TMP9A00-EP_V01 TI | Alldatasheet
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Technical content
TMP9A00-EP ±2.5 °C Low-Power, Analog Out Temperature Sensor
1 Features
- ±2.5 °C Accuracy from –55 °C to +130 °C
- ±3.5 °C Accuracy from –55 °C to +150 °C
- Supply voltage range: 1.8 V to 5.5 V
- Low power: 4 µA (maximum)
- Microsize package: SC70
- Supports defense, aerospace, and medical
applications
– Controlled baseline – One assembly/test site – One fabrication site – Extended product life cycle – Extended product-change notification – Product traceability
2 Applications
- Defense radio
- Radar
- Avionics
- Sensors and imaging
3 Description
The TMP9A00-EP device is a CMOS, precision analog output temperature sensor available in a tiny 5-pin SC70 package. The TMP9A00-EP operates from –55 °C to 150 °C on a supply voltage of 1.8 V to 5.5 V with a supply current of 4 µA. Operation as low as 1.8 V is possible for temperatures between 15 °C and 150 °C. The linear transfer function has a slope of –11.77 mV/°C (typical) and an output voltage of 1.8639 V (typical) at 0 °C. The TMP9A00-EP has a ±2.5 °C accuracy a from –55 °C to 130 °C and ±3.5 °C from 130 °C to 150 °C. The 4-µA (maximum) supply current of the TMP9A00- EP limits self-heating of the device to less than 0.01 °C. When V+ is less than 0.5 V, the device is in shutdown mode and consumes less than 20 nA (typical). The TMP9A00-EP is available in a 5-pin SC70 package that reduces the overall required board space. Device Information PART NUMBER PACKAGE BODY SIZE (NOM) TMP9A00-EP SC70 (5) 2.00 mm × 1.25 mm Device Block Diagram -75 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Quiescent Current (µA) VS = 5.5 V Device Quiescent Current Over Temperature TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
11.1 Receiving Notification of Documentation Updates..15
12 Introduction to Mechanical, Packaging, and
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (December 2020) to Revision A (February 2021) Page TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 www.ti.com
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5 Pin Configuration and Functions
V OUT NC- no internal connection Figure 5-1. DCK Package 5-Pin SC70 Top View Table 5-1. Pin Functions PIN I/O DESCRIPTION NAME DCK (SC70) GND 2 — This pin must be grounded or left floating. For best thermal response, connect to GND plane. See Layout Example for more information. 5 — Ground pin NC 1 — This pin must be grounded or left floating. See Layout Example for more information. VOUT 3 O Analog output V+ 4 I Positive supply voltage www.ti.com TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TMP9A00-EP
6 Specifications
6.1 Absolute Maximum Ratings
Over free-air temperature range unless otherwise noted(1) MIN MAX UNIT Supply voltage VDD -0.3 7 V Operating junction temperature, TJ -65 150 °C Storage temperature, Tstg -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 VCharged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
VDD Supply voltage 1.8 3.3 5.5 V TA Operating ambient temperature -55 150 °C
6.4 Thermal Information
THERMAL METRIC(1) TMP9A00-EP DCK 6-pins RθJA Junction-to-ambient thermal resistance 229.0 RθJC(top) Junction-to-case (top) thermal resistance 148.9 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A RθJB Junction-to-board thermal resistance 73.4 ψJT Junction-to-top characterization parameter 42.5 ψJB Junction-to-board characterization parameter 73.0 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 www.ti.com
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6.5 Electrical Characteristics
Over free-air temperature range and VDD = 1.8 V to 5.5 V (unless otherwise noted); Typical specifications are at TA = 25 °C and VDD = 3.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE SENSOR TERR Temperature accuracy(1) -55 °C to 130 °C -2.5 2.5 °C 130 °C to 150 °C -3.5 3.5 °C PSR DC power supply rejection VDD = 1.8 V to 5.5 V TA = 15 °C to 150 °C -0.05 0.05 °C/V VDD = 2.7 V to 5.5 V TA = -55 °C to 150 °C -0.15 0.15 °C/V TSENS Temperature sensitivity(2) TA = -55 °C to 150 °C -11.77 mV/°C VOUT Output voltage(3) TA = 0 °C 1863.9 mV TA = 25 °C 1574 mV NL Nonlinearity(4) TA = -55 °C to 150 °C ±0.4 % ANALOG OUTPUT VOUT_R Output resistance ILOAD = -600 μA to 600 μA 10 Ω LR Load regulation ILOAD = -600 μA to 600 μA 6 mV CL Maximum capacitive load 1 nF POWER SUPPLY VDD Operating voltage TA = -55 °C to 150 °C 2.7 5.5 V TA = 15 °C to 150 °C(5) 1.8 5.5 V IDD Supply current VDD = 5.5 V TA = 25 °C 2.6 4 μA VDD = 5.5 V TA = -55 °C to 150 °C 7 μA IDD_SD Shutdown current VDD < 0.5 V 20 nA (1) Power-supply rejection is encompassed in the accuracy specification. (2) Temperature sensitivity is the average slope to the equation VO = (–11.77 × T) + 1.860 V (3) VOUT is calculated from temperature with the following equation: (4) Nonlinearity is the deviation of the calculated output voltage from the best fit straight line. (5) The TMP9A00-EP transfer function requires the output voltage to rise above the 1.8-V supply as the temperature decreases below 15°C. When operating at a 1.8-V supply, it is normal for the TMP9A00-EP output to approach 1.8 V and remain at that voltage as the temperature continues to decrease below 15°C. This condition does not damage the device. Once the temperature rises above 15°C, the output voltage resumes changing as the temperature changes, according to the transfer function specified in this document. www.ti.com TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TMP9A00-EP
6.6 Typical Characteristics
Output Impedance (W) -75 -50 -25 0 25 50 75 100 125 150 Temperature ( C)° R SinkingOUT V = 2.7 VS R SinkingOUT V = 5.5 VS R SourceOUT V = 2.7 VS R SourceOUT V = 5.5 VS Figure 6-1. Output Impedance vs Temperature -75 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Quiescent Current (µA) VS = 5.5 V Figure 6-2. Quiescent Current vs Temperature -75 -50 -25 0 25 50 75 100 125 150 Temperature ( C)° 3.0 2.5 2.0 1.5 1.0 0.5 Output Voltage (V) V+ = 2.7 V Figure 6-3. Output Voltage vs Temperature Supply□Voltage□(V) Quiescent□Current□( A) /c109 T =A +25 C/c176 Figure 6-4. Quiescent Current vs Supply Voltage Supply□Voltage□(V) 0.5 0.4 0.3 0.2 0.1 0.1 0.2 0.3 0.4 0.5 /c45 /c45 /c45 /c45 /c45 Power-Supply□Induced□T emperature□Error (Line□Regulation, C) /c176 20□T ypical□Units At□+2 ,□+125 C 0 C /c176 /c176 Figure 6-5. Power-Supply Rejection vs Temperature Supply□Voltage□(V) 0.5 0.4 0.3 0.2 0.1 0.1 0.2 0.3 0.4 0.5 /c45 /c45 /c45 /c45 /c45 Power-Supply□Induced□T emperature□Error (Line□Regulation, C) /c176 20□T ypical□Units At 50 C/c45 /c176 Figure 6-6. Power-Supply Rejection vs Temperature TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 www.ti.com
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2.5 2.0 1.5 1.0 0.5 -0.5 -1.0 -1.5 -2.0 -2.5 Temperature Error ( C)° -75 -50 -25 0 25 50 75 100 125 150 Temperature ( C)°
39 Typical Units
V+ = 2.7 V Figure 6-7. Temperature Error vs Temperature 3.0 2.5 2.0 1.5 1.0 0.5 Minimum□V (V) SUPPL Y /c45 75 /c45 50 /c45 25 0 25 50 75 100 125 150 Sensor□T emperature□(/c176 C) Figure 6-8. Minimum Supply Voltage vs Temperature Time (5 ms/div) Output Noise (0.5 mV/div) Figure 6-9. Wideband Output Noise Voltage V (200ms/div)OUT Time (2s/div) V+ = 3.3 V T step from +25 C to +110 CA ° ° Figure 6-10. Thermal Settling (Fluid-Filled Temperature Bath) www.ti.com TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TMP9A00-EP
7 Detailed Description
7.1 Overview
The TMP9A00-EP device is a precision analog output temperature sensor. The temperature range of operation is –55 °C to 150 °C with supply voltages of 1.8 V to 5.5 V. The TMP9A00-EP operates from power-supply voltages as low as 1.8 V over a temperature range of 15 °C to 150 °C. TI recommends power supply bypassing. Use a 100-nF capacitor placed as close to the supply pin as possible.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Transfer Function
The analog output of the TMP9A00-EP over the –55 °C to 150 °C temperature range corresponds to the parabolic transfer function shown in Equation 1: 6 2 2 OUTV 3.88 10 T 1.15 10 T 1.8639 V u uuu (1) Where:
- The temperature (T) is in °C. When solving for temperature, the equation is shown as Equation 2. 1.8639 V T 1481.96 2.1962 10 3.88 10 u u (2) These equations apply over the entire operating range of –55 °C to 150 °C. A simplified linear transfer function referenced at 0 °C is shown in Equation 3: OUTV 11.69 mV / C T 1.8863 V q u (3) Linear transfer functions are calculated for limited temperature ranges by calculating the slope and offset for that limited range, where slope is calculated by Equation 4: 6P 7 ± u u (4) Where:
- T equals the temperature at the middle of the temperature range of interest. TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 www.ti.com
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The offset in the linear transfer function is calculated with Equation 5: OUT MAX OUT MAXE 9 7 9 7 ± P 7 7 u (5) where
- V OUT(TMAX) is the calculated output voltage at TMAX.
7.3.1.1 Example 1
Determine the linear transfer function for –40 °C to 110 °C. TMIN = –40 °C; TMAX = 110 °C; therefore, T = 35 °C m = –11.77 mV/°C VOUT (110 °C) = 0.5520 V VOUT (35 °C) = 1.4566 V b = 1.8576 V The linear transfer function for –40 °C to 110 °C is shown in Equation 6: OUTV 11.77 mV / C T 1.8576 V q u (6) www.ti.com TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TMP9A00-EP
Table 7-1 lists common temperature ranges of interest and the corresponding linear transfer functions for these ranges. Note that the error (maximum deviation) of the linear equation from the parabolic equation increases as the temperature ranges widen. Table 7-1. Common Temperature Ranges and Corresponding Linear Transfer Functions TEMPERATURE RANGE LINEAR EQUATION (V) MAXIMUM DEVIATION OF LINEAR EQUATION FROM PARABOLIC EQUATION (°C)TMIN (°C) TMAX (°C) –55 130 VOUT = –11.79 mV/°C × T + 1.8528 ±1.41 –40 110 VOUT = –11.77 mV/°C × T + 1.8577 ±0.93 –30 100 VOUT = –11.77 mV/°C × T + 1.8605 ±0.70 –40 85 VOUT = –11.67 mV/°C × T + 1.8583 ±0.65 –10 65 VOUT = –11.71 mV/°C × T + 1.8641 ±0.23 35 45 VOUT = –11.81 mV/°C × T + 1.8701 ±0.004 20 30 VOUT = –11.69 mV/°C × T + 1.8663 ±0.004
7.4 Device Functional Modes
The singular functional mode of the TMP9A00-EP is an analog output inversely proportional to temperature. TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 www.ti.com
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8 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Output Drive and Capacitive Loads
When used in noisy environments, adding a capacitor from the output to ground with a series resistor filters the TMP9A00-EP output as shown in Figure 8-1. The TMP9A00-EP can drive up to 1-nF load capacitance while sourcing and sinking 600 μA. While sinking or sourcing 600 μA, capacitive loads in the range of 1 nF to 10 μF require a 150-Ω series output resistor to achieve a stable temperature measurement. The output impedance of the TMP9A00-EP is typically 10 Ω when sinking currents and less than 1 Ω when sourcing current as shown in Figure 6-1. TMP9A00-EP ADC 1 nF VOUT TMP9A00-EP ADC C(A) VOUT R(A) A. A series resistor (R) may be required depending on the amount of capacitance (C) and the amount of source and sink current drawn from the output of the TMP9A00-EP. Figure 8-1. TMP9A00-EP Output Filtering www.ti.com TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TMP9A00-EP
8.1.2 Operating Life Deration
The information in this section is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products. Continuous Junction Temperature - TJ(qC) Estimated Life (Hours) 85 90 95 100 105 110 115 120 125 130 135 140 145 150 10000 20000 30000 50000 70000 100000 200000 300000 500000 700000 1000000 2000000 3000000 5000000 900_ Wirebond Voiding Fail Mode 1. Silicon operating life design goal is 100000 power-on hours (POH) at 105 °C junction temperature (does not include package interconnect life). 2. The predicted operating lifetime versus junction temperature is based on reliability modeling using wirebond lifetime as the dominant failure mechanism affecting device wear out for the specific device process and design characteristics. Wirebond Life Derating Curve
8.2 Typical Application
1.8 V to 5.5 V GND Figure 8-2. Suggested Connections to a MCU ADC
8.2.1 Design Requirements
ADCs that are found in microcontrollers have leakage current during the sampling phase to charge the sampling capacitor. A high sampling frequency can have higher average input leakage that sags the output voltage of the TMP9A00-EP, which results in a reading that is hotter than normal. To mitigate this, place a capacitor (C F) between the TMP9A00-EP and the ADC. The capacitor functions as a charge reservoir to smooth out the output voltage and remove the voltage sag. The TMP9A00-EP output voltage has a negative slope and can not output a voltage higher than the VDD voltage. For this reason the effective operating temperature range of the device is restricted by supply. At 2.7 V, the device will output accurate temperature results from –55 °C to 150 °C. Using a supply voltage of 1.8 V will rail the output unless the temperature range is between 15 °C to 150 °C. Equation 7 can be used to find the minimum operating temperature of the device in this region. The minimum VDD must also satisfy the Recommended Operating Conditions 1.8 V regardless of ambient temperature. TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 www.ti.com
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A MIN 1863.9 11.77 T 110VDD 1000 u (7)
8.2.2 Detailed Design Procedure
The size of C F depends on the size of the internal sampling capacitor and the sampling frequency. The charge requirements may vary because not all ADCs have identical input stages. This general ADC application is shown as an example only. Equation 8 shows an example of how to translate the VOUT of the TMP9A00-EP into temperature. This can be implemented in the microcontroller in control of the ADC to record temperature. Another possible way to use the TMP9A00-EP is as a temperature switch in software. The same equation can be used to translate different temperature points into discrete voltages. For example, if a desired overtemperature condition is 105 °C, the corresponding voltage output would be 628 mV. OUT1.8639 VT 0.01177 (8)
8.2.3 Application Curves
Figure 8-3 shows the quiescent current versus temperature. -75 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Quiescent Current (µA) VS = 5.5 V Figure 8-3. Quiescent Current vs Temperature
9 Power Supply Recommendations
The low supply current and supply range of 1.8 V to 5.5 V enable the TMP9A00-EP to be powered from a variety of supply topologies. Power supply bypassing is optional and is typically dependent on the noise of the power supply. In noisy systems, adding bypass capacitors may be necessary to decrease the noise that couples to the output of the TMP9A00-EP. www.ti.com TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TMP9A00-EP
10 Layout
10.1 Layout Guidelines
The substrate on the TMP9A00-EPAIDCK package is directly connected through a conductive epoxy to pin 2 on the lead frame. Consequently, pin 2 is the best lead for a conductive thermal connection to the TMP9A00-EP die. The optimal electrical connection for this pin is ground (GND). CAUTION Do not attempt to connect pin 2 (DCK package) to any electrical potential other than ground. If it is not possible to connect pin 2 to ground, it is possible to electrically isolate this pin (that is, leave it floating). Take care when electrically isolating this pin because any noise or electromagnetic interference or radio frequency interference (EMI or RFI) spikes that couple in through this pin can cause erroneous temperature results.
10.2 Layout Example
Figure 10-1 shows a layout of the TMP9A00-EP with proper electrical and thermal connections to pin 2. NC GND VOUT GND Top/Bottom Layer Trace Via to Ground Plane Via to Power Plane 0.1 µF To ADC Figure 10-1. TMP9A00-EP Layout With Proper Electrical and Thermal Connections TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 www.ti.com
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
11.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
12 Introduction to Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TMP9A00-EP SBOSA26A – DECEMBER 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: TMP9A00-EP
www.ti.com 28-Jun-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TMP9A00MDCKREP ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-3-260C-168 HR -55 to 150 1I7 Samples TMP9A00MDCKTEP ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-3-260C-168 HR -55 to 150 1I7 Samples V62/20606-01EX ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-3-260C-168 HR -55 to 150 1I7 Samples V62/20606-01EX-T ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-3-260C-168 HR -55 to 150 1I7 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1
www.ti.com 28-Jun-2023 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 2-Feb-2021 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP9A00MDCKREP SC70 DCK 5 3000 213.0 191.0 35.0 TMP9A00MDCKTEP SC70 DCK 5 250 213.0 191.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 2-Feb-2021 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.15 2.4 1.8 2X 0.65 1.3
1.1 MAX
0.1
0.0 TYP
5X 0.33 0.23 0.46
0.26 TYP
0 TYP
1.3 A 2.15 1.85 B1.4 1.1 (0.9) (0.15) (0.1) SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/C 03/2023 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-203. 4. Support pin may differ or may not be present.
0.1 C A B
0.1 C SCALE 5.600
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (0.95) 5X (0.4) (2.2) (1.3) 2X (0.65) (R0.05) TYP 4214834/C 03/2023 SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.2) (1.3) 2X(0.65) 5X (0.95) 5X (0.4) (R0.05) TYP SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/C 03/2023 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X SYMM PKG 3 4
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