TPCE275 TEWS | Alldatasheet
Document overview
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Technical content
TPCE275 PCI Express x1, Gen1 XMC Carrier TPCE275-10R
Application Information
The TPCE275 is a standard height PCI Express Revision 1.1 compatible module that provides one slot for a single- width XMC module used to build modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and traffic control. The TPCE 275 is a versatile solution to upgrade well known XMC I/O solutions to the PCI Express signalling standard. The PCI Express x1 link from the host board to the XMC module is enhanced by a PCIe Redriver, allowing safe operation of XMC modules on PCIe mainboards. VPWR is selectable via order option. The TPCE275-x0R variants provide for 12V VPWR and the TPCE275-x1R order options provide 5V VPWR. The TPCE275 supports XMC front panel I/O, and also P14 and P16 rear I/O independently. XMC P14 rear I/O is provided through a VME P2 style connector (IEC 60603-2, Type C). The I/O mapping of P14 complies with VITA -35 (“PMC P4 to VME- P2, Rows A -C mapping”). XMC P16 rear I/O is provided through two 50-pin flat cable connectors mounted in a 2.54mm grid. The PCIe edge card connector provides +12V and +3.3V. The TPCE275-1xR uses the +12V of the PCIe edge card connector to generate all power supply voltages for the XMC slot (+3.3V, VPWR and +12V). According to the PCIe specification, a PCIe x1 card is limited to 6W on the +12V which allows to operate many of the available XMC modules on the TPCE275-1xR. For increased power requirements of an XMC module, the TPCE275-2xR offer a PCIe Graphics Power Connector to supply the +12V for generating all the power supply voltages for the XMC slot providing power of up to 25W. A 10-pin JTAG header is available for XMC module debugging purposes. All five JTAG signals are routed directly to the XMC slot. TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice. All trademarks mentioned are property of their respective owners. Issue 1.0.3 2017-08-31 TEWS TECHNOLOGIES GmbH Am Bahnhof 7 25469 Halstenbek, Germany Phone: +49 (0) 4101 4058 0 Fax: +49 (0) 4101 4058 19 e-mail: info@tews.com www.tews.com
Form Factor: PCI Express x1, Revision 1.1 Board size: approx. 200mm x 111mm One XMC Slot: PCIe Interface: x1, Rev. 1.1 XMC Front Panel I/O XMC P14 I/O connected to VME P2 Style Connector (IEC 60603-2 compatible) XMC P16 I/O connected to two 50-pin flat cable connectors All XMC Power Supplies generated from +12V TPCE275-1xR: +12V from PCIe edge card connector TPCE275-2xR: +12V from PCIe Graphics Power Connector JTAG: 10-pin header with all five JTAG signals routed to XMC connector Operating temperature: 0°C to +70°C MTBF (MIL-HDBK217F/FN2 GB 20°C): TPCE275-10R: 664000h TPCE275-11R: 664000h TPCE275-20R: 637000h TPCE275-21R: 637000h Order Information RoHS Compliant TPCE275-10R 1 Slot XMC Carrier, PCIe x1, VPWR = 12V, 12V from PCIe connector TPCE275-11R 1 Slot XMC Carrier, PCIe x1, VPWR = 5V, 12V from PCIe connector TPCE275-20R 1 Slot XMC Carrier, PCIe x1, VPWR = 12V, 12V from PCIe Graphics connector TPCE275-21R 1 Slot XMC Carrier, PCIe x1, VPWR = 5V, 12V from PCIe Graphics connector For the availability of non-RoHS compliant (leaded solder) products please contact TEWS. Documentation TPCE275-DOC User Manual TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice. All trademarks mentioned are property of their respective owners. Issue 1.0.3 2017-08-31 TEWS TECHNOLOGIES GmbH Am Bahnhof 7 25469 Halstenbek, Germany Phone: +49 (0) 4101 4058 0 Fax: +49 (0) 4101 4058 19 e-mail: info@tews.com www.tews.com