TPA2000D1GQCR

TPA2000D1 TI | Alldatasheet

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V DD PVDD OUTN PGND PW PACKAGE (TOP VIEW) MicroStar Junior (GQC) Package (TOP VIEW) AGND PVDD INN INP NOTE: The shaded terminals are used for thermal connections to the ground plane. BYPASS COSC OUTN PGND NC ROSC VDD PVDD PVDD SHUTDOWN GAIN0 GAIN1 PVDD OUTP NC ± No internal connection, still requires a pad for the ball. (SIDE VIEW) A2 A6

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a Filter mm mm MicroStar Junior BGA and TSSOP Package Options W Into a Ω Speaker (THD+N <1%) <0.2% THD+N at 1.5 kHz, Into a Ω Load Extremely Efficient Third Generation 5-V Class-D Technology: Low-Supply Current (No Filter): mA Low-Supply Current (Filter): 7.5 mA Low-Shutdown Current: 0.05 µ A Low-Noise Floor: µ V RMS (No-Weighting Filter) Maximum Efficiency Into Ω Internal Gain Settings: to 23.5 dB PSRR: -77 dB Integrated Depop Circuitry Short-Circuit Protection (Short to Battery, Ground, and Load) High-Efficiency For Extended Battery Run Time The TPA2000D1 is a 2-W mono bridge-tied-load (BTL) class-D amplifier designed to drive a speaker with at least Ω impedance. The amplifier uses TI's third generation modulation technique, which results in improved efficiency and SNR. It also allows the device to be connected directly to the speaker without the use of the LC output filter commonly associated with class-D amplifiers (this results in EMI that must be shielded at the system level). These time. The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, and 23.5 dB. The differential input terminals are high-impedance CMOS inputs, and can be used as summing nodes. The class-D BTL amplifier includes depop circuitry to reduce the amount of turnon pop at power up and when cycling SHUTDOWN The TPA2000D1 is available in the 16-pin TSSOP and MicroStar Junior BGA packages that drive W of continuous output power into a Ω load. TPA2000D1 operates over an ambient temperature range of -40 C to Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. MicroStar Junior is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 2000 2004, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com Gate Drive_ Gate Drive Gain Adjust Gain Adjust Start-Up Protection Logic OC Detect Thermal VDD ok Ramp Generator Biases and References Gain 2 AGNDVDD VDD PVDD INN OUTN PGND PV DD OUTP PGND INP SHUTDOWN GAIN1 GAIN0 COSC ROSC BYPASS Deglitch Logic Deglitch Logic TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS PACKAGED DEVICES T A TSSOP (PW) (1) GQC (2) C to C TPA2000D1PW TPA2000D1GQCR (1) The PW package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA2000D1PWR). (2) The GQC package is only available taped and reeled. FUNCTIONAL BLOCK DIAGRAM

www.ti.com ABSOLUTE MAXIMUM RATINGS TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 TERMINAL FUNCTIONS TERMINAL NO. I/O A5, AGND I Analog ground BYPASS I Connect capacitor to ground for BYPASS voltage filtering. COSC I Connect capacitor to ground to set oscillation frequency. GAIN0 I Bit of gain control (TTL logic level) GAIN1 I Bit of gain control (TTL logic level) INN I Negative differential input INP I Positive differential input OUTN O Negative BTL output OUTP O Positive BTL output D5, PGND I High-current grounds E1, E7, PV DD I High-current power supplies F1, ROSC I Connect resistor to ground to set oscillation frequency. Places the amplifier in shutdown mode if a TTL logic low is placed on this terminal, and SHUTDOWN I normal operation if a TTL logic high is placed on this terminal. V DD I Analog power supply over operating free-air temperature range (unless otherwise noted) (1) UNITS Supply voltage V DD, PV DD -0.3 V to 5.5 V Input voltage, V I -0.3 V to V DD +0.3 V Continuous total power dissipation (See Dissipation Rating Table) Operating free-air temperature range, T A -40 C to C Operating junction temperature range, T J -40 C to 150 C Storage temperature range, T stg -65 C to 150 C Lead temperature mm (1/16 inch) from case for seconds 260 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE T A C DERATING FACTOR T A C T A C PW 774 mW 6.19 mW/ C 495 mW 402 mW GQC 2.61 W 20.9 mW/ C 1.67 W 1.36 W

www.ti.com RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS OPERATING CHARACTERISTICS ELECTRICAL CHARACTERISTICS TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 MIN MAX UNIT V DD, PV DD Supply voltage 2.7 5.5 V V IH High-level input voltage GAIN0, GAIN1, SHUTDOWN V V IL Low-level input voltage GAIN0, GAIN1, SHUTDOWN 0.7 V f s Switching frequency 200 300 kHz T A Operating free-air temperature -40 C at specified free-air temperature, PV DD V DD T A C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output offset voltage (measured differ- OS V I A V any gain mV entially) PSRR Power supply rejection ratio PV DD 4.9 V to 5.1 V -77 dB IH High-level input current PV DD 5.5, V I PV DD µ A IL Low-level input current PV DD 5.5, V I V µ A Supply current, no filter (with or without I DD mA speaker load) I DD(SD) Supply current, shutdown mode GAIN0, GAIN1, SHUTDOWN V 0.05 µ A PV DD V DD T A R L Ω gain dB (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT P O Output power THD 1%, f kHz, W THD N Total harmonic distortion plus noise P O 1.5 f Hz to kHz <0.2% k SVR Supply ripple rejection ratio f kHz, C BYP µ F -67 dB SNR Signal-to-noise ratio dB Output noise voltage (no-noise f Hz to V n C BYP µ µ V(rms) weighting filter) kHz Z i Input impedance >15 k Ω at specified free-air temperature, PV DD V DD 3.3 T A C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output offset voltage (measured OS V I V A V any gain mV differentially) PV DD 3.2 V PSRR Power supply rejection ratio -61 dB to 3.4 V IH High-level input current PV DD 3.3 V I PV DD µ A IL Low-level input current PV DD 3.3 V I V µ A Supply current, no filter (with or without I DD mA speaker load) I DD(SD) Supply current, shutdown mode 0.05 µ A

www.ti.com OPERATING CHARACTERISTICS TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 PV DD V DD 3.3 T A R L Ω gain dB (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT P O Output power THD 1%, f kHz 850 mW THD N Total harmonic distortion plus noise P O mW, f Hz to kHz <0.2% k SVR Supply ripple rejection ratio f kHz, C BYP µ F -61 dB SNR Signal-to-noise ratio dB Output noise voltage (no-noise V n C BYP µ f <10 Hz to kHz µ V(rms) weighting filter) Z i Input impedance >15 k Ω Table GAIN SETTINGS AMPLIFIER GAIN INPUT IMPEDANCE (dB) Ω GAIN1 GAIN0 TYP TYP 104 23.5

www.ti.com TYPICAL CHARACTERISTICS TABLE OF GRAPHS TEST SETUP FOR GRAPHS 0 0.5 1 1.5 2 Efficiency − % 100 2.5 3 3.5 PO − Output Power − W RL = 3 Ω, 33 µH Class-AB, RL = 4 Ω RL = 4 Ω, 33 µH RL = 8 Ω, 33 µH TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 FIGURE η Efficiency vs Output power FFT at 1.5-W output power vs Frequency vs Output power THD+N Total harmonic distortion plus noise vs Frequency k (SRR) Supply ripple rejection ratio vs Frequency The THD+N measurements shown do not use an LC output filter, but do use a 100- Ω 0.047- µ F RC low-pass filter with a cutoff frequency of ~30 kHz before the audio analyzer so the switching frequency does not dominate the measurement. This is done to ensure that the THD+N measured is just the audible THD+N. The THD+N measurements are shown at the highest gain for worst case. The efficiency was measured with no filters, and a Ω Ω or Ω resistor in series with a 33- µ H inductor as the load. EFFICIENCY vs OUTPUT POWER Figure

www.ti.com −150 −130 −110 −90 −70 −50 −30 −10 +10 0 4 k 8 k 12 k 16 k 20 k 24 k Power − VdB f − Frequency − Hz VDD = 5 V, RL = 4 Ω , f = 1 kHz, PO = 1.5 W THD+N − Total Harmonic Distortion Plus Noise − % VDD = 5 V, Gain = 23.5, RL = 4 Ω f = 20 kHz f = 1 kHz f = 20 Hz 0.2 0.1 0.020.02 0.01 0.001 10 m 100 m 200 m 1 PO − Output Power − W THD+N − Total Harmonic Distortion Plus Noise − % VDD = 5 V, Gain = 23.5, RL = 3 Ω f = 20 kHz f = 1 kHz f = 20 Hz 0.2 0.1 0.020.02 0.01 0.01 10 m 100 m 200 m 1 PO − Output Power − W TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 TYPICAL CHARACTERISTICS (continued) FFT AT 1.5-W OUTPUT POWER vs FREQUENCY Figure TOTAL HARMONIC DISTORTION PLUS NOISE TOTAL HARMONIC DISTORTION PLUS NOISE vs vs OUTPUT POWER OUTPUT POWER Figure Figure

www.ti.com THD+N − Total Harmonic Distortion Plus Noise − % VDD = 5 V, Gain = 23.5, RL = 8 Ω f = 20 kHz f = 1 kHz f = 20 Hz 0.2 0.1 0.020.02 0.01 0.001 10 m 100 m 200 m 1 PO − Output Power − W 0.01 0.001 20 100 200 1 k THD+N − Total Harmonic Distortion Plus Noise − % f − Frequency − Hz 2 k 20 k 0.02 0.1 0.2 PO = 1.5 W PO = 0.75 W PO = 2 W VDD = 5 V, f = 1 kHz, RL = 4 Ω 10 k 0.01 0.001 20 100 200 1 k THD+N − Total Harmonic Distortion Plus Noise − % f − Frequency − Hz 2 k 20 k 0.02 0.1 0.2 PO = 0.1 W PO = 1 W VDD = 5 V, f = 1 kHz, RL = 8 Ω PO = 0.5 W 10 k −70 −75 −80 10 100 200 −55 −45 f − Frequency −Hz −40 1 k 20 k − Supply Ripple Rejection Ratio − dB −65 −60 −50 2 k 10 k (SVR)K TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 TYPICAL CHARACTERISTICS (continued) TOTAL HARMONIC DISTORTION PLUS NOISE TOTAL HARMONIC DISTORTION PLUS NOISE vs vs OUTPUT POWER FREQUENCY Figure Figure TOTAL HARMONIC DISTORTION PLUS NOISE SUPPLY RIPPLE REJECTION RATIO vs vs FREQUENCY FREQUENCY Figure Figure

www.ti.com APPLICATION INFORMATION ELIMINATING THE OUTPUT FILTER WITH THE TPA2000D1 EFFECT ON AUDIO TRADITIONAL CLASS-D MODULATION SCHEME O V ±5 V +5 V Current OUTP Differential Voltage Across Load OUTN TPA2000D1 MODULATION SCHEME TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 This section explains why the user can eliminate the output filter with the TPA2000D1. The class-D amplifier outputs a pulse-width modulated (PWM) square wave, which is the sum of the switching waveform and the amplified input audio signal. The human ear acts as a band-pass filter such that only the frequencies between approximately Hz and kHz are passed. The switching frequency components are much greater than kHz, so the only signal heard is the amplified input audio signal. The traditional class-D modulation scheme, which is used in the TPA005Dxx family, has a differential output where each output is 180 degrees out of phase and changes from ground to the supply voltage, V DD Therefore, the differential prefiltered output varies between positive and negative V DD where filtered 50% duty cycle yields V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in Figure Even at an average of V across the load (50% duty cycle), the current to the load is high, causing high loss, and a high supply current. Figure Traditional Class-D Modulation Scheme Output Voltage and Current Waveforms Into an Inductive Load With No Input The TPA2000D1 uses a modulation scheme that still has each output switching from to the supply voltage. However, OUTP and OUTN are now in phase with each other with no input. The duty cycle of OUTP is greater than 50% and OUTN is less than 50% for positive voltages. The duty cycle of OUTP is less than 50% and OUTN is greater than 50% for negative voltages. The voltage across the load sits at V throughout most of the switching period greatly reducing the switching current, which reduces any I R losses in the load.

www.ti.com 0 V ±5 V +5 V Current OUTP OUTN Differential Voltage Across Load 0 V ±5 V +5 V Current OUTP OUTN Differential Voltage Across Load Output = 0 V Output > 0 V EFFICIENCY: WHY YOU MUST USE A FILTER WITH THE TRADITIONAL CLASS-D MODULATION TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 APPLICATION INFORMATION (continued) Figure 10. The TPA2000D1 Output Voltage and Current Waveforms Into an Inductive Load SCHEME The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is large for the traditional modulation scheme because the ripple current is proportional to voltage multiplied by the time at that voltage. The differential voltage swing is V DD and the time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive, whereas an LC filter is almost purely reactive. The TPA2000D1 modulation scheme has little loss in the load without a filter because the pulses are short and the change in voltage is V DD instead of V DD As the output power increases, the pulses widen making the ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most needed. An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow through the filter instead of the load. The filter has less resistance than the speaker that results in less power dissipated, which increases efficiency.

www.ti.com EFFECTS OF APPLYING A SQUARE WAVE INTO A SPEAKER PSPKR = PSUP ± PSUP THEORETICAL (at max output power) (1) PSPKR = POUT(PSUP / POUT ± PSUP THEORETICAL / POUT) (at max output power) (2) PSPKR = POUT(1/ηMEASURED ± 1/ηTHEORETICAL) (at max output power) (3) WHEN TO USE AN OUTPUT FILTER OUT± OUT+ TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 APPLICATION INFORMATION (continued) Audio specialists advise not to apply a square wave to speakers. If the amplitude of the waveform is high enough and the frequency of the square wave is within the bandwidth of the speaker, the square wave could cause the voice coil to jump out of the air gap and/or scar the voice coil. A 250-kHz switching frequency, however, is not significant because the speaker cone movement is proportional to 1/f for frequencies beyond the audio band. Therefore, the amount of cone movement at the switching frequency is very small. However, damage could occur to the speaker if the voice coil is not designed to handle the additional power. To size the speaker for added power, the ripple current dissipated in the load needs to be calculated by subtracting the theoretical supplied power SUP THEORETICAL from the actual supply power SUP at maximum output power OUT The switching power dissipated in the speaker is the inverse of the measured efficiency η MEASURED minus the theoretical efficiency η THEORETICAL all multiplied by P OUT The maximum efficiency of the TPA2000D1 with an Ω load is 85%. Using Equation with the efficiency at maximum power (78%), we see that there is an additional 106 mW dissipated in the speaker. The added power dissipated in the speaker is not an issue as long as it is taken into account when choosing the speaker. Design the TPA2000D1 without the filter if the traces from amplifier to speaker are short. The TPA2000D1 passed FCC and CE radiated emissions with no shielding with speaker wires eight inches long or less. Notebook PCs and powered speakers where the speaker is in the same enclosure as the amplifier are good a filter. A ferrite bead filter (shown in Figure can often be used if the design is failing radiated emissions without a filter, and the frequency sensitive circuit is greater than MHz. This is good for circuits that just have to pass FCC and CE because FCC and CE only test radiated emissions greater than MHz. If choosing a ferrite bead, choose one with high impedance at high frequencies, but low impedance at low frequencies. Use an LC output filter if there are low frequency MHz) EMI sensitive circuits and/or there are long leads from amplifier to speaker. The LC output filter is shown in Figure µ H (DCR 110 m Ω part number SCD0703T-220 M-S, manufacturer GCI) µ F The ferrite filter is shown in Figure where L is a ferrite bead. ferrite bead (part number MPZ1608S221, manufacturer TDK) nF Figure 11. Class-D Output Filter

www.ti.com GAIN SETTING VIA GAIN0 AND GAIN1 INPUTS INPUT RESISTANCE Ci IN Zi Zf Input Signal f3 dB 1

2 CiZi

(4) TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 APPLICATION INFORMATION (continued) The gain of the TPA2000D1 is set by two input terminals, GAIN0 and GAIN1. The gains listed in Table are realized by changing the taps on the input resistors inside the amplifier. This causes the input impedance i to be dependent on the gain setting. The actual gain settings are controlled by ratios of resistors, so the actual gain distribution from part-to-part is quite good. However, the input impedance can shift by up to 30% due to shifts in the actual resistance of the input resistors. For design purposes, the input network (discussed in the next section) should be designed assuming an input impedance of k Ω which is the absolute minimum input impedance of the TPA2000D1. At the higher gain settings, the input impedance can increase as high as 115 k Ω Table GAIN SETTINGS AMPLIFIER GAIN INPUT IMPEDANCE (dB) Ω GAIN1 GAIN0 TYP TYP 104 23.5 Each gain setting is achieved by varying the input resistance of the amplifier, which can range from its smallest value to over six times that value. As a result, if a single capacitor is used in the input high-pass filter, the dB or cutoff frequency also changes by over six times. The -3-dB frequency can be calculated using Equation

www.ti.com INPUT CAPACITOR, C i fc 1 2ZiCi −3 dB fc (5) Ci 1 2Zi fc (6) Ci CBYP (7) POWER SUPPLY DECOUPLING, C S MIDRAIL BYPASS CAPACITOR, C BYP TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 In the typical application an input capacitor i is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, C i and the input impedance of the amplifier i form a high-pass filter with the corner frequency determined in Equation The value of C i is important because it directly affects the bass (low frequency) performance of the circuit. Consider the example where Z i is k Ω and the specification calls for a flat bass response down to Hz. Equation is reconfigured as Equation In this example, C i is 0.1 µ so one would likely choose a value in the range of 0.1 µ F to µ If the gain is known and constant, use Z i from Table to calculate C i A further consideration for this capacitor is the leakage path from the input source through the input network i and the feedback network to the load. This leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially in high gain applications. For this reason, a low-leakage tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most V DD /2, which is likely higher than the source dc level. It is important to confirm the capacitor polarity in the application. C i must be times smaller than the bypass capacitor to reduce clicking and popping noise from power on/off and entering and leaving shutdown. After sizing C i for a given cutoff frequency, size the bypass capacitor to times that of the input capacitor. The TPA2000D1 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1 µ F placed as close as possible to the device V DD lead works best. For filtering lower-frequency noise signals, a larger aluminum electrolytic capacitor of µ F or greater placed near the audio power amplifier is recommended. The midrail bypass capacitor BYP is the most critical capacitor and serves several important functions. During start-up or recovery from shutdown mode, C BYP determines the rate at which the amplifier starts up. The second function is to reduce noise produced by the power supply caused by coupling into the output drive signal. This noise is from the midrail generation circuit internal to the amplifier, which appears as degraded PSRR and THD+N. Bypass capacitor BYP values of 0.47- µ F to µ F ceramic or tantalum low-ESR capacitors are recommended for the best THD and noise performance.

www.ti.com CBYP 10 Ci (8) DIFFERENTIAL INPUT SHUTDOWN MODES USING LOW-ESR CAPACITORS TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 Increasing the bypass capacitor reduces clicking and popping noise from power on/off and entering and leaving shutdown. To have minimal pop, C BYP should be times larger than C i The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To use the TPA2000D1 EVM with a differential source, connect the positive lead of the audio source to the INP input and the negative lead from the audio source to the INN input. To use the TPA2000D1 with a single-ended source, ac ground the INN input through a capacitor and apply the audio single to the input. In a single-ended input application, the INN input should be ac-grounded at the audio source instead of at the device input for best noise performance. The TPA2000D1 employs a shutdown mode of operation designed to reduce supply current DD to the absolute minimum level during periods of nonuse for battery-power conservation. The SHUTDOWN input terminal should be held high during normal operation when the amplifier is in use. Pulling SHUTDOWN low causes the outputs to mute and the amplifier to enter a low-current state, I DD(SD) µ SHUTDOWN should never be left unconnected because amplifier operation would be unpredictable. Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance, the more the real capacitor behaves like an ideal capacitor.

www.ti.com SWITCHING FREQUENCY fs 6.6 ROSC COSC (9) APPLICATION CIRCUIT INP INN SHUTDOWN GAIN0 GAIN1 PVDD OUTP PGND BYPASS AGND COSC ROSC VDD PVDD OUTN PGND TPA2000D1 1 µF 1 µF 1 µF 220 pF R1 120 kΩ 1 µFC3 1 µF 1 µF 10 µF OUT+ VDD OUT± Audio Input± VDD To System Controller Audio Input+ Gain Select Gain Select VDD TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 The switching frequency is determined using the values of the components connected to ROSC (pin 13) and COSC (pin 14) and are calculated using Equation The switching frequency was chosen to be centered on 250 kHz. This frequency represents the optimization of audio fidelity due to oversampling and the maximization of efficiency by minimizing the switching losses of the amplifier. The recommended values are a resistance of 120 k Ω and a capacitance of 220 pF. Using these component values, the amplifier operates properly by using tolerance resistors and 10% tolerance capacitors. The tolerance of the components can be changed as long as the switching frequency remains between 200 kHz and 300 kHz. Within this range, the internal circuitry of the device provides stable operation. Table TPA2000D1 APPLICATION CIRCUIT BILL OF MATERIALS REFERENCE Capacitor, ceramic, 220 pF, 10%, XICON, V 0805 Mouser 140-CC501B221K Capacitor, ceramic, µ +80%/-20%, Y5V, V 0805 Murata GRM40-Y5V105Z16 Capacitor, ceramic, µ +80%/-20%, Y5V, V 1210 Murata GRM235-Y5V106Z16 Resistor, chip, 120 k Ω 5%, XICON 0805 Mouser 260-120K IC, TPA2000D1, audio power amplifier, 2-W, single 24-pin TI TPA2000D1PW channel, class-D TSSOP

www.ti.com LOW SUPPLY VOLTAGE POP INN 1 M 1 M 1 M 1 M VDD VDD INP TPA2000D1 Audio In TPA2000D1 SLOS328F JUNE 2000 REVISED MARCH 2004 The TPA2000D1 pops when coming out of shutdown at low supply voltages (3.3 V and less) when using the application schematic shown above. The pops occur because the common-mode input range is worse at the lower supply voltages. At low supply voltages, the inputs are not within the common-mode input range when coming out of shutdown. The outputs develop an offset voltage until the inputs settle within the common-mode input range. This causes a pop. Figure shows 1-M Ω resistors added to form voltage dividers. The voltage dividers bias the inputs to V DD that keeps the pop low at turn on and when coming out of shutdown. The resistors should be tolerance to ensure the offset voltage is not increased. Figure 12. Voltage Dividers

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TPA2000D1PW Active Production TSSOP (PW) | 16 90 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 2000D1 TPA2000D1PW.A Active Production TSSOP (PW) | 16 90 | TUBE Yes NIPDAU Level-1-260C-UNLIM -40 to 85 2000D1 TPA2000D1PWR Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 2000D1 TPA2000D1PWR.A Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 2000D1 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPA2000D1 : Addendum-Page 1

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• Automotive : TPA2000D1-Q1 NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2000D1PWR TSSOP PW 16 2000 356.0 356.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) TPA2000D1PW PW TSSOP 16 90 530 10.2 3600 3.5 TPA2000D1PW.A PW TSSOP 16 90 530 10.2 3600 3.5 Pack Materials-Page 3

www.ti.com PACKAGE OUTLINE C 14X 0.65 4.55 16X 0.30 0.19 TYP6.6 6.2

1.2 MAX

0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 5.1 4.9 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 8 9 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 8 9

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