TP3420AV309 NSC | Alldatasheet

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Gloria Gordon 1-408-721-8435 MSL Rating Peak Body Temp C MaxTime (Sec) Cycles 3 220 30 4 Document Date Weight (mg) Unit Type 5-May-2007 676.000 Each Item Weight (mg) Component CAS# Weight (mg) Item-ppm Part-ppm Plastic 452.200 SiO2 60676-86-0 339.150 750,000 501,701 Epoxy Resin 25928-94-3 104.910 232,000 155,193 Sb2O3 1309-64-4 5.426 12,000 8,027 Brominated Epoxy 40039-93-8 2.713 6,000 4,014 Leadframe 189.540 Cu 7440-50-8 184.707 974,500 273,235 Fe 7439-89-6 4.549 24,000 6,729 Zn 7440-66-6 0.227 1,200 336 P 7723-14-0 0.057 300 84 Ext. LeadFinish 18.080 Sn 7440-31-5 15.368 850,000 22,734 Pb 7439-92-1 2.712 150,000 4,012 Chip 12.580 Si 7440-21-3 12.505 994,000 18,498 Al 7429-90-5 0.075 6,000 112 Int. LeadFinish 1.400 Ag 7440-22-4 1.400 1,000,000 2,071 Die Attach 1.280 Ag 7440-22-4 0.960 750,000 1,420 Epoxy Resin 25928-94-3 0.320 250,000 473 Wires 0.920 Au 7440-57-5 0.920 1,000,000 1,361 RoHS Directive 2002/95/EC Gerry Fields Vice President Quality Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing. Additionally, the following should be noted: 1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties. 2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary. Part Number Homogeneous Material Composition Declaration for Electronic Products Contains Lead(Pb) and is NOT European RoHS Compliant. TP3420AV309 NOT China RoHS Compliant National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in connection with the information provided herein unless otherwise provided by a written contract signed by both parties. NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION. Company http://www.national.com/quality/green/ URL for Additional Information Green.project@nsc.com Email National Semiconductor Engineering Project Manager Title RoHS Material Composition Declaration RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date. 1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances 2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A threshold levels, except lead in RoHS exempt applications 5, 7a and 7c. 2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in solder and RoHS exempt applications 5, 7a and 7c. 3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at www.national.com/quality/green/. 4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that Deplete the Ozone Layer and U.S. Clean Air Act, Title VI. National Semiconductor Page 1 of 3

Use Material Cd CrVl Pb Hg PBB PBDE Ref # Device CHIP <1 <1 <1 <1 <1 <1 1000 COMPOUND DIEATTACH EXTLF <2 <2 149000 <2 NA NA 56 FRAME <100 <1000 <1000 <1000 <1000 <1000 9990 Ref #

1000 Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-07

56 Analysis on 04/27/2007 by SGS per Report# LPCI/07440/07

75 Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007

9990 Analysis pending

Banned Substance Monitoring * Unless otherwise noted, units are in PPM (parts-per-million) * Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected 3rd Party Analysis (available upon request, subject to a non-disclosure agreement) Document Date 5-May-2007 Part Number TP3420AV309 Contains Lead(Pb) and is NOT European RoHS Compliant. NOT China RoHS Compliant National Semiconductor Page 2 of 3

产品名称 Product Name 部件名称 铅 汞 镉 六价铬 多溴联苯 多溴二苯醚 Part (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) 集成电路 Integrated Circuit 美国国家半导体 《电子信息产品污染控制管理办法》的声明 China RoHS Declaration 美国国家半导体的产品不会含有镉、汞、六价铬、多溴联苯(PBB) 和二苯醚(PBDE)。 有毒有害物质或元素 Toxic and harmful substances or elements O：表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T 11363-2006 标准规定的限量要求以下。 X：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 标准规定的限量要求。 O：Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T 11363-2006. O "Electronic Information Products Pollution Control Measures" Statement X：Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit requirement in SJ/T 11363-2006. X O O O O 环保使用期限(epup) 是指以符号在这里展出. 环保使用期限(epup) 的有效期只有当产品使用范围以内的数据表中的规格. The Environmental Protection Use Period (EPUP) is defined by the symbol shown here. The Environmental Protection Use Period (EPUP) is valid only when product is used within the limits of the data sheet specifications. National Semiconductor's products will not contain cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and diphenyl ether (PBDE). TP3420AV309