.75 5.25 V C µ F Limit output short circuit I 5Vout V V 200 mA current Brown-Out (BO) Input Threshold for brown-out 1.3 V BOV thes V IN reduced until BO_OUTZ goes low detection Brown-Out Detection Output (BO_OUTZ) V OL Logic level output I OL 100 µ A 0.4 V V OH (3) Logic level output Pullup to V CC V CC 0.8 V Thermal Shutdown T SD Thermal shutdown 150 C T HYS Hysteresis C (1) All typical values are at T A (2) There are external high-frequency noise-suppression capacitors and filter capacitors on V IN (3) V CC is the pullup resistor voltage. Submit Documentation Feedback
www.ti.com Output Control Register TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 MSB LSB IN8 IN7 IN6 IN5 IN4 IN3 IN2 IN1 INn Output OFF INn Output ON To operate the output in PWM mode, the output control register must be updated at a rate twice the desired PWM frequency of the output. Maximum PWM frequency is kHz. The register is updated every 100 µ ENABLE TRUTH TABLE SERIAL INPUT EN1 OUT1 FOR OUT1 Open H On Open L Off L H On L L Off H H On H L On Submit Documentation Feedback
www.ti.com Serial Communications Interface IN1 LSB IN7 IN6 IN5 IN4 IN3 IN2IN8 MSB XXX T1 T5 NCS SCLK MOSI 1 2 3 4 5 6 7 8 TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 The serial communications are an 8-bit format, with data transfer synchronized using a serial clock from the microcontroller (see Figure A single register controls all the outputs. The signal gives the instruction to control the output of TPL9202. The NCS signal enables the SCLK and MOSI data when it is low. After NCS is set to low for T1, synchronization clock and data begin to transmit and, after the 8-bit data has been transmitted, NCS is set high again to disable SCLK and MOSI and to transfer the serial data to the control register. SCLK must be held low when NCS is high. Figure Serial Communications Submit Documentation Feedback
www.ti.com Timing Requirements Reset Delay DELAY TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 T A C to 125 V IN V to V (unless otherwise stated) PARAMETER MIN TYP MAX UNIT f SPI SPI frequency kHz Delay time, NCS falling edge to SCLK rising edge ns Delay time, NCS falling edge to SCLK falling edge ns Pulse duration, SCLK high ns Pulse duration, SCLK low ns Delay time, last SCLK falling edge to NCS rising edge ns Setup time, MOSI valid before SCLK edge ns Hold time, MOSI valid after SCLK edge ns Time between two words for transmitting 170 ns The R DELAY output provides a constant current source to charge an external capacitor to approximately 6.5 The external capacitor is selected to provide a delay time, based on the current equation for a capacitor, I Δ Δ and a 28- µ A typical output current. Therefore, the user should select a 47-nF capacitor to provide a 6-ms delay at 3.55 I Δ Δ µ A C (3.55 V/6 ms) C nF Submit Documentation Feedback
www.ti.com APPLICATION INFORMATION TPL9202 MCU/DSP MOSI SCLK NCS BO_OUTZ RST 5V ±5% at 200 mAOUT EN1 RDELAY Buzzer Driver Relay Driver Relay Driver Relay Driver Relay Driver Fan Driver Fan Driver Fan Driver
8 Outputs
M Cover Switch T emperature Sensor (Optional) Optical Sensor Water-Level Sensor V olume Sensor Keypad Display (LED/LCD/VFD) Controller Regulator POR/SYS TPL9202 ~ ~ LED LED Brown-Out Detect VIN BO BO_OUTZ TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 Figure Typical Application Figure Washing-Machine Application Submit Documentation Feedback
www.ti.com PCB Layout Application Using a Multilayer PCB Package□Thermal□Pad Solder□Pad□(Land□Pattern) Thermal□Via's Package□Outline Power□Pad Package□Solder□Pad Package□Solder□Pad (Bottom□Trace) Thermal□Via Component□Traces Thermal□Isolation Power□Plane□Only 1.5748□mm 0.0 0.071-mm□Board□Base– and□Bottom□Pad 0.5246 0.5606-mm– Power□Plane (1-oz□Cu) 1.0142 1.0502-mm– Ground□Plane (1-oz□Cu) 1.5038 1.5748-mm– Component□Trace (2-oz□Cu) 2□Plane 4□Plane TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 APPLICATION INFORMATION (continued) To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following information is to be used as a guideline only. For further information, see the PowerPAD concept implementation document. In a multilayer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane (see Figure and Figure The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper, etc. (see the PowerPAD Thermally Enhanced Package Technical Brief literature number SLMA002 Figure Package and PCB Land Configuration for a Multilayer PCB Figure Multilayer Board (Side View) Submit Documentation Feedback
www.ti.com Application Using a Single-Layer PCB Use□as□Much□Copper Area as□Possible□for□Heat□Spread Package□Thermal□Pad Package□Outline TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 APPLICATION INFORMATION (continued) In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by a low thermal-impedance attachment method (solder paste or thermal conductive epoxy). With either method, it is advisable to use as many copper traces as possible to dissipate the heat. CAUTION: If the attachment method is not implemented correctly, the functionality of the product cannot be assured. Power-dissipation capability is adversely affected if the device is incorrectly mounted on the circuit board. Figure Layout Recommendations for a Single-Layer PCB Submit Documentation Feedback
www.ti.com Recommended Board Layout SMOC□=□Solder□Mask□Over□Copper SMO□=□Solder□Mask□Opening 3,7□SMO 0,65 0,27□( 20)/c180 1,2□( 20) /c180 0,33□( 8) /c180 5,85 6,5□SMOC 6,92 4,52 3,4□SMOC2,4□SMO TPL9202 8-CHANNEL RELAY DRIVER WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION SLIS124B JUNE 2006 REVISED NOVEMBER 2006 APPLICATION INFORMATION (continued) Figure Recommended Board Layout for PWP Submit Documentation Feedback
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TPL9202PWP ACTIVE HTSSOP PWP 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TPL9202PWPG4 ACTIVE HTSSOP PWP 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TPL9202PWPR ACTIVE HTSSOP PWP 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TPL9202PWPRG4 ACTIVE HTSSOP PWP 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 15-Nov-2006 Addendum-Page 1