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Document overview

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Technical content

Features

  • –2.4V Maximum Low Threshold
  • High Input Impedance
  • Low Input Capacitance (95 pF)
  • Fast Switching Speeds
  • Low On-Resistance
  • Free from Secondary Breakdown
  • Low Input and Output Leakage

Applications

  • Logic-Level Interfaces (Ideal for TTL and CMOS)
  • Solid-State Relays
  • Battery-Operated Systems
  • Photovoltaic Drives
  • Analog Switches
  • General Purpose Line Drivers
  • Telecommunication Switches General Description The TP0604 low-threshold, Enhancement-mode (normally-off) transistor uses a vertical DMOS structure and a well-proven silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally induced secondary breakdown. Microchip’s vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance and fast switching speeds are desired. Package Type See Table 3-1 for pin information. 3-lead TO-92 (Top view) GATE SOURCE DRAIN P-Channel Enhancement-Mode Vertical DMOS FET

DS20005956A-page 2  2019 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings† † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: TA = 25°C unless otherwise specified. All DC parameters are 100% tested at 25°C unless otherwise stated. Pulse test: 300 µs pulse, 2% duty cycle Parameter Sym. Min. Typ. Max. Unit Conditions Drain-to-Source Breakdown Voltage BVDSS –40 — — V VGS = 0V, ID = –2 mA Gate Threshold Voltage VGS(th) –1 — –2.4 V VGS = VDS, ID= –1 mA Change in VGS(th) with Temperature ΔVGS(th) — –3 –4.5 mV/°C VGS = VDS, ID= –1 mA (Note 1) Gate Body Leakage Current IGSS — — –100 nA VGS = ± 20V, VDS = 0V Zero-Gate Voltage Drain Current IDSS — — –10 µA VGS = 0V, VDS = Maximum rating — — –1 mA VDS = 0.8 Maximum rating, VGS = 0V, TA = 125°C (Note 1) On-State Drain Current ID(ON) –0.4 –0.6 — A VGS = –5V, VDS = –20V –2 –3.3 — A VGS = –10V, VDS = –20V Static Drain-to-Source On-State Resistance RDS(ON) — 2 3.5 Ω VGS = –5V, ID = –250 mA — 1.5 2 Ω VGS = –10V, ID = –1A Change in RDS(ON) with Temperature ΔRDS(ON) — — 1.2 %/°C VGS = –10V, ID = –1A (Note 1) Note 1: Specification is obtained by characterization and is not 100% tested.

 2019 Microchip Technology Inc. DS20005956A-page 3 TP0604 AC ELECTRICAL CHARACTERISTICS Electrical Specifications: TA = 25°C unless otherwise specified. Specification is obtained by characterization and is not 100% tested. Parameter Sym. Min. Typ. Max. Unit Conditions Forward Transconductance GFS 400 600 — mmho VDS = –20V, ID = –1A Input Capacitance CISS — 95 150 pF VGS = 0V, VDS = –20V, f = 1 MHz Common Source Output Capacitance COSS — 85 120 pF Reverse Transfer Capacitance CRSS — 35 60 pF Turn-On Delay Time td(ON) — 5 8 ns VDD = –20V, ID = –1A, RGEN = 25Ω Rise Time tr — 7 18 ns Turn-Off Delay Time td(OFF) — 10 15 ns Fall Time tf — 6 19 ns DIODE PARAMETER Diode Forward Voltage Drop VSD — –1.3 –2 V VGS = 0V, ISD = –1.5A (Note 1) Reverse Recovery Time trr — 300 — ns VGS = 0V, ISD = –1.5A Note 1: Unless otherwise stated, all DC parameters are 100% tested at 25°C. Pulse test: 300 µs pulse, 2% duty cycle TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Conditions TEMPERATURE RANGE Operating Ambient Temperature TA –55 — +150 °C Storage Temperature TS –55 — +150 °C PACKAGE THERMAL RESISTANCE 3-lead TO-92 JA — 132 — °C/W THERMAL CHARACTERISTICS Package ID (Note 1) (Continuous) (A) ID (Pulsed) (A) Power Dissipation at TA = 25°C (W) IDR (Note 1) (mA) IDRM (A) Note 1: ID (continuous) is limited by maximum rated TJ.

DS20005956A-page 4  2019 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transconductance vs. Drain Current. FIGURE 2-3: Maximum Rated Safe Operating Area. FIGURE 2-4: Saturation Characteristics. FIGURE 2-5: Power Dissipation vs. Case Temperature. FIGURE 2-6: Thermal Response Characteristics. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g. outside specified power supply range) and therefore outside the warranted range. 0 -10 -20 -30 -40 VDS (volts) ID (amperes) -6V -8V -4V VGS = -10V -5V -7V -9V TA = -55OC GFS (siemens) ID (amperes) VDS = -25V TA = -150OC TA = 25OC 1.0 0.8 0.6 0.4 0.2 0 -1.0 -2.0 -3.0 -1 -10 -100 -1000 -0.1 -1.0 -10 -0.01 TC = 25OC TO-92 (DC) VDS (volts) ID (amperes) -6V -8V -4V ID (amperes) VDS (volts) VGS = -10V -5V -7V -9V 0 15010050 2.0 1.0 1257525 TO-92 TC (OC) PD (watts)Thermal Resistance (normalized) 1.0 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1.0 10 tp (seconds) TO-92 PD = 1.0W TC = 25OC

DS20005956A-page 6  2019 Microchip Technology Inc.

3.0 PIN DESCRIPTION

The details on the pins of TP0604 are listed in Table 3-1. Refer to Package Type for the location of pins. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name Description

1 Source Source

2 Gate Gate

3 Drain Drain

 2019 Microchip Technology Inc. DS20005956A-page 7 TP0604

4.0 FUNCTIONAL DESCRIPTION

Figure 4-1 illustrates the switching waveforms and test circuit for TP0604. FIGURE 4-1: Switching Waveforms and Test Circuit. 90% 10% 90% 90% 10%10% Pulse Generator VDD RL OUTPUT D.U.T. t(ON) td(ON) t(OFF) td(OFF) tftr INPUT RGEN INPUT OUTPUT VDD -10V TABLE 4-1: PRODUCT SUMMARY BVDSS/BVDGS (V) RDS(ON) (Maximum) (Ω) ID(ON) (Minimum) (A) VGS(TH) (Maximum) (V) –40 2 –2 –2.4

DS20005956A-page 8  2019 Microchip Technology Inc.

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Legend: XX...X Product Code or Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. 3-lead TO-92 YWWNNN XXXXXX XX e3 Example 923145 TP0604 N3 e3

 2019 Microchip Technology Inc. DS20005956A-page 9 TP0604 Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

DS20005956A-page 10  2019 Microchip Technology Inc. NOTES:

 2019 Microchip Technology Inc. DS20005956A-page 11 TP0604 APPENDIX A: REVISION HISTORY Revision A (July 2019)

  • Converted Supertex Doc# DSFP-TP0604 to Microchip DS20005956A
  • Changed the package marking format
  • Added a pin function table
  • Removed the TO-92 P002, P003, P005, P013 and P014 media types
  • Made minor text changes throughout the document

DS20005956A-page 12  2019 Microchip Technology Inc. PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Example: a) TP0604N3-G: P-Channel Enhancement- Mode, Vertical DMOS FET, 3-lead TO-92, 1000/Bag PART NO. Device Device: TP0604 = P-Channel Enhancement-Mode Vertical DMOS FET Package: N3 = 3-lead TO-92 Environmental: G = Lead (Pb)-free/RoHS-compliant Package Media Type: (blank) = 1000/Bag for an N3 Package XX Package - X - X Environmental Media Type Options

 2019 Microchip Technology Inc. DS20005956A-page 13 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-4811-2 Note the following details of the code protection feature on Microchip devices:

  • Microchip products meet the specification contained in their particular Microchip Data Sheet.
  • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
  • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
  • Microchip is willing to work with the customer who is concerned about the integrity of their code.
  • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

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