TNC-4 LSTD | Alldatasheet
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global solutions: local support TM Innovative Technology for a Connected World Tgard TM TNC-4 Thermally Conductive Insulators PRELIMINARY LOW COST, MEDIUM PERFORMANCE INSULATOR MATERIAL TgardTM TNC-4 is an electrically insulating, thermally conductive, heat curable adhesive insulator. It consists of a thin electrically insulating PI film coated on both sides with a thermally conductive polymer composite material. It can be used to permanently attach IC or other electronic packages to heatsink.
APPLICATIONS
- Permanently bonding cooling devices such as heat sinks to electronic components Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com www.lairdtech.com/thermal PROPERTY TEST METHOD TYPICAL VALUES Post-cured Breakdown Voltage VAC ASTM D149 6000 Post-cured Thermal Resistance °Cin2/W ASTM D5470 Modified < 0.3 Thickness inch(mm) 0.005(0.125) Post-cured Lap Shear ASTM D3163 Modified > 600 psi Color Visual Black
Thermally Conductive Insulators PRELIMINARY APPLICATION PROCEDURE FIg. 1 FIg. 2 FIg. 3 FIg. 5 FIg. 4 FIg. 6 1. Clean bonding surface with alcohol or other solvents and make it clean (Fig. 1). 2. Peel off one liner from the TNC-4 adhesive tape (Fig 2). Place the TNC-4 on heatsink surface (Fig 3). 3. Apply 75 psi pressures for 10 seconds at 25-35° C, using pressure pads/foams to apply pressure uniformly on both sides (Fig. 4). Then Peel off the other liner (Fig. 5). component on the top of TNC-4/heat sink assembly (Fig. 6). Apply 75~85psi over 15 seconds, use pressure pads/foams to apply pressure uniformly on both sides (Fig. 7).
Shelf life : Six months at room temperature (<25C) THR-DS-TGARD-TNC-4 0312 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A16723-00 Rev A Tgard TM TNC-4 Thermally Conductive Insulators PRELIMINARY FIg. 8 FIg. 7 4. Cure the assembly at 150° C for 6 minutes or more minutes. Time is at least 6 minutes when part temp is above 140° C. Choose the curing conditions according to actual products and heat oven conditions. During curing process, the assembly should be on a horizontal and flat surface and IC parts should be up towards (Fig. 8). And the Assembly could not be slanting during the curing process and before being cooled down. Normally heating up curve of assembly (3 components on aluminum heatsink, one piece, based on normal heating oven.) is shown in the chart below. Please select your heating curve according to your assemblies. NORMAL ASSEMBLY HEATINg UP CURVE 140C Temp (°C) Time (“5Sec) 0 20 40 60 80 100 140 180120 160 200 160 140 120 100