TPD4F003_1 TI | Alldatasheet
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Ch1_In 161 Ch2_In 152 Ch3_In 143 Ch4_In 134 Ch5_In 125 Ch6_In 116 Ch1_Out Ch2_Out Ch3_Out Ch4_Out Ch5_Out Ch6_Out Ch7_In 107 Ch8_In GND Ch7_Out Ch8_Out TPD8F003 3.3 mm x 1.35 mm x 0.75 mm (0.4-mm pitch) Ch1_In 121 Ch2_In 112 Ch3_In 103 Ch4_In 94 Ch5_In 85 Ch6_In 76 Ch1_Out Ch2_Out Ch3_Out Ch4_Out Ch5_Out Ch6_Out GND TPD6F003 2.5 mm x 1.35 mm x 0.75 mm (0.4-mm pitch) Ch1_In 81 Ch2_In 72 Ch3_In 63 Ch4_In 54 Ch1_Out Ch2_Out Ch3_Out Ch4_Out GND TPD4F003 1.7 mm x 1.35 mm x 0.75 mm (0.4-mm pitch) TPD4F003,TPD6F003,TPD8F003 www.ti.com SLLS907D –AUGUST 2008–REVISED JANUARY 2010 FOUR-,SIX-,ANDEIGHT-CHANNELEMIFILTERSWITHINTEGRATEDESDPROTECTION Check forSamples: TPD4F003 ,TPD6F003 ,TPD8F003 1FEATURES
- Four-,Six-,and Eight-ChannelEMI Filteringfor • Space-Saving DQD Packages and Data Ports Flow-Through Pin Mapping ProvideOptimum FilterPerformance• –3 dB Bandwidth 200 MHz
- Greaterthan 25dB attenuationat1 GHz APPLICATIONS• Robust ESD ProtectionExceeds IEC61000-4-2 • LCD DisplayInterfaces(Level4) • CellPhones– ±15-kV Human-Body Model (HBM) • SVGA Video Connections– ±12-kV IEC 61000-4-2ContactDischarge • PersonalDigitalAssistants(PDAs) – ±20-kV IEC 61000-4-2Air-GapDischarge
- Pi-Style(C-R-C)FilterConfiguration (R = 100 Ω,C TOTAL = 17 pF)
- Low 10-nA Leakage Current DQD PACKAGE (TOP VIEW) DESCRIPTION/ORDERING INFORMATION The TPD4F003, TPD6F003, and TPD8F003 are 4-,6-,and 8-channelEMI filtersinspace-saving0.4-mm pitch DQD packages.The low-passfilterarraysreduceEMI emissionsand providesystemlevelESD protection. Because ofitssmallpackage and easy-to-usepinassignments,theTPDxF003 filtersarsuitablefora wide array of applicationssuch as mobilehandsets,PDAs, videoconsoles,notebookcomputers,etc.In particular,these filtersare idealforEMI filteringand protectingdata linesfrom ESD at the LCD display,keypad,and memory interfaces. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2008–2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
100 Ω GND Ch_In Ch_Out 8.5 pF 8.5 pF TPD4F003,TPD6F003,TPD8F003 SLLS907D –AUGUST 2008–REVISED JANUARY 2010 www.ti.com The TPDxF003 are highlyintegrateddevicedesignedto suppressEMI/RFI noiseinallsystems subjectedto electromagneticinterferences.These filterseriesincludean ESD protectioncircuitrywhich preventsdamage to theapplicationwhen subjectedtoESD stressfarexceedingIEC 61000-4-2(Level4). The TPDxF003 isspecifiedfor–40°C to85°C operation.
ORDERING INFORMATION
ORDERABLETA PACKAGE (1)(2) PACKAGE DIMENSION TOP-SIDE MARKINGPART NUMBER Length= 1.7mm, Width= 1.35mm, TPD4F003DQDR 5RSPitch= 0.4mm, Height= 0.75mm Length= 3.3mm, Width= 1.35mm, TPD8F003DQDR 5USPitch= 0.4mm, Height= 0.75mm (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. EQUIVALENT SCHEMATIC REPRESENTATION ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VIO IO toGND 6 V Tstg Storagetemperaturerange –65 150 °C TJ Junctiontemperature 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedintheoperationalsectionsofthe specificationsisnotimplied.Exposuretoabsolutemaximum ratedconditionsforextendedperiodsmay affectdevicereliability.
ELECTRICAL CHARACTERISTICS
TA = –40°C to85°C (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT VBR DC breakdown voltage IIO = 10 mA 6 V R Resistance 85 100 115 Ω C Capacitance(C1 orC2) VIO = 2.5V 8.5 pF IIO Channelleakagecurrent VIO = 3.3V 10 nA fC Cut-offfrequency ZSOURCE = 50 Ω,ZLOAD = 50 Ω 200 MHz (1) TypicalvaluesareatTA = 25°C.
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ProductFolderLink(s):TPD4F003 TPD6F003 TPD8F003
-40 -20 100 120 140 0 25 50 75 100 125 150 175 200 Time (ns ) Amplitude (V) Ch_In Ch_Out -40 -20 100 120 140 0 25 50 75 100 125 150 175 200 Time (ns ) Amplitude (V) Ch_In Ch_Out -140 -120 -100 -80 -60 -40 -20 0 25 50 75 100 125 150 175 200 Time (ns) Amplitude (V) Ch_In Ch_Out -140 -120 -100 -80 -60 -40 -20 0 25 50 75 100 125 150 175 200 Time (ns) Amplitude (V) Ch_In Ch_Out TPD4F003,TPD6F003,TPD8F003 www.ti.com SLLS907D –AUGUST 2008–REVISED JANUARY 2010 ESD PROTECTION TYP UNIT Human-Body Model (HBM) ±15 kV IEC 61000-4-2ContactDischarge ±12 kV IEC 61000-4-2Air-GapDischarge ±20 kV TYPICAL CHARACTERISTCS IEC Clamping Waveforms (clamp voltagemeasured both atCh_Out and Ch_In) Figure1.With 8 kV ContactESD StressatCh_Out Figure2.With 12 kV ContactESD StressatCh_Out Figure3.With -8kV ContactESD StressatCh_Out Figure4.With -12kV ContactESD StressatCh_Out Copyright© 2008–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TPD4F003 TPD6F003 TPD8F003
-50 -45 -40 -35 -30 -25 -20 -15 -10 Fre quen cy (Hz) Insertion Loss (dB) TPD8F00 3 TPD6 F003 TPD4F00 3 TPD8F0 03 3 dB drop/Bias of 0.0V -3d B = 1 98M Hz Pea k/Freq /Db = 2 .57/ 45 GHz/dB TPD6F0 03 3 dB drop/Bias of 0.0V -3d B = 1 97M Hz Pea k/Freq /Db = 2 .30/ 47 GHz/dB TPD4F0 03 3 dB drop/Bias of 0.0V -3d B = 1 97M Hz Pea k/Freq /Db = 2 .25/ 45 GHz/dB -0.0 01 -0.00 08 -0.00 06 -0.00 04 -0.00 02 0.00 02 0.00 04 0.00 06 0.00 08 0.0 01 -4 -2 0 2 4 6 8 Vo lta ge (V) C urre nt (mA) -110 -105 -100 -95 -90 -85 -80 -75 -70 -65 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 Frequency (Hz) Crosstalk (dB) Adjacent Signal Pair Farthest Signal Pair -110 -105 -100 -95 -90 -85 -80 -75 -70 -65 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 Frequency (Hz) Crosstalk (dB) Adjacent Signal Pair Farthest Signal Pair -110 -105 -100 -95 -90 -85 -80 -75 -70 -65 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 Frequency (Hz) Crosstalk (dB) Adjacent Signal pair Farthes t Signal Pair TPD4F003,TPD6F003,TPD8F003 SLLS907D –AUGUST 2008–REVISED JANUARY 2010 www.ti.com Figure5.Frequency Response Figure6.DC Voltage-CurrentSweep Across Input/OutputPins Channel-to-ChannelCrosstalk Figure7.TPD4F003 Figure8.TPD6F003 Figure9.TPD8F003
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ProductFolderLink(s):TPD4F003 TPD6F003 TPD8F003
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TPD4F003DQDR ACTIVE WSON DQD 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD6F003DQDR ACTIVE WSON DQD 12 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD8F003DQDR ACTIVE WSON DQD 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2010 Addendum-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4F003DQDR WSON DQD 8 3000 202.0 201.0 28.0 TPD6F003DQDR WSON DQD 12 3000 202.0 201.0 28.0 TPD8F003DQDR WSON DQD 16 3000 358.0 335.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 Pack Materials-Page 2
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