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(TOP VIEW) IO4IO1 GND IO2 IO3 DESCRIPTION/ORDERING INFORMATION Absolute Maximum Ratings Thermal Resistance TPD4E002 QUAD LOW-CAPACITANCE ARRAY WITH 15-kV ESD PROTECTION SLVS615B JULY 2006 REVISED MARCH 2007 Where Transient Overvoltage Protection in Four Unidirectional Voltage Suppression ESD-Sensitive Equipment is Required, Such Diodes for use in ESD Protection as: I/O Breakdown Voltage, V BR 6.1 V Min Computers Low I/O Capacitance (11 pF at Printers Low I/O Leakage Current <100 nA Communication Systems and Cellular No Power Supply Routing is Required since Phones there is no V DD Pin Video Equipment Very Small Printed Circuit Board (PCB) Area <2.6 mm ESD Protection Exceeds High ESD Protection Level High Integration 15-kV Human Body Model (HBM) Suitable for High-Density Boards 15-kV IEC 61000-4-2 Contact Discharge The TPD4E002 is a monolithic array designed to protect up to four lines against ESD transients. Monolithic circuit design allows superior matching between the channels and reduced crosstalk. This device is ideal for required. ORDERING INFORMATION T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING C to 125 C 1.6 1.6 DRL Reel of 4000 TPD4E002DRLR 28S (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com MIN MAX UNIT Human Body Model (HBM) V PP ESD discharge kV IEC 61000-4-2 Contact Discharge T J Junction temperature 125 C T stg Storage temperature range 150 C T op Operating temperature range 125 C PARAMETER VALUE UNIT R θ JA Junction to ambient on printed circuit on recommended pad layout 220 C/W Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2006 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com Electrical Characteristics TYPICAL CHARACTERISTICS Capacitance (pF) 8.0 –40 0 25 70 85 125 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Temperature (ºC) Capacitance (pF) 9.0 1 2 3 4 5 6 7 8 9 10 9.5 10.0 10.5 11.0 11.5 12.0 Frequency (Mhz) TPD4E002 QUAD LOW-CAPACITANCE ARRAY WITH 15-kV ESD PROTECTION SLVS615B JULY 2006 REVISED MARCH 2007 T amb C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V BR I/O Breakdown voltage I R mA 6.1 7.2 V I RM I/O Leakage current V RM V 0.1 µ A α T Voltage temperature coefficient C C I/O Capacitance per line pF R d Dynamic resistance (1) Ω (1) R d is measured under reverse breakdown condition with inrush current in the range 1Amps using pulse technique Figure I/O Capacitance vs Temperature Figure I/O Capacitance vs Frequency (Typical Values) Submit Documentation Feedback

www.ti.com I (mA) IN 110.0 –110.0 100.0 –100.0 90.0 –90.0 80.0 –80.0 70.0 –70.0 60.0 –60.0 50.0 –50.0 40.0 –40.0 30.0 –30.0 20.0 –20.0 10.0 –10.0 0.00 V (V)IN Voltage (20 V/div) Time (50 ns/div) TPD4E002 QUAD LOW-CAPACITANCE ARRAY WITH 15-kV ESD PROTECTION SLVS615B JULY 2006 REVISED MARCH 2007 TYPICAL CHARACTERISTICS (continued) Figure Diode Current Across I/O Voltage (Typical Values) Figure ESD Clamp Voltage At I/O Pins: IEC6100-4-2 kV Contact Discharge Submit Documentation Feedback

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TPD4E002DRLR ACTIVE SOT-553 DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD4E002DRLRG4 ACTIVE SOT-553 DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 17-May-2007 Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 7-May-2007 Pack Materials-Page 1

Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TPD4E002DRLR DRL 5 HNT 180 9 1.78 1.78 0.69 4 8 Q3 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) TPD4E002DRLR DRL 5 HNT 201.0 192.0 26.0 PACKAGE MATERIALS INFORMATION www.ti.com 7-May-2007 Pack Materials-Page 2

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