TPAR3D TSC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • Very low profile, typical height of 1.1mm - Excellent high temperature stability - Glass passivated chip junction - Controlled avalanche characteristics - Low leakage current - High forward surge capability - Halogen-free according to IEC 61249-2-21 Molding compound: UL flammability classification rating 94V-0 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test SYMBOL UNIT V RRM V IF(AV) A TJ=25°C TJ=125°C TJ=25°C TJ=125°C RθJM (2) RθJA (3) CJ pF TJ °C TSTG °C Version: B1511 30 mJ TYP MAX 95 120 Maximum instantaneous forward voltage (1) IF=3A Rated VRMaximum reverse current EASNon-repetitive avalanche energy IAS = 2.5A Max IAS = 1.0A Typ VF 1.55 600 1.02 1.15 TYP MAX Maximum reverse recovery time Note 3: Free air, mounted on recommended pad Note 1: Pulse test with PW=300μs, 1% duty cycle trr TPAR3G TPAR3J AR3D AR3G AR3J 1.20 - 55 to +175 - 55 to +175 Typical thermal resistance IF=0.5A, IR=1A, IRR=0.25A Note 4: Measured at 1 MHz and Applied VR=4.0 V ns Typical junction capacitance (4) 58 5.1 75 °C/W Note 2: Junction to mounted, mounted on FR4 PCB with 16mm x 16mm Cu pad area Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 60 IR Operating junction temperature range 250 Storage temperature range Polarity: Indicated by cathode band Weight: 95 mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) μA Marking code Maximum average forward rectified current 3 PARAMETER A V Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: TO-277A (SMPC) 0.30 10 Maximum repetitive peak reverse voltage TPAR3D 200 400 TO-277A (SMPC) TPAR3D - TPAR3J Taiwan Semiconductor 3A, 200V - 600V Avalanche Fast Recovery Surface Mount Rectifiers

FEATURES

PART NO. Note 2: Whole series with green compound (TA=25°C unless otherwise noted) Version: B1511 TPAR3D S1G TPAR3D S1 G Green compound Note 1: "x" defines voltage from 200V (TPAR3D) to 600V (TPAR3J) EXAMPLE EXAMPLE PART NO. PART NO. PACKING CODE DESCRIPTION PACKING TPAR3x (Note 1, 2) S1 G SMPC 1,500/ 7" Plastic reel S2 SMPC 6,000/ 13" Plastic reel RATINGS AND CHARACTERISTICS CURVES TPAR3D - TPAR3J Taiwan Semiconductor

ORDERING INFORMATION

0 25 50 75 100 125 150 175 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE Resister or inductive load with heat sink 100 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD PEAK SURGE CURRENT 8.3ms single half sine wave 0.01 0.1 100 0 2 04 06 08 0 1 0 0 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 4 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 2 TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS Pulse width=300μs 1% duty cycle TJ=25°C TJ=125°C

A 5.650 5.750 0.222 0.226 B 6.350 6.650 0.250 0.262 C 4.550 4.650 0.179 0.183 D 3.540 3.840 0.139 0.151 E 4.235 4.535 0.167 0.179 F 1.850 2.150 0.073 0.085 G 3.170 3.470 0.125 0.137 H 1.043 1.343 0.041 0.053 I 1.000 1.300 0.039 0.051 J 1.930 2.230 0.076 0.088 K 0.175 0.325 0.007 0.013 L 1.000 1.200 0.039 0.047 Symbol A B C D E F P/N = Marking Code YW = Date Code F = Factory Code Version: B1511 6.80 0.268 1.04 0.041 MARKING DIAGRAM 4.72 0.186 1.40 0.055 1.27 0.050 Unit (inch) SUGGESTED PAD LAYOUT Unit (mm) Unit (inch) 4.80 0.189 TPAR3D - TPAR3J Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) TO-277A (SMPC) 100 1000 0.1 1 10 100 JUNCTION CAPACITANCE (pF) REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: B1511 TPAR3D - TPAR3J Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,