TPD7S019_1008 TI1 | Alldatasheet
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www.ti.com SLLSE33 –AUGUST 2010 7-CHANNELINTEGRATEDESDSOLUTIONFORVGAPORT WITHINTEGRATEDLEVELSHIFTERANDMATCHINGIMPEDANCE Check forSamples: TPD7S019 1FEATURES
- 7-ChannelESD ProtectionIncludesESD • Bi-DirectionalLevelShiftingN-Channel FETs Protection,Level-Shifting,Bufferingand Sync ProvidedforDDC_CLK and DDC_DATA Impedance Matching Channels
- Exceeds IEC61000-4-2(Level4)ESD • Flow-Through Single-In-LinePin Mapping ProtectiontoRequirements on theExternal Ensures no AdditionalBoard Layout Burden Pins whilePlacingtheESD ProtectionChip Near theConnector– ±15-kV Human-Body Model (HBM) – ±8-kV IEC 61000-4-2ContactDischarge APPLICATIONS• Very Low Loading Capacitancefrom ESD • VGA and DVI-IPortsin:ProtectionDiodes on VIDEO Lines(2.5pF) – Desktop and Notebook PCs• 5-V DriversforHSYNC and VSYNC Lines – Graphics Cards• IntegratedImpedance Matching Resistorson – Set Top BoxesSync Lines: – TV– TPD7S019-65: 65-Ω Termination – TPD7S019-15: 15-Ω Termination – TPD7S019-55: 55-Ω Termination RSV PACKAGE DBQ PACKAGE (TOP VIEW) (TOP VIEW)
ORDERING INFORMATION
TA PACKAGE (1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING µQFN – RSV Tape and reel TPD7S019-15RSVR PREVIEW TPD7S019-15DBQR PQ19-15 –40°C to85°C SSOP/QSOP – DBQ Tape and reel TPD7S019-55DBQR PQ19-55 TPD7S019-65DBQR PQ19-65 (1) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. (2) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
VCC_VIDEO VSYNC VCC_DDC BYP GND VIDEO1 DDC_IN1 DDC_IN2 DDC_OUT1 DDC_OUT2 VIDEO2 VIDEO3 SYNC_IN1 SYNC_OUT1 SYNC_IN2 SYNC_OUT2 RT RT TPD7S019 SLLSE33 –AUGUST 2010 www.ti.com TERMINATION AT PITCH LENGTH (TYP) WIDTH (TYP) HEIGHT (MAX) ORDERABLE PART NO.SYNC 15-Ω TPD7S019-15DBQR 55-Ω 0.635mm 4.9mm 6.0mm 1.75mm TPD7S019-55DBQR 65-Ω TPD7S019-65DBQR 15-Ω 0.4mm 2.6mm 1.8mm 0.55mm TPD7S019-15RSVR DESCRIPTION/ORDERING INFORMATION The TPD7S019 is an integrated7-channelESD solutionforthe VGA or DVI-Iportconnector.This device integratesESD protectionforallsignals,levelshiftingfortheDDC signalsand bufferingfortheSYNC signals. Three individualsupplylinescontrolthe power railsof the VIDEO, DDC and SYNC channelsto facilitate interfacingwithlowvoltagevideocontrollerICsinmixed supply-voltageenvironments. Two non-invertingdriversprovidebufferingforthe HSYNC and VSYNC signalsfrom the videocontrollerIC (SYNC1, SYNC2). These buffersacceptTTL inputlevelsand convertthem toCMOS outputlevelsthatswing between Ground and VCC_SYNC, which istypically5 V. Additionally,each driverhas a seriestermination resistor(RT)connectedtotheSYNC_OUT pin,eliminatingtheexternalterminationresistorstypicallyrequiredfor theHSYNC and VSYNC linesofthevideocable.At theSYNC outputtheTPD7S019 offers65-Ω,55-Ω,or15-Ω seriesterminationresistoroptiontomatch differenttransmissionlineimpedances. Two N-channelMOSFETs providethelevelshiftingfunctionrequiredwhen theDDC controllerisoperatedata lowersupplyvoltagethanthemonitor.The gateterminalsfortheMOSFETs (VCC_DDC) shouldbe connectedto thesupplyrail(typically3.3V) thatsuppliespower tothetransceiversoftheDDC controller. The TPD7S019 confirmsthe IEC61000-4-2(Level4) system levelESD protectionand ±15KV HBM ESD protection.Thisdeviceisofferedinspace-saving16-pinDBQ and 16-pinRSV packages. The TPD7S019 ischaracterizedforoperationoverambientairtemperatureof–40°C to85°C. CIRCUIT DIAGRAM
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www.ti.com SLLSE33 –AUGUST 2010 TERMINAL FUNCTIONS TERMINAL NO. TYPE DESCRIPTION NAME DBQ RSV BYP Bypass pin.Usinga 0.2µF bypasscapacitorwillincreasetheESD robustnessofthe8 6 Power system. DDC_IN1 10 8 DDC signalinput.ConnectstotheVGA controllersideofone ofthesynclines.IDDC_IN2 11 9 DDC_OUT1 9 7 DDC signaloutput.Connectstothevideoconnectorsideofone ofthesynclines.ODDC_OUT2 12 10 GND 6 4 – Ground SYNC_IN1 13 11 Sync signalbufferinput.ConnectstotheVGA controllersideofone ofthesynclines.ISYNC_IN2 15 13 SYNC_OUT1 14 12 Sync signalbufferoutput.Connectstothevideoconnectorsideofone ofthesynclinesOSYNC_OUT2 16 14 VCC_DDC 7 5 Power IsolatedsupplyinputfortheDDC_1 and DDC_2 level-shiftingN-FET gates VCC_SYNC IsolatedsupplyinputfortheSYNC_1 and SYNC_2 levelshiftersand theirassociated1 15 Power ESD protectioncircuits VCC_VIDEO 2 16 Power SupplypinspecificallyfortheVIDEO_1, VIDEO_2 and VIDEO_3 ESD protectioncircuits VIDEO1 3 1 High-speedESD clamp input VIDEO2 4 2 ESD VIDEO3 5 3 ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC_VIDEO , VCC_DDC , Supplyvoltage –0.5 6.0 V VCC_SYNC VIO(VIDEO) IO voltage VIDEOx pins –0.5 VCC_VIDEO V VI(SYNC) Inputvoltage SYNC pins –0.5 VCC_SYNC V VI(DDC) Inputvoltage DDC_INx pins –0.5 6.0 V VO(DDC) Outputvoltage DDC_INx pins –0.5 6.0 V Tstg Storagetemperature –55 125 °C IEC 61000-4-2ContactDischarge VIDEO, DDC_OUT, SYNC_OUT pins ±8 kV HBM ESD VIDEO, DDC_OUT, SYNC_OUT pins ±15 kV VCC, DDC_IN, SYNC_IN, BYP Pins ±2 (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. RECOMMENDED OPERATING CONDITIONS overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC_VIDEO , VCC_DDC , Supplyvoltage 0 5.5 V VCC_SYNC VIO(VIDEO) IO voltage VIDEOx pins 0 VCC_VIDEO V VI(SYNC) Inputvoltage SYNC pins 0 VCC_SYNC V VI(DDC) Inputvoltage DDC_INx pins 0 5.5 V VO(DDC) Outputvoltage DDC_INx Pins 0 5.5 V TA Operatingtemperature –40 85 °C Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TPD7S019
SLLSE33 –AUGUST 2010 www.ti.com
ELECTRICAL CHARACTERISTICS
overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TEST CONDITION MIN TYP MAX UNIT ICC_VIDEO VCC_VIDEO supplycurrent VCC_VIDEO = 5 V,VIDEO inputsatVCC_VIDEO or 1 10 µAGND ICC_DDC VCC_DDC supplycurrent VCC_DDC = 5 V 1 10 µA ICC_SYNC VCC_SYNC supplycurrent VCC_SYNC = 5 V, SYNC inputsatGND or 1 50 VCC_SYNC , µA SYNC outputsunloaded SYNC inputsat3 V; 2.0 mASYNC outputsunloaded IIO_VIDEO VIDEO input/outputpins VIO_VIDEO = 3 V 0.01 1.0 µA IOFF DDC pinpower down leakagecurrent VCC_DDC ≤ 0.4V,VDDC_OUT = 5 V 0.01 1.0 µA VD Diodeforwardvoltageforlowerclamp of ID = 8 mA, lowerclamp diode –0.6 –0.8 –0.95 VVIDEO, DDC, SYNC outputpins R DYN_VIDEO Dynamic resistance(VIDEO pins) I= 1 A 1.0 Ω VIH High-levelSYNC logicinputvoltage VCC_SYNC = 5 V 2.0 V VIL Low-levelSYNC logicinputvoltage VCC_SYNC = 5 V 0.6 V VOH High-levelSYNC logicoutputvoltage IOH = 0 mA, VCC_SYNC = 5 V 4.85 V VOH-15 High-levelSYNC logic TPD7S019-15 IOH = 24 mA, VCC_SYNC = 5 V 2 Voutputvoltage VOL Low-levelSYNC logicoutputvoltage IOH = 0 mA, VCC_SYNC = 5 V 0.15 V VOL-15 Low-levelSYNC logic TPD7S019-15 IOH = 24 mA, VCC_SYNC = 5 V 0.8 Voutputvoltage R T SYNC driveroutput TPD7S019-15 VCC_SYNC = 5 V,SYNC inputsatGND or3 V 15 resistance TPD7S019-55 55 Ω TPD7S019-65 65 C IO_VIDEO IO capacitanceofVIDEO pins VIO = 2.5V 2.5 4 pF tPLH SYNC driverL => H propagationdelay C L = 50 pF;VCC = 5 V,inputtR and tF ≤ 5ns 12 ns tPHL SYNC driverH => L propagationdelay C L = 50 pF;VCC = 5 V,inputtR and tF ≤ 5ns 12 ns tR ,tF SYNC driveroutputrise& falltimes C L = 50 pF;VCC = 5 V,inputtR and tF ≤ 5ns 4 ns VBR VIDEO ESD diodebreak-downvoltage IIO = 1 mA 9 V TypicalCharacteristics Figure1.TPD7S019-xx TLP VID1 toGND, Barth,Trf= 10 ns
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www.ti.com SLLSE33 –AUGUST 2010 TypicalCharacteristics(continued) Figure2.TPD7S019-xx IEC Clamping Waveforms PositiveContact Figure3.TPD7S019-xx IEC Clamping Waveforms NegativeContact Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TPD7S019
SLLSE33 –AUGUST 2010 www.ti.com TypicalCharacteristics(continued) Figure4.Leakage CurrentTrough VIDEO Pins VCC_VIDEO = 5 V Figure5.IOFF (DDC_OUTx) VCC_DDC = 0 V
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APPLICATION INFORMATION
Figure6. TypicalApplicationSchematics withTPD7S019 R P:PullupresistorfortheDDC dataand clocklines.Typicallysystemdesignerselects47 kΩ pullupvalues R T:LineterminationresistorfortheRGB lines.RT isselectedtomatch thetransmissionline.For a single-ended transmissionline,RT can be anywhere from50 Ω to75 Ω dependingon boardtraceimpedance. Some systemsmay requireadditionalfiltersattheSYNC and RGB lines. The TPD7S019 shouldbe placedas closetotheVGA portas possible. The ESD protectionchannelsVIDEO1, VIDEO2, VIDEO3 areidenticalcircuits,theycan be used interchangeably between theR, G, B signals. Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TPD7S019
SLLSE33 –AUGUST 2010 www.ti.com Figure7. SimplifiedLayout withTPD7S019 (OnlyIO LinesareShown)
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www.ti.com 21-Jun-2010 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPD7S019-15DBQR ACTIVE SSOP/QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TPD7S019-55DBQR PREVIEW SSOP/QSOP DBQ 16 2500 TBD Call TI Call TI Samples Not Available TPD7S019-65DBQR PREVIEW SSOP/QSOP DBQ 16 2500 TBD Call TI Call TI Samples Not Available (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TPD7S019-15DBQR SSOP/ QSOP PACKAGE MATERIALS INFORMATION www.ti.com 14-Oct-2010 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD7S019-15DBQR SSOP/QSOP DBQ 16 2500 340.5 338.1 20.6 PACKAGE MATERIALS INFORMATION www.ti.com 14-Oct-2010 Pack Materials-Page 2
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