TMXIT01 RAKON | Alldatasheet
Document overview
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Technical content
Issue: Rev 2, 06 January 2023 Specifications are subject to change without notice Copyright © 2016 to 2023 Rakon Limited. All rights reserved www.rakonxpress.com Table of Contents TMX IT01 SAW Filter datasheet 3.0 x 3.0 x 1.3 mm, SMD
SAW Bandpass Filters | Wireless Communications Issue: Rev 2, 06 January 2023 Specifications are subject to change without notice Copyright © 2016 to 2023 Rakon Limited. All rights reserved Page 1 of 6 www.rakonxpress.com
Features
Parameter Min. Typ. Max. Unit Storage temperature range (Tstg) -45 85 °C Operating temperature range (TA) -40 85 °C DC Voltage (VDC) 12 V RF Power (in Band Width) 10 dBm Frequency and Electrical Characteristics (Reference temperature @ 25°C) Parameter Min. Typ.1 Max. Unit Center frequency (fc) 829 MHz Bandwidth (BW, passband width) 0.40 MHz 1 dB Bandwidth (BW) 750 900 1200 KHz Insertion Loss (IL, 828.80 – 829.20 MHz) 2.5 3.5 dB Amplitude ripple (828.80 – 829.20 MHz) 0.5 1.0 dB Absolute Attenuation From DC to 650.00 MHz From 650.00 to 710.00 MHz
821.00 MHz
832.00 MHz
From 840.00 to 850.00 MHz From 850.00 to 1000.0 MHz dB dB dB dB dB dB Frequency Temperature Coefficent 0.032 ppm/°C2 Input Impedance 50 Ω Output Impedance 50 Ω
1 Typical values are nominal performances at room temperature
Features Applications 3.0 x 3.0 x 1.3 mm 829 MHz center frequency Ceramic package for Surface Mounted Technology Low Loss RF Filter: 2.5 dB typical value within PassBand Width 828.80 to 829.20 MHz Remote control - RF Wireless applications
SAW Bandpass Filters | Wireless Communications Issue: Rev 2, 06 January 2023 Specifications are subject to change without notice Copyright © 2016 to 2023 Rakon Limited. All rights reserved Page 2 of 6 www.rakonxpress.com Unit: mm Model Outline, Pin Connection and Marking Test Circuit Pin Connections
2 Input
5 Ouptut
1, 3, 4, 6 Ground Marking Note Line 1 IT01 Rakonxpress designation Line 2 S609 S = Production code 6 = Year 2016 09 = Week 08 Line 3 •AA • = Identify black dot AA = Internal Code (Wafer Batch) 50 Ω / 50 Ω Configuration 3.0 SQ TOP VIEW IT01 S609
- AA FRONT VIEW 1.3 BOTTOM VIEW 0.9 0.7 0.15 0.3 0.61 RECOMMENDED PAD LAYOUT TOP VIEW 0.8 (x6) 0.4 1.6 1.8 1.2 1.2 (x5)
SAW Bandpass Filters | Wireless Communications Issue: Rev 2, 06 January 2023 Specifications are subject to change without notice Copyright © 2016 to 2023 Rakon Limited. All rights reserved Page 3 of 6 www.rakonxpress.com Frequency Characteristics TYPICAL S21 RESPONSE
SAW Bandpass Filters | Wireless Communications Issue: Rev 2, 06 January 2023 Specifications are subject to change without notice Copyright © 2016 to 2023 Rakon Limited. All rights reserved Page 4 of 6 www.rakonxpress.com Recommended Reflow Soldering Profile NOTE:
- The components shall remain within the electrical specifications after it soldered on the 1mm thickness PCB board and dipped in the solder at 260 ± 5°C during 10 ± 1 seconds.
- The components shall remain within the electrical specifications after it soldered by electric iron, solder at 350 ± 10 °C during 3~4 seconds. Recovery time: 2 ± 0.5 hour.
- Ultrasonic cleaning may cause deterioration and destruction of the component. Please avoid ultrasonic cleaning.
- Only leads of components may be soldered. Please avoid soldering another part of the component.
SAW Bandpass Filters | Wireless Communications Issue: Rev 2, 06 January 2023 Specifications are subject to change without notice Copyright © 2016 to 2023 Rakon Limited. All rights reserved Page 5 of 6 www.rakonxpress.com Tape and Reel Specifications TAPE DETAILS: REEL DETAILS: Parameter Code Dimension Tolerance Height of component hole A 3.3 max Width of component hole B 3.3 max Diameter of sprocket hole D0 Φ 1.5 ± 0.1 Diameter of feed hole D1 Φ 1.5 ± 0.25 Pitch of sprocket hole P0 4.0 ± 0.2 Length from hole center to component center P1 4.0 ± 0.1 Length from Pocket hole center to sprocket hole center P2 2.0 ± 0.2 Width of carrier tape W 12.0 ± 0.3 Width of adhesive tape F 5.5 ± 0.3 Gap of hold down tape and carrier tape E 1.75 ± 0.1 Thickness of Ebossed tape sheet t1 0.31 max Thickness of Ebossed tape t2 1.7 max NOTE: Unit: mm Standard Packing Quantity (SPQ) is 3000 pieces/ reel Tape running direction IT01 S609
- AA Tape running direction
SAW Bandpass Filters | Wireless Communications Issue: Rev 2, 06 January 2023 Specifications are subject to change without notice Copyright © 2016 to 2023 Rakon Limited. All rights reserved Page 6 of 6 www.rakonxpress.com Reliability Test Parameter Test condition / Description Thermal Shock The components shall remain within the electrical specifications after being kept at the condition of heat cycle conditions: TA=-40°C ±3°C, TB=85°C ±2°C, t1=t2=30min, switch time ≤3min & cycle time: 100 times, recovery time: 2h±0.5h. Temperature Storage High Temperature Storage: The components shall remain within the electrical specifications after being kept at the 85°C ±2°C for 500 hours, recovery time: 2h ±0.5h. Low Temperature Storage: The components shall remain within the electrical specifications after being kept at the -40°C ±3°C for 500 hours, recovery time: 2h ±0.5h. Humidity test The components shall remain within the electrical specifications after being kept at the condition of ambient temperature 60°C ±2°C, and 90~95% RH for 500 hours. Drop test The components shall remain within the electrical specifications after random free drops 10 times from height of 1.0 meter onto concrete floor, and the specimens shall meet the electrical specifications. Vibration Fatigue The components shall remain within the electrical specifications after loaded vibration at 10~55Hz, amplitude 1.5mm, X, Y, Z, direction, during 2 hours. Mechanical Shock The components shall remain within the electrical specifications after 1000 shocks, acceleration 392 m/s² , duration 6ms. Note As a result of the particularity of inner structure of SAW products, the components can easily be breakdown by electrostatic shock; so it’s mandatory to pay attention to ESD protect during the tests.