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FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR-RoHS & HF Y o u r P e r f e c t I n d u c t o r Rev.1701 TP 4210-R TYPE

  • FEATURE 1. Low profile and small size (Height: 1.00mm Max) 2. High current capacity, Large terminal surface for good PCB bonding
  • Applications 1. Digital Camera, Portable CDR-W, Camcorder and others
  • Shape and Dimension ●Schematics and Land Patterns(mm)
  • Specification Part Number L(uH) Marking DCR( Ω Max) IDC(A)(Max) TP4210-1R0M-R 1.0±20% 0.120 3.00 TP4210-2R2M-R 2.2±20% 0.180 2.40 TP4210-3R3M-R 3.3±20% 0.216 1.80 TP4210-4R7M-R 4.7±20% 0.252 1.45 TP4210-5R6M-R 5.6±20% 0.336 1.35 TP4210-6R8M-R 6.8±20% 0.360 1.20 TP4210-8R2M-R 8.2±20% 0.432 1.15 TP4210-100M-R 10±20% 0.456 1.05 TP4210-150M-R 15±20% 0.750 0.90 TP4210-220M-R 22±20% 1.044 0.70 TP4210-330M-R 33±20% 1.848 0.55 TP4210-470M-R 47±20% 2.172 0.45 Note1. Measurement frequency of Inductance value : at 1MHz Note2. Measurement ambient temperature of L, DCR and IDC : at 25℃ Note3. IDC : △L/L≦20%(This indicates the value of current when the inductances is 20% lower than its initial Note4. Inductance tolerance: M: ±20% Note5. Packaging: Taping ; Quantity : 1000 Piece/reel A AA B B C C D D E E F F G G H H I I J J K K L L A CB Black Marking EPOXY 3.70REF 1.20REF 4.20REF mold

FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR-RoHS & HF Y o u r P e r f e c t I n d u c t o r Rev.1701 GENERAL CHARACTERISTICS 1. Operating temperature range: -40 TO + 105 (I ncludes temperature when the coil is heated)℃ 2. External appearance: On visual inspection, the coil has no external defects. 3. Terminal strength: After soldering. Between copper plat e and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 5. 0N 60 sec. 4. Insulating resistance: Over 100M Ω at 100V D.C. between coil and core. 5. Dielectric strength: No dielectric breakdow n at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics: Indu ctance coefficient (0~2,000)x10-6/℃(-25~+80℃ degree Celsius), inductance deviation within±5.0%, after 96 hours. 7. Humidity characteristics(Moisture Resistance): Indu ctance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2℃and 1 hour drying under normal condition. 8. Vibration resistance: Inductance deviation within ±5%, af ter vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes. 9. Shock resistance: Inductance deviation within ±5 %, after being dropped once with 981m/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260℃, 10 seconds(See attached recommend reflow) 11. Storage condition: Temperature Range: 0 ℃ ~ 35 ℃；-40℃ ~ 105 ℃ (after PCB) ，Humidity Range: 50% ~ 70% RH 12. Use components within 12 months. If 12 months or more have elapsed, check solderability before use. 13. Reflow profile recommend: 260 ℃ 230 ℃ 300 250 200 150 100 T( ℃ ) T(s 300240180120600 Lead-free heat endurance test 245℃ Peak 230℃ 170±10℃,60-120 S 300 250 200 150 100 T(℃) T(s) 300240180120600 Lead-free the recommended reflow condition