TPAU3D

TPAU3D TSC | Alldatasheet

Document overview

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• PDF pages: 4

Technical content

• Very low profile, typical height of 1.1mm - Excellent high temperature stability - Glass passivated chip junction - Controlled avalanche characteristics - Low leakage current - High forward surge capability - Halogen-free according to IEC 61249-2-21 definition Molding compound, UL flammability classification rating 94V-0 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test SYMBOL UNIT V RRM V IF(AV) A TJ=25°C TJ=125°C TJ=25°C TJ=125°C RθJM (2) RθJA (3) CJ pF TJ °C TSTG °C Document Number: DS_D0000011 Version: A15 TO-277A (SMPC) TPAU3D - TPAU3J Taiwan Semiconductor 3A, 200V - 600V Avalanche High Efficienct Recovery Surface Mount Rectifiers

FEATURES

• Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: TO-277A (SMPC) 0.40 10 70 250 Polarity: Indicated by cathode band Weight: 95 mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) Moisture sensitivity level: level 1, per J-STD-020 Marking code Maximum average forward rectified current 3 PARAMETER Maximum repetitive peak reverse voltage TPAU3D 200 400 600 A VF V °C/W Note 2: Junction to mounted, mounted on FR4 PCB with 16mm x 16mm Cu pad area Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 50 IR Operating junction temperature range Storage temperature range - 55 to +175 - 55 to +175 Typical thermal resistance IF=0.5A, IR=1A, IRR=0.25A Note 4: Measured at 1 MHz and Applied VR=4.0 V ns Typical junction capacitance (4) 60 Maximum reverse recovery time Note 3: Free air, mounted on recommended pad Note 1: Pulse test with PW=300μs, 1% duty cycle trr TPAU3G TPAU3J AU3D AU3G AU3J IAS = 1.0A Typ 1.50 1.88 1.10 1.35 TYP MAX 65 75 Maximum instantaneous forward voltage (1) IF=3A Rated VRMaximum reverse current EASNon-repetitive avalanche energy IAS = 2.5A Max μA 30 mJ TYP MAX

PART NO. Note 2: Whole series with green compound (TA=25°C unless otherwise noted) Document Number: DS_D0000011 Version: A15 6,000/ 13" Plastic reel RATINGS AND CHARACTERISTICS CURVES TPAU3D - TPAU3J Taiwan Semiconductor

ORDERING INFORMATION

DESCRIPTION

(Note 1, 2) S1 G SMPC 1,500/ 7" Plastic reel S2 SMPC TPAU3D S1G TPAU3D S1 G Green compound Note 1: "x" defines voltage from 200V (TPAU3D) to 600V (TPAU3J) EXAMPLE PREFERRED PART NO. PART NO. PACKING CODE 0 25 50 75 100 125 150 175 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (oC) FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE RESISTER OR INDUCTIVE LOAD WITH HEATSINK 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD PEAK SURGE CURRENT 8.3ms Single Half Sine Wave 0.01 0.1 100 0 2 04 06 08 0 1 0 0 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 4 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 2 TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS Pulse Width=300μs 1% Duty Cycle TJ=25°C TJ=125°C

A 5.650 5.750 0.222 0.226 B 6.350 6.650 0.250 0.262 C 4.550 4.650 0.179 0.183 D 3.540 3.840 0.139 0.151 E 4.235 4.535 0.167 0.179 F 1.850 2.150 0.073 0.085 G 3.170 3.470 0.125 0.137 H 1.043 1.343 0.041 0.053 I 1.000 1.300 0.039 0.051 J 1.930 2.230 0.076 0.088 K 0.175 0.325 0.007 0.013 L 1.000 1.200 0.039 0.047 Symbol A B C D E F P/N = Marking Code YW = Date Code F = Factory Code Document Number: DS_D0000011 Version: A15 TPAU3D - TPAU3J Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) TO-277A (SMPC) 0.050 Unit (inch) SUGGESTED PAD LAYOUT Unit (mm) Unit (inch) 4.80 0.189 6.80 0.268 1.04 0.041 MARKING DIAGRAM 4.72 0.186 1.40 0.055 1.27 100 1000 0.1 1 10 100 JUNCTION CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D0000011 Version: A15 TPAU3D - TPAU3J Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,