TP3057BDWR TI1 | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 17

Technical content

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Complete PCM Codec and Filtering Systems Includes: – Transmit High-Pass and Low-Pass Filtering – Receive Low-Pass Filter With (sin x)/x Correction – Active RC Noise Filters – µ-Law or A-Law Compatible Coder and Decoder – Internal Precision Voltage Reference – Serial I/O Interface – Internal Autozero Circuitry /C0068µ-Law – TP3054B and TP13054B /C0068A-Law – TP3057B and TP13057B /C0068± 5-V Operation /C0068Low Operating Power...5 0 m W T y p /C0068Power-Down Standby Mod e...3 m W T y p /C0068Automatic Power Down /C0068TTL- or CMOS-Compatible Digital Interface /C0068Maximizes Line Interface Card Circuit Density /C0068Improved Versions of National Semiconductor TP3054, TP3057, TP3054-X, TP3057-X

description

The TP3054B, TP3057B, TP13054B, and TP13057B are comprised of a single-chip PCM codec (pulse-code-modulated encoder and de- coder) and PCM line filter. These devices provide all the functions required to interface a full-duplex (2-wire) voice telephone circuit with a TDM (time-division-multiplexed) system. These de- vices are pin-for-pin compatible with the National Semiconductor TP3054B and TP3057B, respec- tively. Primary applications include:

  • Line interface for digital transmission and switching of T1 carrier, PABX, and central office telephone systems
  • Subscriber line concentrators
  • Digital-encryption systems
  • Digital voice-band data-storage systems
  • Digital signal processing These devices are designed to perform the transmit encoding (A/D conversion) and receive decoding (D/A conversion) as well as the transmit and receive filtering functions in a PCM system. They are intended to be used at the analog termination of a PCM line or trunk. The devices require two transmit and receive master clocks that may be asynchronous (1.536 MHz, 1.544 MHz, or 2.048 MHz), transmit and receive data clocks that are synchronous with the master clock (but can vary from 64 kHz to 2.048 MHz), and transmit and receive frame-sync pulses. The TP3054B, TP3057B, TP13054B, and TP13057B provide the band-pass filtering of the analog signals prior to encoding and after decoding of voice and call progress tones. The TP3054B and TP13054B contain patented circuitry to achieve low transmit channel idle noise and are not recommended for applications in which the composite signals on the transmit side are below –55 dBm0. The TP3054B and TP3057B are characterized for operation from 0°C to 70°C. The TP13054B and TP13057B are characterized for operation from –40°C to 85°C. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the CMOS gates. Copyright  1996, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. VBB ANLG GND VFRO VCC FSR DR BCLKR/CLKSEL MCLKR/PDN VFXI+ VFXI– GSX TSX FSX DX BCLKX MCLKX DW OR N PACKAGE (TOP VIEW)

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

–5 V FSX 5 V 9 8 10 7 12 5 MCLKX MCLKR/ PDN BCLKX BCLKR/ CLKSEL FSR TSX Power Amplifier Timing and Control DR CLK Receive Regulator S/H DAC RC Active Filter 11 DX OE Transmit Regulator A/D Control Logic Comparator Voltage Reference Autozero Logic S/H DAC Switched- Capacitor Band-Pass Filter RC Active Filter VFRO VFXI+ 16 R115VFXI– Analog Input Switched- Capacitor Low-Pass Filter

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Terminal Functions TERMINAL NAME NO. ANLG GND 2 Analog ground. All signals are referenced to ANLG GND. BCLKR/CLKSEL 7 The bit clock that shifts data into DR after the FSR leading edge. May vary from 64 kHz to 2.048 MHz. Alternately, BCLKR/CLKSEL can be a logic input that selects either 1.536 MHz/1.544 MHz or 2.048 MHz for the master clock in the synchronous mode. BCLKX is used for both transmit and receive directions (see Table 1). BCLKX 10 The bit clock that shifts out the PCM data on DX. BCLKX can vary from 64 kHz to 2.048 MHz, but must be synchronous with MCLKX. DR 6 Receive data input. PCM data is shifted into DR following the FSR leading edge. DX 11 The 3-state PCM data output that in enabled by FSX FSR 5 Receive frame-sync pulse input that enables BCLKR to shift PCM data in DR. FSR is an 8-kHz pulse train (see Figures 1 and 2 for timing details). FSX 12 Transmit frame-sync pulse that enables BCLKX to shift out the PCM data on DX. FSX is an 8-kHz pulse train (see Figures 1 and 2 for timing details). GSX 14 Analog output of the transmit input amplifier. GSX is used to externally set gain. MCLKR/PDN 8 Receive master clock (must be 1.536 MHz, 1.544 MHz, or 2.048 MHz). May be synchronous with MCLKX, but should be synchronous with MCLKX for best performance. When MCLKR is connected continuously low, MCLKX is selected for all internal timing. When MCLKR is connected continuously high, the device is powered down. TSX 13 Open-drain output that pulses low during the encoder time slot VBB 1 Negative power supply pin. VBB = –5 V ± 5% VCC 4 Positive power supply pin. VCC = 5 V ± 5% VFRO 3 Analog output of the receive filter VFXI+ 16 Noninverting input of the transmit input amplifier VFXI– 15 Inverting input of the transmit input amplifier

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltages are with respect to GND. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE T A = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING DW 1025 mW 8.2 mW/°C 656 mW 533 mW N 1150 mW 9.2 mW/°C 736 mW 598 mW recommended operating conditions (see Note 2) MIN NOM MAX UNIT Supply voltage, VCC 4.75 5 5.25 V Supply voltage, VBB –4.75 –5 –5.25 V High-level input voltage, VIH 2.2 V Low-level input voltage, VIL 0.6 V Common-mode input voltage range, VICR‡ ± 2.5 V Load resistance, GSX, RL 10 kΩ Load capacitance, GSX, CL 50 pF O perating free air temperature TA TP3054B, TP3057B 0 70 °COperating free-air temperature, TA TP13054B, TP13057B –40 85 ‡ Measured with CMRR > 60 dB. NOTE 2: To avoid possible damage to these CMOS devices and resulting reliability problems, the power-up procedure described in the device power-up sequence paragraphs later in this document should be followed.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) supply current PARAMETER TEST CONDITIONS TP305xB TP1305xB UNITPARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT ICC Supply current from VCC Power down No load 0.5 1 0.5 1.2 mAICC Supply current from VCC Active No load 6 9 6 10 mA IBB Supply current from VBB Power down No load 0.5 1 0.5 1.2 mAIBB Supply current from VBB Active No load 6 9 6 10 mA electrical characteristics at VCC = 5 V± 5%, VBB = –5 V± 5%, GND at 0 V, TA = 25°C (unless otherwise noted) digital interface PARAMETER TEST CONDITIONS MIN MAX UNIT VOH High-level output voltage DX IH = –3.2 mA 2.4 V VOL Low level output voltage DX IL = 3.2 mA 0.4 VVOL Low-level output voltage TSX IL = 3.2 mA, Drain open 0.4 V IIH High-level input current VI = VIH to VCC ± 10 µA IIL Low-level input current All digital inputsVI = GND to VIL ± 10 µA VOL Output current in high-impedance state DX VO = GND to VCC ± 10 µA analog interface with transmit amplifier input PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT II Input current VFXI+ or VFXI – VI = –2.5 V to 2.5 V ± 200 nA ri Input resistance VFXI+ or VFXI – VI = –2.5 V to 2.5 V 10 M Ω ro Output resistance Closed loop, Unity gain 1 3 Ω Output dynamic range GSX R L ≥ 10 kΩ ± 2.8 V AV Open-loop voltage amplification VFXI+ to GSX 5000 BI Unity-gain bandwidth GSX 1 2 MHz VIO Input offset voltage VFXI+ or VFXI – ± 20 mV CMRR Common-mode rejection ratio 60 dB KSVR Supply-voltage rejection ratio 60 dB † All typical values are at VCC = 5 V, VBB = –5 V, and TA = 25°C. analog interface with receive filter PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT Output resistance VFRO 1 3 Ω Load resistance VFRO = ± 2.5 V 600 Ω Load capacitance VFRO to GND 500 pF Output dc offset voltage VFRO to GND ± 200 mV † All typical values are at VCC = 5 V, VBB = –5 V, and TA = 25°C.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

operating characteristics, over operating free-air temperature range, VCC = 5 V ± 5%, VBB = –5 V± 5%, GND at 0 V, VI = 1.2276 V, f = 1.02 kHz, transmit input amplifier connected for unity gain, noninverting (unless otherwise noted) timing requirements PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT fclock(M) Frequency of master clock MCLKX and MCLKR Depends on the device used and BCLKX/CLKSEL 1.536 1.544 2.048 MHz fclock(B) Frequency of bit clock, transmit BCLKX 64 2.048 kHz tw1 Pulse duration, MCLKX and MCLKR high 160 ns tw2 Pulse duration, MCLKX and MCLKR low 160 ns tr1 Rise time of master clock MCLKX and MCLKR Measured from 20% to 80% 50 ns tf1 Fall time of master clock MCLKX and MCLKR Measured from 20% to 80% 50 ns tr2 Rise time of bit clock, transmit BCLKX Measured from 20% to 80% 50 ns tf2 Fall time of bit clock, transmit BCLKX Measured from 20% to 80% 50 ns tsu1 Setup time, BCLKX high (and FSX in long-frame sync mode) before MCLKX↓ First bit clock after the leading edge of FSX 100 ns tw3 Pulse duration, BCLKX and BCLKR high VIH = 2.2 V 160 ns tw4 Pulse duration, BCLKX and BCLKR low VIL = 0.6 V 160 ns th1 Hold time, frame sync low after bit clock low (long frame only) 0 ns th2 Hold time, BCLKX high after frame sync↑ (short frame only) 0 ns tsu2 Setup time, frame sync high before bit clock↓ (long frame only) 80 ns td1 Delay time, BCLKX high to data valid Load = 150 pF plus 2 LSTTL loads‡ 0 140 ns td2 Delay time, BCLKX high to TSX low Load = 150 pF plus 2 LSTTL loads‡ 140 ns td3 Delay time, BCLKX (or 8 clock FSX in long frame only) low to data output disabled 50 165 ns td4 Delay time, FSX or BCLKX high to data valid (long frame only) C L = 0 pF to 150 pF 20 165 ns tsu3 Setup time, DR valid before BCLKR↓ 50 ns th3 Hold time, DR valid after BCLKR or BCLKX↓ 50 ns tsu4 Setup time, FSR or FSX high before BCLKR or BCLKR ↓ Short-frame sync pulse (1 or 2 bit clock periods long) (see Note 3) 50 ns th4 Hold time, FSX or FSR high after BCLKX or BCLKR↓ Short-frame sync pulse (1 or 2 bit clock periods long) (see Note 3) 100 ns th5 Hold time, frame sync high after bit clock↓ Long-frame sync pulse (from 3 to 8 bit clock periods long) 100 ns tw5 Minimum pulse duration of the frame sync pulse (low level) 64 kbps operating mode 160 ns † All typical values are at VCC = 5 V, VBB = –5 V, and TA = 25°C. ‡ Nominal input value for an LSTTL lead is 18 kΩ . NOTE 3: For short-frame sync timing, FSR and FSX must go high while their respective bit clocks are high.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996 7POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 filter gains and tracking errors PARAMETER TEST CONDITIONS ‡ MIN TYP † MAX UNIT Maximum peak transmit overload level TP3054B, TP13054B 3.17 dBm0 2.501 VMa ximum peak transmit overload level TP3057B, TP13057B 3.14 dBm0 2.492 V Transmit filter gain, absolute (at 0 dBm0) TA = 25°C – 0.15 0.15 dB f = 16 Hz –40 f = 50 Hz –30 f = 60 Hz –26 f = 200 Hz –1.8 –0.1 Transmit filter gain relative to absolute f = 300 Hz to 3000 Hz –0.15 0.15 dBTransmit filter gain, relative to absolute f = 3300 Hz –0.35 0.05 dB f = 3400 Hz –0.8 0 f = 4000 Hz –14 f ≥ 4600 Hz (measure response from

0 Hz to 4000 Hz) –32

Absolute transmit gain variation with temperature and supply voltage Relative to absolute transmit gain See Note 4 –0.1 0.1 dB Sinusoidal test method, Reference level = –10 dBm0 Transmit gain tracking error with level 3 dBm0 ≥ input level ≥ –40 dBm0 ± 0.2 dBgg –40 dBm0 > input level ≥ –50 dBm0 ± 0.4 –50 dBm0 > input level ≥ –55 dBm0 ± 0.8 Receive filter gain, absolute (at 0 dBm0) Input is digital code sequence for 0 dBm0 signal, T A = 25°C –0.15 0.15 dB f = 0 Hz to 3000 Hz, TA = 25°C –0.15 0.15 Receive filter gain relative to absolute f = 3300 Hz –0.35 0.05 dBReceive filter gain, relative to absolute f = 3400 Hz –0.8 0 dB f = 4000 Hz –14 Absolute receive gain variation with temperature and supply voltage TA = full range, See Note 4 –0.1 0.1 dB Sinusoidal test method; reference input PCM code corresponds to an ideally encoded –10 dBm0 signal Receive gain tracking error with level 3 dBm0 ≥ input level ≥ –40 dBm0 ± 0.2 dB –40 dBm0 > input level ≥ –50 dBm0 ± 0.4 –50 dBm0 > input level ≥ –55 dBm0 ± 0.8 Receive output drive voltage R L = 10 kΩ ± 2.5 V Transmit and receive gain tracking error with level (A-law Pseudo noise test method; reference input PCM code corresponds to an ideally encoded –10 dBm0 signalTransmit and receive gain tracking error with level (A-law, CCITT C 712) 3 dBm0 ≥ input level ≥ –40 dBm0 ± 0.25 dB) –40 dBm0 > input level ≥ –50 dBm0 ± 0.3 –50 dBm0 > input level ≥ –55 dBm0 ± 0.45 † All typical values are at VCC = 5 V, VBB = –5 V, and TA = 25°C. ‡ Absolute rms signal levels are defined as follows: VI = 1.2276 V = 0 dBm0 = 4 dBm at f = 1.02 kHz with RL = 600 Ω . NOTE 4: Full range for the TP3054B and TP3057B is 0°C to 70°C. Full range for the TP13054B and TP13057B is –40°C to 85°C.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

envelope delay distortion with frequency PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT Transmit delay, absolute (at 0 dBm0) f = 1600 Hz 290 315 µs f = 500 Hz to 600 Hz 195 220 f = 600 Hz to 800 Hz 120 145 f = 800 Hz to 1000 Hz 50 75 Transmit delay, relative to absolute f = 1000 Hz to 1600 Hz 20 40 µs f = 1600 Hz to 2600 Hz 55 75 f = 2600 Hz to 2800 Hz 80 105 f = 2800 Hz to 3000 Hz 130 155 Receive delay, absolute (at 0 dBm0) f = 1600 Hz 180 200 µs f = 500 Hz to 1000 Hz –40 –25 f = 1000 Hz to 1600 Hz –30 –20 Receive delay, relative to absolute f = 1600 Hz to 2600 Hz 70 90 µs f = 2600 Hz to 2800 Hz 100 125 µs f = 2800 Hz to 3000 Hz 140 175 † All typical values are at VCC = 5 V, VBB = –5 V, and TA = 25°C. noise PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT Transmit noise, C-message weighted‡ TP3054B, TP13054B VFXI = 0 V 5 9 dBrnC0 Transmit noise, psophometric weighted (see Note 5) TP3057B, TP13057B VFXI = 0 V –74 –69 dBm0p Receive noise, C-message weighted TP3054B, TP13054B PCM code equals alternating positive and negative zero 2 4 dBrnC0 Receive noise, psophometric weighted TP3057B, TP13057B PCM code equals positive zero –86 –83 dBm0p Noise, single frequency VFXI+ = 0 V, f = 0 kHz to 100 kHz, Loop-around measurement –53 dBm0 † All typical values are at VCC = 5 V, VBB = –5 V, and TA = 25°C. ‡ This parameter is achieved through use of patented circuitry and is not recommended for applications in which the composite signals on the transmit side are below –55 dBm0. NOTE 5: Measured by extrapolation from the distortion test result.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996 9POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 power supply rejection PARAMETER TEST CONDITIONS MIN MAX UNIT V 5 V 100 V f=0H zt o4k H z A-law 38 dB Positive power-supply rejection, transmitVCC = 5 V + 100 mVrms, VFXI+ = –50 dBm0 f = 0 H z to 4 kHz µ-law 38 dBC † VFXI+ = –50 dBm0 f = 4 kHz to 50 kHz 40 dB V 5 V 100 V f=0H zt o4k H z A-law 35 dB Negative power-supply rejection, transmitVBB = –5 V + 100 mVrms, VFXI+ =–50 dBm0 f = 0 H z to 4 kHz µ-law 35 dBC † VFXI+ = –50 dBm0 f = 4 kHz to 50 kHz 40 dB PCM d l iti f=0H zt o4k H z A-law 40 dB Positive power-supply rejection, receivePCM code equals positive zero, VCC =5V+1 0 0m V r m s f = 0 H z to 4 kHz µ-law 40 dBC † VCC = 5 V + 100 mVrms f = 4 kHz to 50 kHz 40 dB PCM d l iti f=0H zt o4k H z A-law 38 dB Negative power-supply rejection, receivePCM code equals positive zero, VBB = –5 V + 100 mVrms f = 0 H z to 4 kHz µ-law 38 dBC † VBB = –5 V + 100 mVrms f = 4 kHz to 50 kHz 40 dB Spurious out-of-band signals at the 0 dBm0, 300-Hz to 3400-Hz input applied to DR (measure individual image signals at VFRO) –30 dB S urious out of band signals at the channel output (VFRO) f = 4600 Hz to 7600 Hz –33 dB f = 7600 Hz to 100 kHz –40 dB † The unit dBC applies to C-message weighting. distortion PARAMETER TEST CONDITIONS MIN MAX UNIT Level = 3 dBm0 33 Level = 0 dBm0 to –30 dBm0 36 †Signal to distortion ratio transmit or receive half channel‡ Level = 40 dBm0 Transmit 29 dBC †Signal-to-distortion ratio, transmit or receive half-channel‡ Level = –40 dBm0 Receive 30 dBC † Level = 55 dBm0 Transmit 14 Level = –55 dBm0 Receive 15 Single-frequency distortion products, transmit –46 dB Single-frequency distortion products, receive –46 dB Intermodulation distortion Loop-around measurement, VFXI+ = –4 dBm0 to –21 dBm0, Two frequencies in the range of 300 Hz to 3400 Hz –41 dB Level = –3 dBm0 33 Si l di i i i h lf h l (A l ) Level = –6 dBm0 to –27 dBm0 36 Signal-to-distortion ratio, transmit half-channel (A-law) (CCITT G 714)§ Level = –34 dBm0 33.5 dB(CCITT G .714)§ Level = –40 dBm0 28.5 Level = –55 dBm0 13.5 Level = –3 dBm0 33 Si l t di t ti ti i h lf h l (A l ) Level = –6 dBm0 to –27 dBm0 36 Signal-to-distortion ratio, receive half-channel (A-law) (CCITT G 714)§ Level = –34 dBm0 34.2 dB(CCITT G .714)§ Level = –40 dBm0 30 Level = –55 dBm0 15 † The unit dBC applies to C-message weighting. ‡ Sinusoidal test method (see Note 6) § Pseudo-noise test method NOTE 6: The TP3054B and TP13054B are measured using a C-message filter. The TP3057B and the TP13057B are measured using a psophometric weighted filter.

10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

† All typical values are at VCC = 5 V, VBB = –5 V, and TA = 25°C. NOTE 7: Receive-to-transmit crosstalk is measured with a – 50 dBm0 activation signal applied at VFXI+. Figure 1. Short-Frame Sync Timing

Figure 2. Long-Frame Sync Timing

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996

12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

system reliability and design considerations TP305xB, TP1305xB system reliability and design considerations are described in the following paragraphs. latch-up Latch-up is possible in all CMOS devices. It is caused by the firing of a parasitic SCR that is present due to the inherent nature of CMOS. When a latch-up occurs, the device draws excessive amounts of current and will continue to draw heavy current until power is removed. Latch-up can result in permanent damage to the device if supply current to the device is not limited. Even though the TP305xB and TP1305xB devices are heavily protected against latch-up, it is still possible to cause latch-up under certain conditions in which excess current is forced into or out of one or more terminals. Latch-up can occur when the positive supply voltage drops momentarily below ground, when the negative supply voltage rises momentarily above ground, or possibly if a signal is applied to a terminal after power has been applied but before the ground is connected. This can happen if the device is hot-inserted into a card with the power applied, or if the device is mounted on a card that has an edge connector and the card is hot-inserted into a system with the power on. To help ensure that latch-up does not occur, it is considered good design practice to connect a reverse-biased Schottky diode (with a forward voltage drop of less than or equal to 0.4 V – 1N5711 or equivalent) between the power supply and GND (see Figure 3). If it is possible that a TP305xB- or TP1305xB-equipped card that has an edge connector could be hot-inserted into a powered-up system, it is also important to ensure that the ground edge connector traces are longer than the power and signal traces so that the card ground is always the first to make contact. device power-up sequence Latch-up can also occur if a signal source is connected without the device being properly grounded. A signal applied to one terminal could then find a ground through another signal terminal on the device. To ensure proper operation of the device and as a safeguard against this sort of latch-up, it is recommended that the following power-up sequence always be used: 1. Ensure that no signals are applied to the device before the power-up sequence is complete. 2. Connect GND. 3. Apply V BB (most negative voltage). 4. Apply VCC (most positive voltage). 5. Force a power down condition in the device. 6. Connect clocks. 7. Release the power down condition. 8. Apply FS synchronization pulses. 9. Apply the signal inputs. When powering down the device, this procedure should be followed in the reverse order.

Figure 3. Latch-Up Protection Diode Connection A fixed level on BCLKR/CLKSEL selects BCLKX as the bit clock for both the transmit and receive directions. Table 1 indicates the frequencies of operation that can be selected depending on the state of BCLKR/CLKSEL. Table 1. Selection of Master-Clock Frequencies BCLKR, if running). FSX and FSR must be synchronous with MCLKX and MCLKR.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996

14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

For asynchronous operation, separate transmit and receive clocks can be applied. MCLKX and MCLKR must be 2.048 MHz for the TP3057B and TP13057B, 1.536 MHz or 1.544 MHz for the TP3054B and TP13054B and need not be synchronous. However, for best performance, MCLKR should be synchronous with MCLKX. This is easily achieved by applying only static logic levels to MCLKR/PDN. This connects MCLKX to all internal MCLKR functions. For 1.544-MHz operation, the device compensates for the 193rd clock pulse of each frame. Each encoding cycle is started with FSX and FSX must be synchronous with MCLKX and BCLKX. Each decoding cycle is started with FSR and FSR must be synchronous with BCLKR. The logic levels shown in Table 1 are not valid in the asynchronous mode. BCLKX and BCLKR can operate from 64 kHz to 2.048 MHz. short-frame sync operation The device can operate with either a short- or a long-frame sync pulse. On power up, the device automatically goes into the short-frame mode where both FSX and FSR must be one bit-clock period long with timing relationships specified in Figure 1. With FSX high during a falling edge of BCLKX, the next rising edge of BCLKX enables the 3-state output buffer, DX, which outputs the sign bits. The remaining seven bits are clocked out on the following seven rising edges and the next falling edge disables DX. With FSR high during a falling edge of BCLKR (BCLKX in synchronous mode), the next falling edge of BCLKR latches in the sign bit. The following seven falling edges latch in the seven remaining bits. The short-frame sync pulse may be utilized in either the synchronous or asynchronous mode. long-frame sync operation Both FSX and FSR must be three or more bit-clock periods long to use the long-frame sync mode with timing relationships as shown in Figure 2. Using the transmit frame sync (FSX), the device detects whether a short- or long-frame sync pulse is being used. For 64-kHz operation, the frame-sync pulse must be kept low for a minimum of 160 ns. The rising edge of FSX or BCLKX, which ever occurs later, enables the DX 3-state output buffer. The first bit clocked out is the sign bit. The next seven rising edges of BCLKX edges clock out the remaining seven bits. The falling edge of BCLKX following the eighth rising edge or FSX going low, whichever occurs later, disables DX. A rising edge on FSR, the receive-frame sync pulse, causes the PCM data at DR to be latched in on the next eight falling edges of BCLKR (BCLKX in synchronous mode). The long-frame sync pulse can be utilized in either the synchronous or asynchronous mode. transmit section The transmit section input is an operational amplifier with provision for gain adjustment using two external resistors. The low noise and wide bandwidth characteristics of these devices provide gains in excess of 20 dB across the audio passband. The operational amplifier drives a unity-gain filter consisting of an RC active prefilter followed by an eighth-order switched-capacitor band-pass filter clocked at 256 kHz. The output of this filter directly drives the encoder sample-and-hold circuit. As per µ-law (TP3054B and TP13054B) or A-law (TP3057B and TP13057B) coding conventions, the ADC is a companding type. A precision voltage reference provides a nominal input overload of 2.5 V peak. The sampling of the filter output is controlled by the FSX frame-sync pulse. Then the successive-approximation encoding cycle begins. The 8-bit code is loaded into a buffer and shifted out through DX at the next FSX pulse. The total encoding delay is approximately 290 µs. Any offset voltage due to the filters or comparator is cancelled by sign-bit integration.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996 15POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PRINCIPLES OF OPERATION receive section The receive section consists of an expanding DAC that drives a fifth-order low-pass filter clocked at 256 kHz. The decoder is µ-law (TP3054B and TP13054B) or A-law (TP3057B and TP13057B) and the fifth-order low-pass filter corrects for the (sin x)/x attenuation caused by the 8-kHz sample/hold. The filter is followed by a second-order RC active post-filter/power amplifier capable of driving a 600-Ω load to a level of 7.2 dBm. The receive section is unity gain. At FSR, the data at DR is clocked in on the falling edge of the next eight BCLKR (BCLKX) periods. At the end of the decoder time slot, the decoding cycle begins and 10 µs later, the decoder DAC output is updated. The decoder delay is about 10 µs (decoder update) plus 110 µs (filter delay) plus 62.5 µs (1/2 frame), or a total of approximately 180 µs.

TP3054B, TP3057B, TP13054B, TP13057B MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER SCTS042A – MAY 1990 – REVISED JULY 1996

16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

APPLICATION INFORMATION

While the pins of the TP1305xB and TP305xB families are well protected against electrical misuse, it is recommended that the standard CMOS practice be followed, ensuring that ground is connected to the device before any other connections are made. In applications where the printed-circuit board can be plugged into a hot socket with power and clocks already present, an extra long ground pin in the connector should be used. All ground connections to each device should meet at a common point as close as possible to ANLG GND. This minimizes the interaction of ground return currents flowing through a common bus impedance. V CC and VBB supplies should be decoupled by connecting 0.1-µF decoupling capacitors to this common point. These bypass capacitors must be connected as close as possible to VCC and VBB . For best performance, the ground point of each codec/filter on a card should be connected to a common card ground in star formation, rather than via a ground bus. This common ground point should be decoupled to VCC and VBB with 10-µF capacitors. Data Out Digital Interface Analog Interface R2R1 From SLIC PDN

5 V or GND

0.1 µF 0.1 µF –5 V MCLKX BCLKX DX FSX GSX VFXI– VFXI+ MCLKR/PDN BCLKR/CLKSEL DR FSR VFRO VCC ANLG GND VBB TP3054B TP3057B TP13054B TP13057B NOTE A: Transmit gain = 20 log/C0466R1 /C0041R2 R2 /C0467,(R1 /C0041R2 )/C011910 k/C0087 BCLKX (2.048 MHz/1.544 MHz) Figure 4. Typical Synchronous Application

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright  1998, Texas Instruments Incorporated