TPD2E007_13 TI1 | Alldatasheet
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3 GND
www.ti.com SLVS796E –SEPTEMBER 2008–REVISED AUGUST 2010 2-CHANNELESD-PROTECTIONARRAY FORAC-COUPLED/NEGATIVE-RAILDATAINTERFACES Check forSamples: TPD2E007 1FEATURES YFMG4 PACKAGE 2• ESD ProtectionExceeds IEC61000-4-2 (BOTTOM VIEW) (Level4) – ±15-kV Human-Body Model (HBM) – ±8-kV IEC 61000-4-2ContactDischarge – ±15-kV IEC 61000-4-2Air-GapDischarge
- 4.5-APeak Pulse Current(8/20ms Pulse) 0.8mm × 0.8mm (0.4mm pitch)• 15-pF LinetoGND Capacitance
- Low 50-nA Leakage Current YFMG4 PIN DESCRIPTIONS• 2-ChannelDevice TERMINAL DESCRIPTION• Space-Saving PicoStar™ and DCK Package NAME NO. IO A1,A2 ESD-protectionchannelAPPLICATIONS GND B1,B2 Ground• CellPhones, PDAs
- Audio InterfaceConnections
- Consumer Electronics(DVR, Set-TopBox, TV)
- IndustrialInterface(RS-232,RS-485,RS-422, LVDS) DCK PACKAGE (TOP VIEW) DESCRIPTION/ORDERING INFORMATION Thisdeviceisan application-specificintegratedparts(ASIP)designedto offersystem levelESD solutionsfor wide range of portableand industrialapplications.The back-to-backdiode array allowsAC-coupled or negative-goingdata transmission(audiointerface,LVDS, RS-485, RS-232, etc.)withoutcompromisingsignal integrity.The PicoStar™ package isintendedtobe embedded insidetheprintedcircuitboardwhichsaves board space inportableapplications.Thisdeviceexceeds theIEC61000-4-2(Level4) ESD protectionand suitableto providesystemlevelESD protectionforthevaluableinternalICswhileplacedneartheconnector. The TPD2E007 isofferedina 4-bump PicoStar™ and 3-pinDCK packages.The PicoStar™ package (YFMG4), withonly0.15mm (Max)package height,isrecommended forultraspace savingapplicationwhere thepackage heightisa key concern.The PicoStar™ package can be used ineitherembedded PCB boardapplicationsorin surfacemount applications.The industrystandardDCK package offersstraightforwardboard layoutoptionin legacydesigns. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2PicoStarisa trademarkofTexas Instruments. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2008–2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SLVS796E –SEPTEMBER 2008–REVISED AUGUST 2010 www.ti.com
ORDERING INFORMATION
TA PACKAGE (1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING 45–40°C to85°C DSLGA – YFM Tape and reel TPD2E007YFMRG4 T –40°C to85°C 3-DCK Tape and reel TPD2E007DCKR 45U (1) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. (2) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. EQUIVALENT SCHEMATIC REPRESENTATION ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VIO –13.5 13.5 V YFM package 270Continuouspower dissipation mW(TA = 70°C) DCK package 218 Operatingtemperaturerange –40 85 °C Tstg Storagetemperaturerange –65 150 °C TJ Junctiontemperature 150 °C Infrared(15s) 220 Bump temperature(soldering) °C Vapor phase (60s) 215 Lead temperature(soldering,10 s) 300 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedintheoperationalsectionsofthe specificationsisnotimplied.Exposuretoabsolutemaximum-ratedconditionsforextendedperiodsmay affectdevicereliability.
ELECTRICAL CHARACTERISTICS
TA = –40°C to85°C (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT VBR Break-downvoltage IIO = 10 mA ±14 V IIO Channelleakagecurrent 20 50 nA R d Dynamic resistance 3.5 Ω C IN Channelinputcapacitance VIO = 2.5V 10 15 pF (1) TypicalvaluesareatVCC = 5 V and TA = 25°C. ESD Protection PARAMETER TYP UNIT HBM ±15 kV IEC 61000-4-2ContactDischarge ±8 kV IEC 61000-4-2Air-GapDischarge ±15 kV
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ProductFolderLink(s):TPD2E007
Time (ns) Amplitude (V) –280 –260 –240 –220 –200 –180 –160 –140 –120 –100 –80 –60 –40 –20 0 20 40 60 80 100 120 140 160 180 200 –40 120 160 200 240 280 0 20 40 60 80 100 120 140 160 180 200 Time (ns) Amplitude (V) –1.50E-01 –1.25E-01 –1.00E-01 –7.50E-02 –5.00E-02 –2.50E-02 0.00E+00 2.50E-02 5.00E-02 7.50E-02 1.00E-01 1.25E-01 1.50E-01 V olts Amps Device 2 Device 1 1.0E-12 2.0E-12 3.0E-12 4.0E-12 5.0E-12 6.0E-12 7.0E-12 8.0E-12 9.0E-12 1.0E-11 1.1E-11 1.2E-11 1.3E-11 1.4E-11 1.5E-11 Device 2 Device 1 Input Voltage (V) Capacitance (F) TPD2E007 www.ti.com SLVS796E –SEPTEMBER 2008–REVISED AUGUST 2010 TYPICAL OPERATING CHARACTERISTICS IEC Clamping Waveforms (20ns/div) Figure1.8-kV Contact Figure2.–8-kV Contact Figure3.Capacitancevs InputVoltageatTA = 27°C Figure4.Diode Breakdown VoltageData atTA = 27°C Copyright© 2008–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TPD2E007
SLVS796E –SEPTEMBER 2008–REVISED AUGUST 2010 www.ti.com
REVISION HISTORY
Changes from RevisionD (October2009)toRevisionE Page
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ProductFolderLink(s):TPD2E007
www.ti.com 30-May-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TPD2E007DCKR ACTIVE SC70 DCK 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 45U TPD2E007YFMR PREVIEW DSLGA YFM 4 TBD Call TI Call TI -40 to 85 TPD2E007YFMRG4 ACTIVE DSLGA YFM 4 3000 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM -40 to 85 45 T TPD2E007YFMTG4 ACTIVE DSLGA YFM 4 250 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM -40 to 85 45 T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
www.ti.com 30-May-2013 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 30-May-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD2E007DCKR SC70 DCK 3 3000 195.0 200.0 45.0 TPD2E007YFMRG4 DSLGA YFM 4 3000 220.0 220.0 35.0 TPD2E007YFMTG4 DSLGA YFM 4 250 220.0 220.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 30-May-2013 Pack Materials-Page 2
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