TP3054WMX

TP3054WMX NSC | Alldatasheet

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Gloria Gordon 1-408-721-8435 MSL Rating Peak Body Temp C MaxTime (Sec) Cycles 4 220 30 4 Document Date Weight (mg) Unit Type 1-Sep-2007 420.000 Each Item Weight (mg) Component CAS# Weight (mg) Item-ppm Part-ppm Plastic 305.050 SiO2 60676-86-0 211.278 692,600 503,042 Epoxy Resin 25928-94-3 85.414 280,000 203,367 Sb2O3 1309-64-4 6.101 20,000 14,526 Brominated Epoxy 40039-93-8 2.257 7,400 5,375 Leadframe 101.910 Cu 7440-50-8 99.311 974,500 236,455 Fe 7439-89-6 2.446 24,000 5,823 Zn 7440-66-6 0.122 1,200 291 P 7723-14-0 0.031 300 73 Ext. LeadFinish 6.350 Sn 7440-31-5 5.398 850,000 12,851 Pb 7439-92-1 0.953 150,000 2,268 Chip 5.350 Si 7440-21-3 5.318 994,000 12,662 Al 7429-90-5 0.032 6,000 76 Die Attach 0.570 Ag 7440-22-4 0.428 750,000 1,018 Epoxy Resin 25928-94-3 0.143 250,000 339 Int. LeadFinish 0.470 Ag 7440-22-4 0.470 1,000,000 1,119 Wires 0.300 Au 7440-57-5 0.300 1,000,000 714 RoHS Directive 2002/95/EC Gerry Fields Vice President Quality Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing. Additionally, the following should be noted: 1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties. 2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary. Part Number Homogeneous Material Composition Declaration for Electronic Products Contains Lead(Pb) and is NOT European RoHS Compliant. TP3054WMX NOT China RoHS Compliant National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in connection with the information provided herein unless otherwise provided by a written contract signed by both parties. NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION. Company http://www.national.com/quality/green/ URL for Additional Information Green.project@nsc.com Email National Semiconductor Engineering Project Manager Title RoHS Material Composition Declaration RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date. 1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances 2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A threshold levels, except lead in RoHS exempt applications 5, 7a and 7c. 2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in solder and RoHS exempt applications 5, 7a and 7c. 3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at www.national.com/quality/green/. 4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that Deplete the Ozone Layer and U.S. Clean Air Act, Title VI. National Semiconductor Page 1 of 3

Use Material Cd CrVl Pb Hg PBB PBDE Ref # Device CHIP <1 <1 <1 <1 <1 <1 1000 COMPOUND <2 <2 <2 <2 <100 <100 564 EXTLF <2 <2 149000 <2 NA NA 56 FRAME <2 <2 <2 <2 NA NA 51 Ref #

1000 Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-07

32 Analysis on 05/16/2007 by ALS per Report# ATJB/3488BS/2007

51 Analysis on 03/13/2007 by SGS per Report# LPCI/05141/07

56 Analysis on 04/27/2007 by SGS per Report# LPCI/07440/07

75 Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007

564 Analysis on 04/27/2007 by SGS per Report# LPCI/07426/07

Banned Substance Monitoring * Unless otherwise noted, units are in PPM (parts-per-million) * Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected 3rd Party Analysis (available upon request, subject to a non-disclosure agreement) Document Date 1-Sep-2007 Part Number TP3054WMX Contains Lead(Pb) and is NOT European RoHS Compliant. NOT China RoHS Compliant National Semiconductor Page 2 of 3

产品名称 Product Name 部件名称 铅 汞 镉 六价铬 多溴联苯 多溴二苯醚 Part (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) 集成电路 Integrated Circuit 美国国家半导体 《电子信息产品污染控制管理办法》的声明 China RoHS Declaration 美国国家半导体的产品不会含有镉、汞、六价铬、多溴联苯(PBB) 和二苯醚(PBDE)。 有毒有害物质或元素 Toxic and harmful substances or elements O：表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T 11363-2006 标准规定的限量要求以下。 X：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 标准规定的限量要求。 O：Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T 11363-2006. O "Electronic Information Products Pollution Control Measures" Statement X：Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit requirement in SJ/T 11363-2006. X O O O O 环保使用期限(epup) 是指以符号在这里展出. 环保使用期限(epup) 的有效期只有当产品使用范围以内的数据表中的规格. The Environmental Protection Use Period (EPUP) is defined by the symbol shown here. The Environmental Protection Use Period (EPUP) is valid only when product is used within the limits of the data sheet specifications. National Semiconductor's products will not contain cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and diphenyl ether (PBDE). TP3054WMX