TPA3100D2RGZRG4

TPA3100D2_17 TI1 | Alldatasheet

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Simplified Application□Circuit TV Audio Processor RINP BSRN BSRP VCLAMPR VCLAMPL PGNDR PGNDL VREG VBYP ROSC BSLN ROUTN LOUTN LOUTP BSLP ROUTP TPA3100D2 LINN RINN LINP MUTE GAIN0 GAIN1 SYNC FAULT PVCCR PVCCL AVCC AGND MSTR/SLV SHUTDOWNShutdown Control Mute□Control Sync□Control Fault□Flag 10□V□to□26□V Gain□Select

1 F/c109

10□nF 100□k/c87

0.22 F/c109

www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 20-WSTEREOCLASS-DAUDIOPOWER AMPLIFIER Check forSamples: TPA3100D2 1FEATURES APPLICATIONS

• Televisions• 20-W/ch intoan 8-Ω Load From a 18-V Supply
• 10-W/ch intoan 8-Ω Load From a 12-V Supply DESCRIPTION• 15-W/ch intoan 4-Ω Load From a 12-V Supply The TPA3100D2 is a 20-W (perchannel)efficient,• Operates from 10 V to26 V Class-Daudiopower amplifierfordrivingbridged-tied• 92% EfficientClass-DOperationEliminates stereospeakers.The TPA3100D2 can drivestereoNeed forHeat Sinks speakersas low as 4 Ω. The highefficiencyof the
• Four Selectable,FixedGain Settings TPA3100D2, 92%, eliminatesthe need for an externalheatsinkwhen playingmusic.• DifferentialInputs The gain of the amplifieris controlledby two gain• Thermal and Short-CircuitProtectionWith selectpins.The gain selectionsare 20, 26, 32,Auto Recovery Feature 36 dB.• Clock Output forSynchronizationWith The outputsare fullyprotectedagainstshortstoMultipleClass-DDevices GND, VCC , and output-to-outputshortswithan auto• SurfaceMount 7 mm × 7 mm, 48-pinQFN recoveryfeatureand monitoroutput.Package
• SurfaceMount 9 mm × 9 mm, 48-pinHTQFP Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2005–2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. ABSOLUTE MAXIMUM RATINGS overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) UNIT VCC Supplyvoltage AVCC, PVCC –0.3V to30 V SHUTDOWN, MUTE –0.3V toVCC + 0.3V VI Inputvoltage GAIN0, GAIN1, RINN, RINP, LINN,LINP,MSTR/ SLV, –0.3V toVREG + 0.5VSYNC Continuoustotalpower dissipation See ThermalInformationTable TA Operatingfree-airtemperaturerange –40°C to85°C TJ Operatingjunctiontemperaturerange(2) –40°C to150°C Tstg Storagetemperaturerange –65°C to150°C R Load Load Resistance 3.2Ω Minimum Human body model (3)(allpins) ±2 kV Electrostaticdischarge Machine model (4)(allpins) ±200 V Charged-devicemodel (5)(allpins) ±500 V (1) Stressesbeyond thoselistedunderabsolutemaximum ratingsmay cause permanentdamage tothedevice.These arestressratings only,and functionaloperationsofthedeviceattheseorany otherconditionsbeyond thoseindicatedunderrecommended operating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) The TPA3100D2 incorporatesan exposed thermalpad on theundersideofthechip.Thisactsas a heatsink,and itmust be connected toa thermallydissipatingplaneforproperpower dissipation.Failuretodo so may resultinthedevicegoingintothermalprotection shutdown.See TITechnicalBriefsSCBA017D and SLUA271 formore informationaboutusingtheQFN thermalpad.See TITechnical BriefsSLMA002 formore informationaboutusingtheHTQFP thermalpad. (3) InaccordancewithJEDEC Standard22,TestMethod A114-B. (4) InaccordancewithJEDEC Standard22,TestMethod A115-A (5) InaccordancewithJEDEC Standard22,TestMethod C101-A THERMAL INFORMATION TPA3100D2 THERMAL METRIC (1)(2) UNITS RGZ (48PINS) PHP (48PINS) qJA Junction-to-ambientthermalresistance 25 28.7 qJCtop Junction-to-case(top)thermalresistance 16.5 19.2 qJB Junction-to-boardthermalresistance 12.8 12.4 °C/W yJT Junction-to-topcharacterizationparameter 0.2 0.2 yJB Junction-to-boardcharacterizationparameter 4.9 6.6 qJCbot Junction-to-case(bottom)thermalresistance 1.0 0.7 (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . (2) Forthermalestimatesofthisdevicebased on PCB copperarea,see theTIPCB ThermalCalculator. RECOMMENDED OPERATING CONDITIONS overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN MAX UNIT VCC Supplyvoltage PVCC, AVCC 10 26 V SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/ SLV,VIH High-levelinputvoltage 2 VSYNC SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/ SLV,VIL Low-levelinputvoltage 0.8 VSYNC

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www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 RECOMMENDED OPERATING CONDITIONS (continued) overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN MAX UNIT SHUTDOWN, VI= VCC ,VCC = 24 V 125 MUTE, VI= VCC ,VCC = 24 V 75IIH High-levelinputcurrent µA GAIN0, GAIN1, MSTR/ SLV, SYNC, VI= VREG, 2VCC = 24 V SHUTDOWN, VI= 0,VCC = 24 V 2 IIL Low-levelinputcurrent µASYNC, MUTE, GAIN0, GAIN1, MSTR/ SLV, VI= 0 1 V,VCC = 24 V VOH High-leveloutputvoltage FAULT, IOH = 1 mA VREG -0.6 V VOL Low-leveloutputvoltage FAULT, IOL = -1mA AGND + 0.4 V fOSC Oscillatorfrequency R osc Resistor= 100 kΩ,MSTR/ SLV = 2 V 200 300 kHz TA Operatingfree-airtemperature –40 85 °C DC CHARACTERISTICS TA = 25°C, VCC = 24 V,R L = 8 Ω (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Class-Doutputoffsetvoltage(measured|VOS | VI= 0 V,Gain = 36 dB 5 50 mVdifferentially) Bypass referenceforinputamplifier VBYP, no load 1.1 1.25 1.45 V 4-V internalsupplyvoltage VREG, no load,VCC = 10 V to26 V 3.75 4 4.25 V VCC = 12 V to24 V,inputsac coupledtoAGND,PSRR DC Power supplyrejectionratio -70 dBGain = 36 dB ICC Quiescentsupplycurrent SHUTDOWN = 2 V,MUTE = 0 V,no load,filter, 22 26.5 mA orsnubber ICC(SD) Quiescentsupplycurrentinshutdownmode SHUTDOWN = 0.8V,no load,filter,orsnubber 180 250 µA ICC(MUTE) Quiescentsupplycurrentinmute mode MUTE = 2 V,no load,filter,orsnubber 8 10 mA HighSide 200 VCC = 12 V,IO = 500 mA,rDS(on) Drain-sourceon-stateresistance Low side 200 m ΩTJ = 25°C Total 400 500 GAIN0 = 0.8V 19 20 21 GAIN1 = 0.8V dB GAIN0 = 2 V 25 26 27 G Gain GAIN0 = 0.8V 31 32 33 GAIN1 = 2 V dB GAIN0 = 2 V 35 36 37 Gain matching Between channels 2% tON Turn-ontime C (VBYP) = 1 µF,SHUTDOWN = 2 V 25 ms tOFF Turn-offtime C (VBYP) = 1 µF,SHUTDOWN = 0.8V 0.1 ms DC CHARACTERISTICS TA = 25°C, VCC = 12 V,R L = 8 Ω (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Class-Doutputoffsetvoltage(measured|VOS | VI= 0 V,Gain = 36 dB 5 50 mVdifferentially) Bypass referenceforinputamplifier VBYP, no load 1.1 1.25 1.45 V 4-V internalsupplyvoltage VREG, no load 3.75 4 4.25 V VCC = 12 V to24 V,Inputsac coupledtoAGND,PSRR DC Power supplyrejectionratio -70 dBGain = 36 dB ICC Quiescentsupplycurrent SHUTDOWN = 2 V,MUTE = 0 V,no load,filter, 18 22.5 mA orsnubber ICC(SD) Quiescentsupplycurrentinshutdownmode SHUTDOWN = 0.8V,no load,filter,orsnubber 80 200 µA ICC(MUTE) Quiescentsupplycurrentinmute mode MUTE = 2 V,no load,filter,orsnubber 7 9 mA Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TPA3100D2

SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com DC CHARACTERISTICS (continued) TA = 25°C, VCC = 12 V,R L = 8 Ω (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT HighSide 200 VCC = 12 V,IO = 500 mA,rDS(on) Drain-sourceon-stateresistance Low side 200 m ΩTJ = 25°C Total 400 500 GAIN0 = 0.8V 19 20 21 GAIN1 = 0.8V dB GAIN0 = 2 V 25 26 27 G Gain GAIN0 = 0.8V 31 32 33 GAIN1 = 2 V dB GAIN0 = 2 V 35 36 37 tON Turn-ontime C (VBYP) = 1 µF,SHUTDOWN = 2 V 25 ms tOFF Turn-offtime C (VBYP) = 1 µF,SHUTDOWN = 0.8V 0.1 ms AC CHARACTERISTICS TA = 25°C, VCC = 24 V,R L = 8 Ω (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 200 mV PP ripplefrom20 Hz–1 kHz,KSVR Supplyripplerejection –70 dBGain = 20 dB,Inputsac-coupledtoAGND THD+N = 7%, f= 1 kHz,VCC = 18 V 20.6 W PO Continuousoutputpower THD+N = 10%, f= 1 kHz,VCC = 18 V 21.8 W THD+N Totalharmonicdistortion+ noise VCC = 18 V,f= 1 kHz,PO = 10 W (half-power) 0.11% 100 µV Vn Outputintegratednoise 20 Hz to22 kHz,A-weightedfilter,Gain = 20 dB –80 dBV Crosstalk VO = 1 Vrms,Gain = 20 dB,f= 1 kHz –92 dB Maximum outputatTHD+N < 1%, f= 1 kHz,SNR Signal-to-noiseratio 102 dBGain = 20 dB,A-weighted Thermaltrippoint 150 °C Thermalhysteresis 30 °C AC CHARACTERISTICS TA = 25°C, VCC = 12 V,R L = 8 Ω (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 200 mV PP ripplefrom20 Hz–1 kHz,KSVR Supplyripplerejection –70 dBGain = 20 dB,Inputsac-coupledtoAGND THD+N = 7%, f= 1 kHz 9.4 THD+N = 10%, f= 1 kHz 10 PO Continuousoutputpower W THD+N = 7%, f= 1 kHz,R L = 4 Ω 15.6 THD+N = 10%, f= 1 kHz,R L = 4 Ω 16.4 THD+N Totalharmonicdistortion+ noise R L = 8 Ω,f= 1 kHz,PO = 5 W (half-power) 0.11% R L = 4 Ω,f= 1 kHz,PO = 8 W (half-power) 0.15% 100 µV Vn Outputintegratednoise 20 Hz to22 kHz,A-weightedfilter,Gain = 20 dB –80 dBV Crosstalk Po = 1 W, Gain = 20 dB,f= 1 kHz –94 dB Maximum outputatTHD+N < 1%, f= 1 kHz,SNR Signal-to-noiseratio 98 dBGain = 20 dB,A-weighted Thermaltrippoint 150 °C Thermalhysteresis 30 °C

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Thermal□Pad RINN NCNC NCNC PGNDRLINP VCLAMPRLINN VCLAMPLNC PGNDLGAIN0 PGNDLGAIN1 PVCCLMSTR/SLV PVCCLSYNC 334 289 2611 343 298 352 307 361 316 AVCC AVCC FAULT MUTESHUTDOWNBSRP ROUTP ROUTP ROUTN ROUTN BSRN GND GND PVCCR PVCCR PGNDR VCLAMPR VCLAMPL PGNDL PVCCL PVCCL GND GND RINN RINP AGND LINP LINN GAIN0 GAIN1 MSTR/SLV SYNC GND GNDROSCVREGVBYPAGNDBSLPLOUTP LOUTPLOUTN LOUTNBSLNGND PGNDR PGNDL GAIN0 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 Exposed Thermal□Pad TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010

48 PIN,QFN PACKAGE 48 PIN,HTQFP PACKAGE

(TOP VIEW) (TOP VIEW) TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTIONQFN HTQFPNAME NO. NO. Shutdown signalforIC (LOW = disabled,HIGH = operational).TTL logicSHUTDOWN 44 44 I levelswithcompliancetoAVCC. RINN 2 2 I Negativeaudioinputforrightchannel.BiasedatVREG/2. RINP 3 3 I Positiveaudioinputforrightchannel.BiasedatVREG/2. LINN 6 6 I Negativeaudioinputforleftchannel.BiasedatVREG/2. LINP 5 5 I Positiveaudioinputforleftchannel.BiasedatVREG/2. GAIN0 8 7,8 I Gain selectleastsignificantbit.TTL logiclevelswithcompliancetoVREG. GAIN1 9 9 I Gain selectmost significantbit.TTL logiclevelswithcompliancetoVREG. 1,12,13, GND 24,25,36, Connecttothethermalpad. Mute signalforquickdisable/enableofoutputs(HIGH = outputshigh-Z,MUTE 45 45 I LOW = outputsenabled).TTL logiclevelswithcompliancetoAVCC. BSLP 18 18 I/O BootstrapI/Oforleftchannel,positivehigh-sideFET. Power supplyforleftchannelH-bridge,notinternallyconnectedtoPVCCRPVCCL 26,27 26,27 orAVCC. LOUTP 19,20 19,20 O Class-D1/2-H-bridgepositiveoutputforleftchannel. PGNDL 28,29 28,29 Power groundforleftchannelH-bridge. LOUTN 21,22 21,22 O Class-D1/2-H-bridgenegativeoutputforleftchannel. BSLN 23 23 I/O BootstrapI/Oforleftchannel,negativehigh-sideFET. VCLAMPL 30 30 Internallygeneratedvoltagesupplyforleftchannelbootstrapcapacitor. VCLAMPR 31 31 Internallygeneratedvoltagesupplyforrightchannelbootstrapcapacitor. BSRN 38 38 I/O BootstrapI/Oforrightchannel,negativehigh-sideFET. ROUTN 39,40 39,40 O Class-D1/2-H-bridgenegativeoutputforrightchannel. PGNDR 32,33 32,33 Power groundforrightchannelH-bridge. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TPA3100D2

SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com TERMINAL FUNCTIONS (continued) TERMINAL I/O DESCRIPTIONQFN HTQFPNAME NO. NO. ROUTP 41,42 41,42 O Class-D1/2-H-bridgepositiveoutputforrightchannel. PVCCR 34,35 34,35 Power supplyforrightchannelH-bridge,notconnectedtoPVCCL orAVCC. BSRP 43 43 I/O BootstrapI/Oforrightchannel,positivehigh-sideFET. AGND 4,17 4,17 Analoggroundfordigital/analogcellsincore. ROSC 14 14 I/O I/Oforcurrentsettingresistoroframp generator. Master/SlaveselectfordeterminingdirectionofSYNC terminal. HIGH=Master mode, SYNC terminalisan output;LOW = slavemode,MSTR/ SLV 10 10 I SYNC terminalacceptsa clockinput.TTL logiclevelswithcomplianceto VREG. Clockinput/outputforsynchronizingmultipleclass-Ddevices.DirectionSYNC 11 11 I/O determinedby MSTR/ SLV terminal.Inputsignalnottoexceed VREG. Referenceforpreamplifier.Nominallyequalto1.25V.Alsocontrolsstart-upVBYP 16 16 O timeviaexternalcapacitorsizing. 4-V regulatedoutputforuse by internalcells,GAINx, MUTE, andVREG 15 15 O MSTR/ SLV pinsonly.Not specifiedfordrivingotherexternalcircuitry. High-voltageanalogpower supply.Not internallyconnectedtoPVCCR orAVCC 48 47,48 PVCCL. 1,7,12, NC 13,24,25, Not internallyconnected. 36,37,47 ConnecttoAGND and PGND – shouldbe starpointforbothgrounds. InternalresistiveconnectiontoAGND and PGND. Thermalviason thePCB ThermalPad - - - shouldconnectthispad toa largecopperareaon an internalorbottom layerforthebestthermalperformance.The ThermalPad must be soldered tothePCB formechanicalreliability.

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4V□Reg AVCC VREG PWM Logic Gain Control Gain Control LINP LINN SHUTDOWN VBYP VBYP MSTR/SLV PWM Logic SYNC AVCC AVCC AVCC Gain Control GAIN0 GAIN1 8 To□Gain Adj. Blocks□and Startup□Logic MUTE FAULT VREG AGND VBYP VBYP VREG VBYP VClamp Gen PVCCR Gate Drive Gate Drive VClamp Gen Gate Drive Thermal SC Detect PVCCR Gate Drive BSLN VCLAMPL PVCCL PVCCL BSLP LOUTN BSRN VCLAMPR PVCCR PVCCR ROUTN BSRP ROUTP PGNDR PVCCL PVCCL PGNDL LOUTP Gain Gain Gain Gain TLL Input Buffer (VCC□Compliant) TLL Input Buffer (VCC□Compliant) TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 FUNCTIONAL BLOCK DIAGRAM TYPICAL CHARACTERISTICS Table1.TABLE OF GRAPHS (1) FIGURE THD+N Totalharmonicdistortion+ noise vs Frequency 1,2,3,4 THD+N Totalharmonicdistortion+ noise vs Outputpower 5,6,7,8 Closed-loopresponse vs Frequency 9,10 Outputpower vs Supplyvoltage 11.12 Efficiency vs Outputpower 13,14 VCC Supplycurrent vs Totaloutputpower 15,16 Crosstalk vs Frequency 17,18 kSVR Supplyripplerejectionratio vs Frequency 19,20 (1) Allgraphswere measured usingtheTPA3100D2 EVM. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TPA3100D2

0.003 0.005 0.01 0.1 20 20k100 1k 10k f□-□Frequency□-□Hz THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□12□V, R =□8 , Gain□=□20□dB CC L /c87 P =□5□WO P =□0.5□WO P =□2.5□WO 0.003 0.005 0.01 0.1 20 20k100 1k 10k f□-□Frequency□-□Hz THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□18□V, R =□8 , Gain□=□20□dB CC L /c87 P =□1□WO P =□5□WO P =□10□WO 0.003 0.005 0.01 0.1 20 20k100 1k 10k f□-□Frequency□-□Hz THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□12□V, R =□4 , Gain□=□20□dB CC L /c87 P =□5□WO P =□1□WO P =□10□WO 0.003 0.005 0.01 0.1 20 20k100 1k 10k f□-□Frequency□-□Hz THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□24□V, R =□8 , Gain□=□20□dB CC L /c87 P =□10□WO P =□1□WO P =□5□WO TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs FREQUENCY FREQUENCY Figure1. Figure2. TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs FREQUENCY FREQUENCY Figure3. Figure4.

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0.01 0.02 0.05 0.1 10m 40100m 200m 1 10 20 10□kHz 1□kHz 20□Hz THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□12□V, R =□8 , Gain□=□32□dB CC L /c87 P -□Output□Power□-□WO 0.01 0.02 0.05 0.1 10m 40100m 200m 1 10 20 1□kHz 20□Hz THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□18□V, R =□8 , Gain□=□32□dB CC L /c87 P -□Output□Power□-□WO 10□kHz 0.01 0.02 0.05 0.1 10m 40100m 200m 1 10 20 THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□12□V, R =□4 , Gain□=□32□dB CC L /c87 P -□Output□Power□-□WO 10□kHz 1□kHz 20□kHz 0.01 0.02 0.05 0.1 10m 40100m 200m 1 10 20 1□kHz 20□Hz THD+N□-□Total□Harmonic□Distortion□+□Noise□-□% V =□24□V, R =□8 , Gain□=□32□dB CC L /c87 P -□Output□Power□-□WO 10□kHz TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs OUTPUT POWER OUTPUT POWER Figure5. Figure6. TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs OUTPUT POWER OUTPUT POWER Figure7. Figure8. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TPA3100D2

f − Frequency − Hz Gain dB Phase −/c176Phase Gain 10 100 1k 100k10k 200 150 100 − 50 − 100 − 150 − 200 V =□12□V R =□8 CC L /c87 V =□0.1□V C =□10 F I rms I /c109 Gain□=□32□dB RC□Filter□=□100 ,□10□nF/c87 f − Frequency − Hz Gain dB Phase −/c176 10 100 1k 100k10k 200 150 100 − 50 − 100 − 150 − 200 Phase Gain V =□24□V R =□8 CC L /c87 V =□0.1□V C =□10 F Gain□=□32□dB I rms I /c109 /c87 V -□Supply□Voltage□-□VCC 10 12 14 16 18 20 22 24 26 28 R =□8 Gain□=□20□dB L /c87 P O Output□Power W THD+N□=□10% THD+N□=□1% Power□Represented□by Dash□Lines□May□Require More□Heatsinking. VCC − Supply□V oltage − V 10 11 12 13 14 15 16 P O − Output□Power − W THD+N□=□10% THD+N□=□1% R =□4 Gain□=□20□dB L /c87 Power□Represented□by Dash□Lines□May□Require More□Heatsinking. TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com CLOSED LOOP RESPONSE CLOSED LOOP RESPONSE vs vs FREQUENCY FREQUENCY Figure9. Figure10. OUTPUT POWER OUTPUT POWER vs vs SUPPLY VOLTAGE SUPPLY VOLTAGE Figure11. Figure12.

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PO − Output□Power□(Per□Channel) − W 100 0 2 4 6 8 10 12 14 16 18 20 RL =□8 /c87 Gain□=□32□dB Efficiency VCC =□24□V V =□18□VCC VCC =□12□V PO − Output□Power□(Per□Channel) − W 100 0 2 4 6 8 10 12 14 15 RL =□4 Ω Gain□=□32□dB Efficiency VCC =□12□V PO − Total□Output□Power − W 0.5 1.5 2.5 0 10 20 30 40 RL =□8 Ω Gain□=□20□dB ICC Supply□Current A VCC =□24□V VCC =□12□V VCC =□18□V Power□Represented□by Dash□Lines□May□Require More□Heatsinking. PO − Total□Output□Power − W 0.5 1.5 2.5 3.5 0 10 20 30 40 ICC Supply□Current A R Gain□=□20□dB L =□4 Ω VCC =□12□V Power□Represented□by Dash□Lines□May□Require More□Heatsinking. TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 EFFICIENCY EFFICIENCY vs vs OUTPUT POWER OUTPUT POWER Figure13. Figure14. SUPPLY CURRENT SUPPLY CURRENT vs vs TOTAL OUTPUT POWER TOTAL OUTPUT POWER Figure15. Figure16. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TPA3100D2

− 140 − 120 − 100 − 80 − 60 -40 f − Frequency − Hz Crosstalk dB 20 100 1k 10k 20k VCC =□12□V RL =□8 Ω Gain□=□20□dB V =□1□VrmsO L to□R R□to□L − 140 − 120 − 100 − 80 − 60 -40 f − Frequency − Hz Crosstalk dB 20 100 1k 10k 20k L to□R R□to□L VCC =□24□V RL =□8 Ω Gain□=□20□dB V =□1□VrmsO − 100 − 90 − 80 − 70 − 60 − 50 − 40 − 30 − 20 − 10 f − Frequency − Hz VCC =□12□V RL =□8 Ω Gain□=□20□dB V(RIPPLE) =□200□mVPP kSVR Supply□Ripple□Rejection□Ratio dB 20 100 1k 10k 20k − 100 − 90 − 80 − 70 − 60 − 50 − 40 − 30 − 20 − 10 f − Frequency − Hz VCC =□18□V RL =□8 Ω Gain□=□20□dB V(RIPPLE) =□200□mVPP kSVR Supply□Ripple□Rejection□Ratio dB 20 100 1k 10k 20k TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com CROSSTALK CROSSTALK vs vs FREQUENCY FREQUENCY Figure17. Figure18. SUPPLY RIPPLE REJECTION RATIO SUPPLY RIPPLE REJECTION RATIO vs vs FREQUENCY FREQUENCY Figure19. Figure20.

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BSRPROUTP ROUTPROUTN ROUTNBSRN NC 10□V□-□26□V NC VREGVBYP AGND BSLP LOUTP LOUTPLOUTN LOUTN BSLN NCROSC 220nF 220nF 220nF 220nF PVCCR NC NC PGNDR PVCCR PGNDR VCLAMPR VCLAMPL PVCCL PGNDL PGNDL PVCCL 10□V□-□26□V 10□V□-□26□V Fault□Output Shutdown and□Mute Control

10 F/c109

33 H/c109

220 F/c109

10□nF 100□k/c87 Gain□Control Synchronize□Multiple Class-D□Devices 1□nF 1□nF 20 /c87 20 /c87 1□nF 1□nF 20 /c87 20 /c87 TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010

APPLICATION INFORMATION

Figure21. StereoClass-DWith DifferentialInputs(QFN) Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLink(s):TPA3100D2

1□nF 1□nF 20 /c87 20 /c87 TPA3100D2 GAIN1 LINP RINN RINP AGND LINN GAIN0 SYNC MSTR/SLV NC NC NC AVCC NC FAUL TMUTE SHUTDOWN BSRPROUTP ROUTPROUTN ROUTNBSRN NC 10□V□-□26□V NC VREGVBYP AGND BSLP LOUTP LOUTPLOUTN LOUTN BSLN NCROSC 220nF 220nF 220nF 220nF PVCCR NC NC PGNDR PVCCR PGNDR VCLAMPR VCLAMPL PVCCL PGNDL PGNDL PVCCL 10□V□-□26□V 10□V□-□26□V Fault□Output Shutdown and□Mute Control 10□nF 100□k/c87 Gain□Control Synchronize□Multiple Class-D□Devices 8 /c87 1□nF 1□nF 20 /c87 20 /c87 TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com Figure22. StereoClass-DWith Single-EndedInputs(QFN)

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BSRPROUTP ROUTPROUTN ROUTNBSRNGND 10□V□-□26□V GND VREGVBYP AGND BSLP LOUTP LOUTPLOUTN LOUTN BSLN GNDROSC 220nF 220nF 220nF 220nF PVCCR GND GND PGNDR PVCCR PGNDR VCLAMPR VCLAMPL PVCCL PGNDL PGNDL PVCCL 10□V□-□26□V 10□V□-□26□V Fault□Output Shutdown and□Mute Control 10□nF 100□k/c87 Differential Analog Inputs 4-Step Gain□Control Synchronize□Multiple Class-D□Devices 1□nF 1□nF 20 /c87 20 /c87 1□nF 1□nF 20 /c87 20 /c87 TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 Figure23. StereoClass-DWith DifferentialInputs(HTQFP) Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLink(s):TPA3100D2

BSRPROUTP ROUTPROUTN ROUTNBSRNGND 10□V□-□26□V GND VREGVBYP AGND BSLP LOUTP LOUTPLOUTN LOUTN BSLN GNDROSC 220nF 220nF 220nF 220nF PVCCR GND GND PGNDR PVCCR PGNDR VCLAMPR VCLAMPL PVCCL PGNDL PGNDL PVCCL 10□V□-□26□V 10□V□-□26□V Fault□Output Shutdown and□Mute Control 10□nF 100□k/c87 Single-Ended Analog Inputs 4-Step Gain□Control Synchronize□Multiple Class-D□Devices 1□nF 1□nF 20 /c87 20 /c87 1□nF 1□nF 20 /c87 20 /c87 TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com Figure24. StereoClass-DWith Single-EndedInputs(HTQFP)

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0□V -12□V +12□V Current OUTP Differential□V oltage Across□Load OUTN TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 CLASS-D OPERATION Thissectionfocuseson theclass-DoperationoftheTPA3100D2. TraditionalClass-DModulationScheme The traditionalclass-Dmodulationscheme, which isused inthe TPA032D0x family,has a differentialoutput where each outputis180 degreesoutofphase and changes fromgroundtothesupplyvoltage,VCC .Therefore, thedifferentialprefilteredoutputvariesbetween positiveand negativeVCC ,where filtered50% dutycycleyields 0 V acrosstheload.The traditionalclass-Dmodulationscheme withvoltageand currentwaveforms isshown in Figure25.Note thateven atan averageof0 V acrosstheload(50% dutycycle),thecurrenttotheloadishigh, causinghighlossand thuscausinga highsupplycurrent. Figure25. TraditionalClass-DModulationScheme 's Output Voltageand CurrentWaveforms intoan InductiveLoad With No Input TPA3100D2 ModulationScheme The TPA3100D2 uses a modulationscheme thatstillhas each outputswitchingfrom 0 to the supplyvoltage. However,OUTP and OUTN arenow inphase witheach otherwithno input.The dutycycleofOUTP isgreater than50% and OUTN islessthan50% forpositiveoutputvoltages.The dutycycleofOUTP islessthan50% and OUTN isgreaterthan50% fornegativeoutputvoltages.The voltageacrosstheloadsitsat0 V throughoutmost oftheswitchingperiod,greatlyreducingtheswitchingcurrent,whichreducesany I2R lossesintheload. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLink(s):TPA3100D2

0□V -12□V +12□V Current OUTP OUTN Differential Voltage Across Load 0□V -12□V +12□V Current OUTP OUTN Differential Voltage Across Load Output□=□0□V Output□>□0□V TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com Figure26. The TPA3100D2 Output Voltageand CurrentWaveforms Intoan InductiveLoad Efficiency:LC FilterRequired With theTraditionalClass-DModulationScheme The main reasonthatthetraditionalclass-Damplifierneeds an outputfilteristhattheswitchingwaveform results inmaximum currentflow.Thiscauses more lossintheload,whichcauses lowerefficiency.The ripplecurrentis largeforthetraditionalmodulationscheme, because theripplecurrentisproportionaltovoltagemultipliedby the timeatthatvoltage.The differentialvoltageswingis2 x VCC ,and thetimeateach voltageishalftheperiodfor thetraditionalmodulationscheme. An idealLC filterisneeded tostoretheripplecurrentfromeach halfcyclefor thenexthalfcycle,whileany resistancecauses power dissipation.The speakerisbothresistiveand reactive, whereas an LC filterisalmostpurelyreactive. The TPA3100D2 modulationscheme has littlelossintheloadwithouta filterbecause thepulsesareshortand thechange involtageisVCC insteadof2 x VCC .As theoutputpower increases,thepulseswiden,making the ripplecurrentlarger.Ripplecurrentcouldbe filteredwithan LC filterforincreasedefficiency,but formost applicationsthefilterisnotneeded. An LC filterwitha cutofffrequencylessthantheclass-Dswitchingfrequencyallowstheswitchingcurrenttoflow throughthe filterinsteadof the load.The filterhas lessresistancebut higherimpedance at the switching frequencythanthespeaker,whichresultsinlesspower dissipation,thereforeincreasingefficiency. When toUse an Output FilterforEMI Suppression Design the TPA3100D2 withoutthe filterifthe tracesfrom amplifierto speakerare short(< 10 cm). Powered speakers,where thespeakerisinthesame enclosureas theamplifier,isa typicalapplicationforclass-Dwithout a filter.

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2.2 /c109F

15 H/c109

2.2 /c109F 1□nF Ferrite Chip□Bead OUTP OUTN Ferrite Chip□Bead 1□nF TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 Most applicationsrequirea ferritebead filter.The ferritefilterreducesEMI around1 MHz and higher(FCC and CE onlytestradiatedemissionsgreaterthan 30 MHz). When selectinga ferritebead, choose one withhigh impedance athighfrequencies,butlowimpedance atlowfrequencies. Use an LC outputfilterifthereare low frequency(<1 MHz) EMI-sensitivecircuitsand/orthereare longwires fromtheamplifiertothespeaker. When bothan LC filterand a ferritebead filterare used,theLC filtershouldbe placedas closeas possibleto theIC followedby theferritebead filter. Figure27. TypicalLC Output Filter,CutoffFrequency of28 kHz,Speaker Impedance = 8 Ω Figure28. TypicalLC Output Filter,CutoffFrequency of28 kHz,Speaker Impedance = 4 Ω Figure29. TypicalFerriteChip Bead Filter(ChipBead Example: Fair-Rite2512067007Y3) Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLink(s):TPA3100D2

FCC□B□Limit Peak□dB 30□M 230□M 430□M 630□M 830□M National□Technical□Systems,□Plano□TX Radiated□Emissions□30□MHz□-□1000□MHz FCC□B f□-□Frequency□-□Hz Limit□Level□-□dB( V/m) /c109 TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com UsingtheLC filterinFigure27,theTPA3100D2 EMI EVM passed theFCC Part15 ClassB radiatedemissions with21-inchspeakerwires.Quasi-peakmeasurements were takenforthe4 standardtestconfigurations,and the TPA3100D2 EVM passed withat least17-dB margin.A plotof the peak measurement forthe horizontalrear configurationisshown inFigure30. Figure30. RadiatedEmissions Prescan 30 MHz -1000 MHz Inductorsused inLC filtersmust be chosen carefully.A significantchange ininductanceat the peak output currentoftheTPA3100D2 willcause increaseddistortion.The change ofinductanceatcurrentsup tothepeak outputcurrentmust be lessthan0.1mH peramp toavoidthisdistortion.Alsonotethatsmallerinductorsthan33 mH may cause an increaseindistortionabove what isshown intheprecedinggraphsofTHD versusfrequency and outputpower. Capacitorsused inLC filtersmust alsobe chosen carefully.A significantchange incapacitanceat the peak outputvoltageof the TPA3100D2 willcause increaseddistortion.LC filtercapacitorsshouldhave DC voltage ratingsat leasttwicethe peak applicationvoltage(thepower supplyvoltage)and shouldbe made of X5R or bettermaterial.Inallcasesavoidusingcapacitorswithloosetemperatureratings,likeY5V.

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Closest□Competitor t□-□Time□=□100 s/div/c109 TPA3100D2 Closest□Competitor t□-□Time□=□20 s/div/c109 TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 AdaptiveDynamic Range Control Figure31.1-kHz Sine Output at10% THD+N Figure32.8-kHz Sine Output at10% THD+N The Texas Instrumentspatent-pendingadaptivedynamic range control(ADRC) technologyremoves thenotch inherentinclass-Daudiopower amplifierswhen theycome outofclipping.Thiseffectismore severeathigher frequenciesas shown inFigure32. Gain settingviaGAIN0 and GAIN1 inputs The gainoftheTPA3100D2 issetby two inputterminals,GAIN0 and GAIN1. The gainslistedinTable2 arerealizedby changingthetapson theinputresistorsand feedbackresistorsinside theamplifier.Thiscauses theinputimpedance (ZI)tobe dependenton thegainsetting.The actualgainsettings arecontrolledby ratiosofresistors,so thegainvariationfrompart-to-partissmall.However,theinputimpedance frompart-to-partatthesame gainmay shiftby ±20% due toshiftsintheactualresistanceoftheinputresistors. For designpurposes,theinputnetwork(discussedinthenextsection)shouldbe designedassuming an input impedance of12.8kΩ,which istheabsoluteminimum inputimpedance oftheTPA3100D2. At thelowergain settings,theinputimpedance couldincreaseas highas 38.4kΩ Table2.Gain Setting INPUT IMPEDANCEAMPLIFIER GAIN (dB) (kΩ)GAIN1 GAIN0 TYP TYP 0 0 20 32 0 1 26 16 1 0 32 16 1 1 36 16 INPUT RESISTANCE Changing thegainsettingcan varytheinputresistanceoftheamplifierfromitssmallestvalue,16 kΩ ±20%, to thelargestvalue,32 kΩ ±20%. As a result,ifa singlecapacitorisused intheinputhigh-passfilter,the-3dB or cutofffrequencymay change when changinggainsteps. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLink(s):TPA3100D2

f□□= 1

2 Z C/c112 i i

f =c -3□dB fc C =i

2 Z f/c112 i c

SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com The -3-dBfrequencycan be calculatedusingEquation1.Use theZI valuesgiveninTable2. (1) INPUT CAPACITOR, C I Inthetypicalapplication,an inputcapacitor(CI) isrequiredtoallowtheamplifiertobiastheinputsignaltothe properdc levelforoptimum operation.In thiscase,C I and the inputimpedance of the amplifier(ZI) form a high-passfilterwiththecornerfrequencydeterminedinEquation2. (2) The valueofC I isimportant,as itdirectlyaffectsthebass (low-frequency)performanceofthecircuit.Consider theexample where ZI is20 kΩ and thespecificationcallsfora flatbass responsedown to20 Hz. Equation2 is reconfiguredas Equation3. (3) Inthisexample,C I is0.4µF;so,one would likelychoose a valueof0.47mF as thisvalueiscommonly used.If thegainisknown and isconstant,use ZI fromTable2 tocalculateC I.A furtherconsiderationforthiscapacitoris theleakagepathfromtheinputsourcethroughtheinputnetwork(CI)and thefeedbacknetworktotheload.This leakagecurrentcreatesa dc offsetvoltageattheinputtotheamplifierthatreducesusefulheadroom,especially inhighgainapplications.For thisreason,a low-leakagetantalumorceramiccapacitoristhebestchoice.When polarizedcapacitorsare used, the positiveside of the capacitorshould face the amplifierinputin most applicationsas thedc levelthereisheldat2 V, which islikelyhigherthanthesourcedc level.Note thatitis importanttoconfirmthecapacitorpolarityintheapplication.Additionally,lead-freesoldercan createdc offset voltagesand itisimportanttoensurethatboardsarecleanedproperly. Power Supply Decoupling,C S The TPA3100D2 isa high-performanceCMOS audioamplifierthatrequiresadequatepower supplydecoupling to ensure thatthe outputtotalharmonicdistortion(THD) isas low as possible.Power supplydecouplingalso preventsoscillationsforlongleadlengthsbetween the amplifierand the speaker.The optimum decouplingis achievedby usingtwo capacitorsofdifferenttypesthattargetdifferenttypesofnoiseon thepower supplyleads. Forhigherfrequencytransients,spikes,ordigitalhash on theline,a good lowequivalent-series-resistance(ESR) ceramiccapacitor,typically0.1mF to1 µF placedas closeas possibletothedeviceVCC leadworks best.For filteringlowerfrequencynoisesignals,a largeraluminum electrolyticcapacitorof220 mF orgreaterplacednear the audiopower amplifierisrecommended. The 220 mF capacitoralsoservesas localstoragecapacitorfor supplyingcurrentduringlargesignaltransientson theamplifieroutputs.The PVCC terminalsprovidethepower to the outputtransistors,so a 220 µF or largercapacitorshouldbe placedon each PVCC terminal.A 10 µF capacitoron theAVCC terminalisadequate.

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1□nF 1□nF 20 /c8720 /c87 TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 IC Output Snubbers 1-nF capacitorsinserieswith20-Ω resistorsfrom the outputsof the TPA3100D2 IC to ground are switching snubbers.These are illustratedin Figure33. They linearizeswitchingtransitionsand reduce overshootand ringing.By doingso theyimproveTHD+N, reducingitby a factornear3 at1kHz,1W; and theyimproveEMC by 2 to 6 dB at middlefrequencies.They increasequiescentcurrentby 5 to 15 mA dependingon power supply voltage. Figure33. IC Output Snubbers BSN and BSP Capacitors The fullH-bridgeoutputstagesuse onlyNMOS transistors.Therefore,theyrequirebootstrapcapacitorsforthe high sideof each outputto turnon correctly.A 220-nF ceramiccapacitor,ratedforat least25 V, must be connectedfrom each outputto itscorrespondingbootstrapinput.Specifically,one 220-nF capacitormust be connectedfrom xOUTP toBSxx, and one 220-nF capacitormust be connectedfrom xOUTN toBSxx. (See the applicationcircuitdiagraminFigure21.) The bootstrapcapacitorsconnectedbetween the BSxx pinsand correspondingoutputfunctionas a floating power supplyforthehigh-sideN-channelpower MOSFET gatedrivecircuitry.Duringeach high-sideswitching cycle,the bootstrapcapacitorsholdthe gate-to-sourcevoltagehighenough to keep the high-sideMOSFETs turnedon. VCLAMP Capacitors To ensure thatthe maximum gate-to-sourcevoltageforthe NMOS outputtransistorsisnot exceeded,two internalregulatorsclamp thegatevoltage.Two 1-mF capacitorsmust be connectedfromVCLAMPL (pin30)and VCLAMPR (pin31)togroundand must be ratedforatleast16 V. The voltagesattheVCLAMP terminalsmay varywithVCC and may notbe used forpoweringany othercircuitry. InternalRegulated4-V Supply (VREG) The VREG terminal(pin15) is the outputof an internallygenerated4-V supply,used forthe oscillator, preamplifier,and gaincontrolcircuitry.Itrequiresa 10-nFcapacitor,placedclosetothepin,tokeep theregulator stable. Thisregulatedvoltagecan be used tocontrolGAIN0, GAIN1, MSTR/ SLV, and MUTE terminals,butshouldnot be used todriveexternalcircuitry. VBYP CapacitorSelection The internalbiasgenerator(VBYP) nominallyprovidesa 1.25-Vinternalbiasforthe preamplifierstages.The externalinputcapacitorsand thisinternalreferenceallow the inputsto be biased withinthe optimal common-mode rangeoftheinputpreamplifiers. The selectionofthecapacitorvalueon theVBYP terminaliscriticalforachievingthebestdeviceperformance. Duringpower up or recoveryfrom the shutdown state,the VBYP capacitordeterminesthe rateat which the amplifierstartsup.When thevoltageon theVBYP capacitorequalsVBYP, thedevicestartsa 16.4-mstimer. When thistimercompletes,theoutputsstartswitching.The chargerateofthecapacitoriscalculatedusingthe standardchargingformulafora capacitor,I= C x dV/dT.The chargecurrentisnominallyequalto250µA and dV isequaltoVBYP. For example,a 1-µF capacitoron VBYP would take5 ms toreachthevalueofVBYP and begina 16.4-mscountbeforetheoutputsturnon.Thisequatestoa turn-ontimeof<30 ms fora 1-µF capacitor on theVBYP terminal. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLink(s):TPA3100D2

F =OSC TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com A secondaryfunctionoftheVBYP capacitoristofilterhigh-frequencynoiseon theinternal1.25-Vbiasgenerator. A valueofatleast0.47µF isrecommended fortheVBYP capacitor.For thebestpower-upand shutdown pop performance,theVBYP capacitorshouldbe greaterthanorequaltotheinputcapacitors. ROSC ResistorSelection The resistorconnectedtotheROSC terminalcontrolstheclass-DoutputswitchingfrequencyusingEquation4: (4) COSC isan internalcapacitorthatisnominallyequalto 20 pF. Variationover processand temperaturecan resultina ±15% change inthiscapacitorvalue. For example,ifROSC isfixedat100 kΩ,thefrequencyfrom devicetodevicewiththisfixedresistancecould varyfrom217 kHz to294 kHz witha 15% variationintheinternalCOSC capacitor.The toleranceoftheROSC resistorshouldalsobe consideredto determinethe range of expectedswitchingfrequenciesfrom deviceto device.Itisrecommended that1% toleranceresistorsbe used. DifferentialInput The differentialinputstageoftheamplifiercancelsany noisethatappearson bothinputlinesofthechannel.To use theTPA3100D2 witha differentialsource,connectthepositiveleadoftheaudiosourcetotheINP inputand thenegativeleadfromtheaudiosourcetotheINN input.To use theTPA3100D2 witha single-endedsource,ac ground theINP or INN inputthrougha capacitorequalinvaluetotheinputcapacitoron INN or INP and apply theaudiosourcetoeitherinput.Ina single-endedinputapplication,theunused inputshouldbe ac groundedat theaudiosourceinsteadofatthedeviceinputforbestnoiseperformance. SHUTDOWN OPERATION The TPA3100D2 employs a shutdown mode ofoperationdesignedtoreducesupplycurrent(ICC )totheabsolute minimum levelduringperiodsofnonuse forpower conservation.The SHUTDOWN inputterminalshouldbe held high (see specificationtablefortrippoint)duringnormal operationwhen the amplifieris in use. Pulling SHUTDOWN low causes the outputsto mute and the amplifierto entera low-currentstate.Never leave SHUTDOWN unconnected,because amplifieroperationwouldbe unpredictable. For thebestpower-offpop performance,placetheamplifierintheshutdown ormute mode priortoremovingthe power supplyvoltage. MUTE Operation The MUTE pin isan inputforcontrollingthe outputstateof the TPA3100D2. A logichigh on thisterminal disablesthe outputs.A logiclow on thispin enables the outputs.This terminalmay be used as a quick disable/enableof outputswhen changing channelson a televisionor transitioningbetween differentaudio sources. The MUTE terminalshouldneverbe leftfloating.For power conservation,theSHUTDOWN terminalshouldbe used toreducethequiescentcurrenttotheabsoluteminimum level. The MUTE terminalcan alsobe used withtheFAULT outputtoautomaticallyrecoverfroma short-circuitevent. When a short-circuitevent occurs,the FAULT terminaltransitionshigh indicatinga short-circuithas been detected.When directlyconnectedto MUTE, the MUTE terminaltransitionshigh,and clearsthe internalfault flag.Thiscauses theFAULT terminaltocyclelow,and normaldeviceoperationresumes iftheshort-circuitis removed fromtheoutput.Ifa shortremainsattheoutput,thecyclecontinuesuntiltheshortisremoved. IfexternalMUTE controlisdesired,and automaticrecoveryfroma short-circuiteventisalsodesired,an OR gate can be used tocombine thefunctionalityoftheFAULT outputand externalMUTE control,see Figure34.

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External□GPIO Control TPA3100D2 TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 Figure34. ExternalMUTE Control MSTR/ SLV and SYNC operation The MSTR/ SLV and SYNC terminalscan be used tosynchronizethefrequencyoftheclass-Doutputswitching. When the MSTR/ SLV terminalishigh,the outputswitchingfrequencyisdeterminedby the selectionof the resistorconnectedtotheROSC terminal(seeROSC ResistorSelection).The SYNC terminalbecomes an output inthismode, and thefrequencyofthisoutputisalsodeterminedby theselectionoftheROSC resistor.ThisTTL compatible,push-pulloutputcan be connectedtoanotherTPA3100D2, configuredintheslavemode. The output switchingissynchronizedtoavoidany beatfrequenciesthatcouldoccurintheaudioband when two class-D amplifiersinthesame systemareswitchingatslightlydifferentfrequencies. When theMSTR/ SLV terminalislow,theoutputswitchingfrequencyisdeterminedby theincomingsquarewave on theSYNC input.The SYNC terminalbecomes an inputinthismode and acceptsa TTL compatiblesquare wave from anotherTPA3100D2 configuredinthe master mode or from an externalGPIO. Ifconnectingto an externalGPIO, recommended frequenciesare 200 kHz to 300 kHz forproper device operation,and the maximum amplitudeis4 V. USING LOW-ESR CAPACITORS Low-ESR capacitorsarerecommended throughoutthisapplicationsection.A real(asopposed toideal)capacitor can be modeled simplyas a resistorinserieswithan idealcapacitor.The voltagedrop acrossthisresistor minimizesthebeneficialeffectsofthecapacitorinthecircuit.The lowertheequivalentvalueofthisresistance, themore therealcapacitorbehaves likean idealcapacitor. SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE The TPA3100D2 has short-circuitprotectioncircuitryon theoutputsthatpreventsdamage tothedeviceduring output-to-outputshorts,output-to-GNDshorts,and output-to-VCC shorts.When a shortcircuitisdetectedon the outputs,thepartimmediatelydisablestheoutputdrive.Thisisa latchedfaultand must be resetby cyclingthe voltageon theSHUTDOWN pinorMUTE pin.Thisclearstheshort-circuitflagand allowsfornormaloperationif theshortwas removed.Iftheshortwas notremoved,theprotectioncircuitryagainactivates. The FAULT terminalcan be used forautomaticrecoveryfroma short-circuitevent,orused tomonitorthestatus withan externalGPIO. For automaticrecoveryfroma short-circuitevent,connecttheFAULT terminaldirectlyto the MUTE terminal.When a short-circuitevent occurs,the FAULT terminaltransitionshigh indicatinga short-circuithas been detected.When directlyconnectedto MUTE, the MUTE terminaltransitionshigh,and clearstheinternalfaultflag.Thiscauses theFAULT terminaltocyclelow,and normaldeviceoperationresumes iftheshort-circuitisremoved fromtheoutput.Ifa shortremainsattheoutput,thecyclecontinuesuntiltheshort isremoved.IfexternalMUTE controlisdesired,and automaticrecoveryfroma short-circuiteventisalsodesired, an OR gate can be used to combine the functionalityof the FAULT outputand externalMUTE control,see Figure34. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLink(s):TPA3100D2

SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com THERMAL PROTECTION Thermal protectionon the TPA3100D2 preventsdamage to the devicewhen the internaldie temperature exceeds 150°C. There isa ±15°C toleranceon thistrippointfrom devicetodevice.Once thedietemperature exceedsthethermalsetpoint,thedeviceentersintotheshutdownstateand theoutputsaredisabled.Thisisnot a latchedfault.The thermalfaultisclearedonce the temperatureof the dieisreduced by 30°C. The device beginsnormaloperationatthispointwithno externalsysteminteraction. PRINTED-CIRCUIT BOARD (PCB) LAYOUT Because theTPA3100D2 isa class-Damplifierthatswitchesata highfrequency,thelayoutoftheprinted-circuit board(PCB) shouldbe optimizedaccordingtothefollowingguidelinesforthebestpossibleperformance.

• Decouplingcapacitors— The high-frequency1µF decouplingcapacitorsshouldbe placedas closeto the PVCC (pins26, 27, 34, and 35) and AVCC (pin48) terminalsas possible.The VBYP (pin16) capacitor, VREG (pin15) capacitor,and VCLAMP (pins30 and 31) capacitorshouldalsobe placedas closeto the deviceas possible.Large(220µF orgreater)bulkpower supplydecouplingcapacitorsshouldbe placednear theTPA3100D2 on thePVCCL, PVCCR, and AVCC terminals.
• Grounding— The AVCC (pin48)decouplingcapacitor,VREG (pin15)capacitor,VBYP (pin16)capacitor,and ROSC (pin14) resistorshouldeach be grounded toanalogground (AGND, pin17).The PVCC decoupling capacitorsand VCLAMP capacitorsshouldeach be groundedtopower ground(PGND, pins28,29,32,and 33).Analog ground and power ground shouldbe connectedatthethermalpad,which shouldbe used as a centralgroundconnectionorstargroundfortheTPA3100D2.
• Outputfilter— The ferriteEMI filter(Figure29)shouldbe placedas closetotheoutputterminalsas possible forthebestEMI performance.The LC filter(Figure27 and Figure28)shouldbe placedclosetotheoutputs. The capacitorsused inboththeferriteand LC filtersshouldbe groundedtopower ground.Ifbothfiltersare used,theLC filtershouldbe placedfirst,followingtheoutputs.
• Thermal Pad— The thermalpad must be solderedto the PCB forproperthermalperformanceand optimal reliability.The dimensionsofthethermalpad and thermallandshouldbe 5,1mm by 5,1mm. Fiverows of solidvias(fiveviasper row, 0,3302 mm or 13 milsdiameter)shouldbe equallyspaced underneaththe thermalland.The viasshouldconnecttoa solidcopperplane,eitheron an internallayeror on thebottom layerof the PCB. The viasmust be solidvias,not thermalreliefor webbed vias.See TI TechnicalBriefs SCBA017D and SLUA271 formore informationaboutusingtheQFN thermalpad.See TI TechnicalBriefs SLMA002 formore informationaboutusingtheHTQFP thermalpad.For recommended PCB footprints,see figuresattheend ofthisdatasheet. For an example layout,see the TPA3100D2 EvaluationModule (TPA3100D2EVM) User Manual,(SLOU179). Both the EVM user manual and the thermalpad applicationnote are availableon the TI Web siteat http://www.ti.com. BASIC MEASUREMENT SYSTEM Thisapplicationnotefocuseson methods thatuse thebasicequipmentlistedbelow:
• Audioanalyzerorspectrumanalyzer
• Digitalmultimeter(DMM)
• Oscilloscope
• Twisted-pairwires
• Signalgenerator
• Power resistor(s)
• Linearregulatedpower supply
• Filtercomponents
• EVM orothercompleteaudiocircuit Figure35 shows theblockdiagramsofbasicmeasurement systemsforclass-ABand class-Damplifiers.A sine wave isnormallyused as the inputsignalbecause itconsistsof the fundamentalfrequencyonly(no other harmonicsare present).An analyzeristhenconnectedtotheAPA outputtomeasure thevoltageoutput.The analyzermust be capableof measuringthe entireaudiobandwidth.A regulateddc power supplyisused to reducethenoiseand distortioninjectedintotheAPA throughthepower pins.A System Two audiomeasurement system(AP-II)(Reference1)by AudioPrecisionincludesthesignalgeneratorand analyzerinone package.

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20□Hz□-□20□kHz (a)□Basic□Class-AB APASignal Generator Power□Supply Analyzer 20□Hz□-□20□kHzRL (b)□Filter-Free□and□Traditional□Class-D Class-D APASignal Generator Power□Supply RL Low-Pass□RC Filter Low-Pass□RC Filter (See□note A) TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 The generatoroutputand amplifierinputmust be ac-coupled.However,theEVMs alreadyhave theac-coupling capacitors,(CIN),so no additionalcouplingisrequired.The generatoroutputimpedance shouldbe low toavoid attenuatingthetestsignal,and isimportantbecause theinputresistanceofAPAs isnothigh.Conversely,the analyzer-inputimpedance shouldbe high.The outputresistance,R OUT ,oftheAPA isnormallyinthehundredsof milliohmsand can be ignoredforallbutthepower-relatedcalculations. Figure35(a)shows a class-ABamplifiersystem.Ittakesan analogsignalinputand producesan analogsignal output.Thisamplifiercircuitcan be directlyconnectedtotheAP-IIorotheranalyzerinput. Thisisnot trueof the class-Damplifiersystem shown inFigure35(b),which requireslow-passfiltersinmost cases inorderto measure the audiooutputwaveforms.Thisisbecause ittakesan analoginputsignaland convertsitintoa pulse-widthmodulated (PWM) outputsignalthatis not accuratelyprocessed by some analyzers. A. Forefficiencymeasurements withfilter-freeClass-D,R L shouldbe an inductiveloadlikea speaker. Figure35. Audio Measurement Systems The TPA3100D2 uses a modulationscheme thatdoes not requirean outputfilterforoperation,but theydo sometimes requirean RC low-passfilterwhen making measurements.Thisisbecause some analyzerinputs cannotaccuratelyprocesstherapidlychangingsquare-waveoutputand thereforerecordan extremelyhighlevel ofdistortion.The RC low-passmeasurement filterisused toremove themodulatedwaveforms so theanalyzer can measure theoutputsinewave. Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 27 ProductFolderLink(s):TPA3100D2

Audio□Power AmplifierGenerator Low-Pass RC□Filter CIN RGEN RGEN RIN RIN VGEN ROUT ROUT Analyzer RANA RANA CANA Low-Pass RC□Filter RL CANA Twisted-Pair□Wire Evaluation□Module Twisted-Pair□Wire TPA3100D2 SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com DIFFERENTIAL INPUT AND BTL OUTPUT Allof the class-DAPAs and many class-ABAPAs have differentialinputsand bridge-tiedload(BTL) outputs. Differentialinputshave two inputpinsper channeland amplifythe differencein voltagebetween the pins. Differentialinputsreduce the common-mode noiseand distortionof the inputcircuit.BTL isa term commonly used inaudiotodescribedifferentialoutputs.BTL outputshave two outputpinsprovidingvoltagesthatare180 degreesoutofphase.The loadisconnectedbetween thesepins.Thishas theadded benefitsofquadruplingthe outputpower totheloadand eliminatinga dc blockingcapacitor. A blockdiagram of the measurement circuitisshown inFigure36. The differentialinputisa balancedinput, meaning thepositive(+)and negative(-)pinshave thesame impedance toground.Similarly,theBTL output equatestoa balancedoutput. Figure36. DifferentialInput,BTL Output Measurement Circuit The generatorshouldhave balancedoutputs,and thesignalshouldbe balancedforbestresults.An unbalanced outputcan be used,butitmay createa groundloopthataffectsthemeasurement accuracy.The analyzermust alsohave balancedinputsforthesystemtobe fullybalanced,therebycancellingoutany common-mode noisein thecircuitand providingthemost accuratemeasurement. The followinggeneralrulesshouldbe followedwhen connectingtoAPAs withdifferentialinputsand BTL outputs:

• Use a balancedsourcetosupplytheinputsignal.
• Use an analyzerwithbalancedinputs.
• Use twisted-pairwireforallconnections.
• Use shieldingwhen thesystemenvironmentisnoisy.
• Ensure thatthecablesfromthepower supplytotheAPA, and fromtheAPA totheload,can handlethelarge currents(seeTable3). Table3 shows therecommended wiresizeforthepower supplyand loadcablesoftheAPA system.The real concernisthedc orac power lossthatoccursas thecurrentflowsthroughthecable.These recommendations arebased on 12-inchlongwirewitha 20-kHzsine-wavesignalat25°C. Table3.Recommended Minimum Wire SizeforPower Cables DC POWER LOSS AC POWER LOSSPOUT (W) R L(Ω) AWG Size (MW) (MW) 10 4 18 22 16 40 18 42 2 4 18 22 3.2 8 3.7 8.5 1 8 22 28 2 8 2.1 8.1

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VL=□VIN VOUT RANACANA RANACANA CFILT To APA GND AP Analyzer□InputRC□Low-Pass□FiltersLoad VOUT /c119VIN /c119O RANA + RFILT RANA 1□□+□□j ( ( () ) f =c /c2142 x f max C =FILT 2 x□□f x□□R/c112 c FILT TPA3100D2 www.ti.com SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 CLASS-D RC LOW-PASS FILTER An RC filterisused toreducethesquare-waveoutputwhen theanalyzerinputscannotprocessthepulse-width modulatedclass-Doutputwaveform.Thisfilterhas littleeffecton themeasurement accuracybecause thecutoff frequencyis set above the audio band. The high frequencyof the square wave has negligibleimpact on measurement accuracybecause itiswellabove the audiblefrequencyrange,and the speaker cone cannot respondatsuch a fastrate.The RC filterisnotrequiredwhen an LC low-passfilterisused,such as withthe class-DAPAs thatemploy thetraditionalmodulationscheme (TPA032D0x, TPA005Dxx). The component valuesoftheRC filterareselectedusingtheequivalentoutputcircuitas shown inFigure37.R L istheloadimpedance thattheAPA isdrivingforthetest.The analyzerinputimpedance specificationsshouldbe availableand substitutedforR ANA and C ANA .The filtercomponents,R FILT and C FILT,can thenbe derivedforthe system.The filtershouldbe groundedtotheAPA neartheoutputgroundpinsoratthepower supplygroundpin tominimizegroundloops. Figure37. Measurement Low-Pass FilterDerivationCircuit-Class-DAPAs The transferfunctionforthiscircuitisshown in Equation5 where wO = R EQ C EQ , R EQ = R FILT ||R ANA and C EQ = (CFILT + C ANA ).The filterfrequencyshouldbe setabove fMAX ,thehighestfrequencyofthemeasurement bandwidth,toavoidattenuatingtheaudiosignal.Equation6 providesthiscutofffrequency,fC .The valueofR FILT must be chosen largeenough tominimizecurrentthatisshuntedfromtheload,yetsmallenough tominimizethe attenuationoftheanalyzer-inputvoltagethroughthevoltagedividerformedby R FILT and R ANA .A generalruleis thatR FILT shouldbe small(~100 Ω) formost measurements.Thisreducesthemeasurement errortolessthan 1% forR ANA ≥ 10 kΩ. (5) (6) An exceptionoccurswiththe efficiencymeasurements,where R FILT must be increasedby a factorof ten to reducethecurrentshuntedthroughthefilter.C FILT must be decreasedby a factoroftentomaintainthesame cutofffrequency.See Table4 fortherecommended filtercomponent values. Once fC isdeterminedand R FILT isselected,the filtercapacitanceiscalculatedusingEquation7. When the calculatedvalueisnotavailable,itisbettertochoose a smallercapacitancevaluetokeep fC above theminimum desiredvaluecalculatedinEquation7. (7) Copyright© 2005–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 29 ProductFolderLink(s):TPA3100D2

SLOS469F –OCTOBER 2005–REVISED AUGUST 2010 www.ti.com Table4 shows recommended valuesofR FILT and C FILT based on common component values.The valueoffC was originallycalculatedtobe 28 kHz foran fMAX of20 kHz.C FILT,however,was calculatedtobe 57,000pF,but thenearestvaluesof56,000pF and 51,000pF were notavailable.A 47,000-pFcapacitorwas used instead,and fC is34 kHz,whichisabove thedesiredvalueof28 kHz. Table4.TypicalRC Measurement FilterValues MEASUREMENT R FILT C FILT Efficiency 1000 Ω 5,600pF Allothermeasurements 100 Ω 56,000pF spacer

REVISION HISTORY

Changes from RevisionE (May 2007)toRevisionF Page

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www.ti.com 15-Apr-2017 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples HPA00297PHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3100D2 TPA3100D2PHP ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3100D2 TPA3100D2PHPG4 ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3100D2 TPA3100D2PHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3100D2 TPA3100D2PHPRG4 ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3100D2 TPA3100D2RGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA 3100D2 TPA3100D2RGZRG4 ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA 3100D2 TPA3100D2RGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA 3100D2 TPA3100D2RGZTG4 ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA 3100D2 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

www.ti.com 15-Apr-2017 Addendum-Page 2 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPA3100D2 :

• Automotive: TPA3100D2-Q1 NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA3100D2PHPR HTQFP PHP 48 1000 367.0 367.0 38.0 TPA3100D2RGZR VQFN RGZ 48 2500 367.0 367.0 38.0 TPA3100D2RGZT VQFN RGZ 48 250 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2013 Pack Materials-Page 2

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