Sensor

TMP411ADGKR.B

Texas Instruments

TMP411 ±1°C Remote and Local Temperature Sensor With N-Factor and Series Resistance Correction REVISED DECEMBER 2016

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Technical content

D ± SCL SDA GND Processor or ASIC SMBus Controller 4 5 2.7 V to 5.5 V 2.7 V to 5.5 V Built-In Thermal Transistor, Diode Overtemperature Shutdown THERM THERM2ALERT / Copyright © 2016, Texas Instruments Incorporated Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP411 SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 TMP411±1°CRemoteandLocalTemperatureSensor WithN-FactorandSeriesResistanceCorrection

1 Features

1• ±1°C Remote Diode Sensor

±1°C Local Temperature Sensor
Programmable Non-Ideality Factor
Series Resistance Cancellation
Alert Function
Offset Registers for System Calibration
Pin and Registers Compatible With ADT7461 and ADM1032
Programmable Resolution: 9 to 12 Bits
Programmable Threshold Limits
Two-Wire and SMBus Serial Interface
Minimum and Maximum Temperature Monitors
Multiple Interface Addresses
ALERT and THERM2 Pin Configuration
Diode Fault Detection

2 Applications

LCD and DLP and LCOS Projectors
Servers
Industrial Controllers
Central Office Telecom Equipment
Desktop and Notebook Computers
Storage Area Networks (SAN)
Industrial and Medical Equipment
Processor and FPGA Temperature Monitoring

3 Description

The TMP411 device is a remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature-sensor, diode-connected transistors are typically low-cost, NPN- or PNP-type transistors or diodes that are an integral part of microcontrollers, microprocessors, or FPGAs. Remote accuracy is ±1°C for multiple device manufacturers, with no calibration needed. The two- wire serial interface accepts SMBus write byte, read byte, send byte and receive byte commands to program the alarm thresholds and to read temperature data. Features that are included in the TMP411 device are: series resistance cancellation, programmable non- ideality factor, programmable resolution, programmable threshold limits, user-defined offset register for maximum accuracy, minimum and maximum temperature monitors, wide remote temperature measurement range (up to 150°C), diode fault detection, and temperature alert function. The TMP411 device is available in VSSOP-8 and SOIC-8 packages. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP411 VSSOP (8) 3.00 mm × 3.00 mm SOIC (8) 4.90 mm × 3.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Block Diagram

13.1 Receiving Notification of Documentation Updates 37

14 Mechanical, Packaging, and Orderable

4 Revision History

Changes from Revision C (May 2008) to Revision D Page

Added "Offset Registers for System Calibration" and "Pin and Registers Compatible With ADT7461 and ADM1032"
Deleted Vs = 3.3 V test condition in Temperature error power supply sensitivity vs supply (local and remote)

3D ± 6 ALERT /THERM2 4THERM 5 GND Not to scale TMP411 www.ti.com SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 Product Folder Links: TMP411 Submit Documentation FeedbackCopyright © 2006–2016, Texas Instruments Incorporated

5 Device Comparison Table

PART NUMBER I2C BINARY ADDRESS I2C HEX ADDRESS OFFSET REGISTERS TMP411A 100 1100b 4Ch No TMP411B 100 1101b 4Dh No TMP411C 100 1110b 4Eh No TMP411E 100 1100b 4Ch Yes

6 Pin Configuration and Functions

8-Pin VSSOP, SOIC Top View Pin Functions PIN I/O DESCRIPTION NAME NO. ALERT/ THERM2 6 Digital output Alert (reconfigurable as second thermal flag), active low, open-drain; requires pullup resistor to V+ D+ 2 Analog input Positive connection to remote temperature sensor D– 3 Analog input Negative connection to remote temperature sensor GND 5 Ground Ground SCL 8 Digital input Serial clock line for SMBus, open-drain; requires pull-up resistor to V+ SDA 7 Bidrectional digital input-output Serial data line for SMBus, open-drain; requires pull-up resistor to V+ THERM 4 Digital output Thermal flag, active low, open-drain; requires pull-up resistor to V+ V+ 1 Power supply Positive supply (2.7 V to 5.5 V)

SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 www.ti.com Product Folder Links: TMP411 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

Input voltage Pins 2, 3, 4 only –0.5 VS + 0.5 V Input voltage Pins 6, 7, 8 only –0.5 7 V Input current 10 mA Power supply, Vs 7 V Operating temperature range –55 127 °C Junction temperature, TJ(max) 150 °C Storage temperature, Tstg –60 130 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 VCharged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT V+ Supply voltage 2.7 3.3 5.5 V TA Operating free-air temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.4 Thermal Information

THERMAL METRIC(1) TMP411 UNITD (SOIC) DGK (VSSOP)

8 PINS 8 PINS

RθJA Junction-to-ambient thermal resistance 112.3 166.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 59.4 58.3 °C/W RθJB Junction-to-board thermal resistance 53.0 86.7 °C/W ψJT Junction-to-top characterization parameter 13.6 7.5 °C/W ψJB Junction-to-board characterization parameter 52.4 85.2 °C/W

www.ti.com SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 Product Folder Links: TMP411 Submit Documentation FeedbackCopyright © 2006–2016, Texas Instruments Incorporated (1) Tested with less than 5-Ω effective series resistance and 100-pF differential input capacitance. TA is the ambient temperature of the TMP411. TDIODE is the temperature at the remote diode sensor.

7.5 Electrical Characteristics

at TA = –40°C to +125°C and VS = 2.7 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE ERROR TERROR(LOCAL) Local temperature sensor TA= 15°C to 85°C VS = 3.3 V –1 ±0.25 1 °C TERROR(REMOTE) Remote temperature sensor(1) TA = 15°C to 75°C TDIODE = –40°C to 150°C VS = 3.3 V –1 ±0.0625 1 °C TA = –40°C to 100°C TDIODE = –40°C to 150°C VS = 3.3 V –3 ±1 3 °C TA = –40°C to 125°C TDIODE = –40°C to 150°C VS = 3.3 V –5 ±3 5 °C TERROR_PS Temperature error power supply sensitivity (local and remote) VS = 2.7 V to 5.5 V TDIODE = –40°C to 150°C –0.5 ±0.2 0.5 °C/V TEMPERATURE MEASUREMENT Conversion time (per channel) One-shot mode 105 115 125 ms Resolution Local temperature sensor (programmable) 9 12 Bits Remote temperature sensor 12 Bits Remote sensor source currents High Series resistance: 3 kΩ maximum 120 µA Medium high 60 µA Medium low 12 µA Low 6 µA η Remote transistor ideality factor Optimized ideality factor 1.008 SMBUS INTERFACE VIH Logic input high voltage (SCL, SDA) 2.1 V VIL Logic input low voltage (SCL, SDA) 0.8 V Hysteresis 500 mV SMBus output low sink current 6 mA Logic input current –1 1 µA SMBus input capacitance (SCL, SDA) 3 pF SMBus clock frequency 3.4 MHz SMBus timeout 25 30 35 ms SCL falling edge to SDA valid time 1 µs DIGITAL OUTPUTS VOL Output low voltage IOUT = 6 mA 0.15 0.4 V IOH High-level output leakage current VOUT = Vs 0.1 1 µA ALERT or THERM2 output low sink current ALERT/THERM2 forced to 0.4 V 6 mA THERM output low sink current THERM forced to 0.4 V 6 mA POWER SUPPLY VS Specified voltage range 2.7 5.5 V IQ Quiescent current 0.0625 conversions per second VS = 3.3 V 28 30 µA Eight conversions per second VS = 3.3 V 400 475 µA Serial bus inactive, shutdown mode 3 10 µA Serial bus active, fS = 40 kHz, shutdown mode 90 µA Serial bus active, fS = 3.4 MHz, shutdown mode 350 µA Undervoltage lockout 2.3 2.4 2.6 V

SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 www.ti.com Product Folder Links: TMP411 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Electrical Characteristics (continued) at TA = –40°C to +125°C and VS = 2.7 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POR Power-on-reset threshold 1.6 2.3 V

www.ti.com SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 Product Folder Links: TMP411 Submit Documentation FeedbackCopyright © 2006–2016, Texas Instruments Incorporated (1) For cases with an SCL fall time of less than 20 ns, or an SDA rise or fall time of less than 20 ns, the hold time must be greater than 20 ns. (2) For cases with an SCL fall time of less than 10 ns, or an SDA rise or fall time of less than 10 ns, the hold time must be greater than 10 ns.

7.6 Timing Requirements

f(SCL) SCL operating frequency Fast mode 0.001 0.4 MHz High-speed mode 0.001 3.4 t (BUF) Bus free time between STOP and START condition Fast mode 600 ns High-speed mode 160 t (HDSTA) Hold time after repeated START condition. After this period, the first clock is generated Fast mode 100 ns High-speed mode 100 t (SUSTA) Repeated START condition setup time Fast mode 100 ns High-speed mode 100 t (SUSTO) STOP condition setup time Fast mode 100 ns High-speed mode 100 t (HDDAT) Data hold time Fast mode 0 (1) ns High-speed mode 0 (2) t (SUDAT) Data setup time Fast mode 100 ns High-speed mode 10 t (LOW) SCL clock LOW period Fast mode 1300 ns High-speed mode 160 t (HIGH) SCL clock HIGH period Fast mode 600 ns High-speed mode 60 t F Clock and data fall time Fast mode 300 ns High-speed mode 160 t R Clock and data rise time Fast mode 300 ns High-speed mode 160 SCLK ≤ 100 kHz Fast mode 1000 High-speed mode

30 Typical Units Shown

8 Typical Characteristics

Figure 1. Remote Temperature Error vs TMP411 Ambient Figure 2. Local Temperature Error vs TMP411 Ambient Figure 3. Remote Temperature Error vs Leakage Resistance Figure 4. Remote Temperature Error vs Series Resistance Figure 5. Remote Temperature Error vs Series Resistance Figure 6. Remote Temperature Error vs Differential

9 Detailed Description

9.1 Overview

minimum limits, and status information. supply bypass capacitor for good local bypassing. Figure 11 shows a typical configuration for the TMP411 . connected. TI recommends this layout for the MMBT3906LP and MMBT3904LP devices. Filtering section and Figure 5. Figure 11. Basic Connections

D ± SCL SDA GND Processor or ASIC SMBus Controller 4 5 2.7 V to 5.5 V 2.7 V to 5.5 V Built-In Thermal Transistor, Diode Overtemperature Shutdown THERM THERM2ALERT / Copyright © 2016, Texas Instruments Incorporated TMP411 www.ti.com SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 Product Folder Links: TMP411 Submit Documentation FeedbackCopyright © 2006–2016, Texas Instruments Incorporated

9.2 Functional Block Diagram

9.3 Feature Description

9.3.1 Series Resistance Cancellation

Figure 11 shows series resistance in an application circuit that results from printed circuit board (PCB) trace resistance and remote line length. The TMP411 automatically cancels the resistance, which prevents a temperature offset. The TMP411 device cancels up to 3 kΩ of series line resistance that eliminates the need for additional characterization and temperature offset correction. See Figure 4 and Figure 5 for details on the effect of series resistance and power-supply voltage on sensed remote temperature error.

9.3.2 Differential Input Capacitance

The TMP411 tolerates differential input capacitance of up to 1000 pF with minimal change in temperature error. The effect of capacitance on sensed remote temperature error is shown in Figure 6.

9.3.3 Temperature Measurement Data

Temperature measurement data is taken over a default range of 0°C to 127°C for local and remote locations. Measurements from –55°C to +150°C can be made locally and remotely by reconfiguring the TMP411 device for the extended temperature range. To change the TMP411 configuration from the standard to the extended temperature range, switch bit 2 (RANGE) of the Configuration Register from low to high. Temperature data resulting from conversions within the default measurement range are represented in binary form, as listed in the standard binary column of Table 1. Note that any temperature below 0°C results in a data value of zero (00h). Likewise, temperatures above 127°C results in a value of 127 (7Fh). The device can be set to measure over an extended temperature range by changing bit 2 of the Configuration Register from low to high. The change in measurement range and data format from standard binary to extended binary occurs at the next temperature conversion. For data captured in the extended temperature range configuration, an offset of 64 (40h) is added to the standard binary value, as listed in the extended binary column in Table 1. This configuration allows measurement of temperatures below 0°C. It is possible to have binary values in the range of –64°C to +191°C, but most temperature-sensing diodes measure in the range of –55°C to +150°C. The TMP411 device is rated only for ambient local temperatures ranging from –40°C to +125°C. Parameters in the Absolute Maximum Ratings table must be observed.

Table 1. Temperature Data Format (Local and Temperature High Bytes)

9.3.4 THERM (Pin 4) and ALERTor THERM2 (Pin 6)

Register: AL or TH bit = 1). The default setting configures pin 6 to function as an ALERT pin (AL or TH = 0). Temperature High and Low Limit Registers to set the comparison range. assert only if the range is violated a specified number of consecutive times (either one, two, three or four times). caused the alert no longer persists, and the Status Register is reset.

9.3.5 Sensor Fault

The TMP411 senses a fault at the D+ input resulting from an incorrect diode connection or an open circuit. The detection circuitry consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) − 0.6 V (typical). The comparator output is checked during a conversion. If a fault is detected, the last valid measured temperature is the temperature measurement result, the OPEN bit (Status Register, bit 2) is set high, and the ALERT pin asserts low if the alert function is enabled. The D+ and D− inputs must be connected together to prevent meaningless fault warnings when the TMP411 remote sensor is not in use.

9.3.6 Undervoltage Lockout

The TMP411 senses when the power-supply voltage reaches a minimum voltage level for the ADC converter to function. The detection circuitry consists of a voltage comparator that enables the ADC converter after the power supply (V+) exceeds 2.45 V (typical). The comparator output is checked during a conversion. The TMP411 does not perform a temperature conversion if the power supply is not valid. The last valid measured temperature is the temperature measurement result.

9.3.7 Filtering

Remote junction temperature sensors are typically implemented in a noisy environment. Noise is often created by fast digital signals that corrupt measurements. The TMP411 has a built-in 65-kHz filter on the D+ and D− inputs to minimize the effects of noise. TI recommends placing a bypass capacitor differentially across the sensor inputs to protect the application against unwanted coupled signals. The value of the capacitor must be between 100 pF and 1 nF. Some applications have better overall accuracy with additional series resistance, however, this increased accuracy is specific to the setup. When series resistance is added, the value must not be greater than 3 kΩ. If filtering is needed, TI recommends component values of 100-pF and 50-Ω on each input. Exact values are specific to the application. space NOTE Whenever changing between standard and extended temperature ranges, be aware that the temperatures stored in the temperature limit registers are NOT automatically reformatted to correspond to the new temperature range format. These temperature limit values must be reprogrammed in the appropriate binary or extended binary format. Local and remote temperature data uses two bytes for data storage. The high byte stores the temperature with a resolution of 1°C. The second or low byte stores the decimal fraction value of the temperature and allows a higher measurement resolution, as listed in Table 2. The measurement resolution for the remote channel is 0.0625°C, and is not adjustable. The measurement resolution for the local channel is adjustable, and can be set

Table 2. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes)

9.4 Device Functional Modes

9.4.1 Shutdown Mode (SD)

current conversion is completed. When shutdown is low, the device maintains a continuous conversion state.

9.4.2 One-Shot Conversion

in shutdown mode, an initial 200 μs is required before a one-shot command is given. following shutdown. One-shot commands can be issued without delay thereafter.

9.5 Programming

9.5.1 Serial Interface

data bytes are transmitted with the MSB first.

9.5.2 Bus Overview

the serial clock (SCL), controls the bus access, and generates the START and STOP conditions. addressed responds to the master by generating an acknowledge bit and pulling the SDA line low. interpreted as a control signal. low to high, while the SCL line is high.

9.5.3 Timing Diagrams

Bus Idle: Both SDA and SCL lines remain high. a START condition. A START condition initiates each data transfer. STOP condition. A STOP or repeated START condition terminates each data transfer. is determined by the master device. The receiver acknowledges the data transfer. and low during the high period of the acknowledge clock pulse. Setup and hold times must be taken into account. Figure 12. Two-Wire Timing Diagram

Figure 17. SMBus Alert Timing Diagram

9.5.4 Serial Bus Address

To communicate with the TMP411, the master must first address slave devices through a slave address byte. The slave address byte consists of seven address bits and a direction bit that indicates whether the operation is read or write. The address of the TMP411A is 4Ch (1001100b). The address of the TMP411B is 4Dh (1001101b). The address of the TMP411E is 4Ch (1001100b).

9.5.5 Read and Write Operations

To access a particular register on the TMP411, the appropriate value must be written to the Pointer Register. With the read and write bit low, the value for the Pointer Register is the first byte transferred after the slave address byte. Every write operation to the TMP411 requires a value for the Pointer Register, as shown in Figure 13. When reading from the TMP411, the last value stored in the Pointer Register by a write operation determines which register is read by a read operation. A new value must be written to the Pointer Register to change the register pointer for a read operation. This transaction is accomplished by issuing a slave address byte with the read and write bit low, followed by the Pointer Register byte. No additional data is required. The master then generates a START condition and sends the slave address byte with the read and write bit high to initiate the read command. See Figure 14 for details of this sequence. If repeated reads from the same register are desired, it is not necessary to continually send the Pointer Register bytes, because the TMP411 device retains the Pointer Register value until the next write operation changes the value. Note that the MSB sends the register bytes first, followed by the LSB.

9.5.6 Timeout Function

When bit 7 of the Consecutive Alert Register is set high, the TMP411 timeout function is enabled. The TMP411 device resets the serial interface if the SCL or SDA lines are held low for 30 ms (typical) between a START and STOP condition. If the TMP411 device is holding the bus low, the device releases the bus and waits for a START condition. To avoid activating the timeout function, it is necessary to maintain a communication speed of at least 1 kHz for the SCL operating frequency. The default state of the timeout function is enabled (bit 7 = high).

9.5.7 High-Speed Mode

For the two-wire bus to operate at frequencies above 400 kHz, the master device must issue a high-speed mode (Hs-mode) master code (00001XXX) as the first byte after a START condition to switch the bus to high-speed operation. The TMP411 device does not acknowledge this byte, but switches the input filters on the SDA and SCL lines, switches the output filter on SDA to operate in Hs-mode, which allows transfers at up to 3.4 MHz. After the Hs-mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer operation. The bus operates in high-speed mode until a STOP condition occurs on the bus. The TMP411 switches the input and output filter after receiving the STOP condition.

9.5.8 General Call Reset

The TMP411 device supports reset through the two-wire general call address 00h (0000 0000b). The TMP411 device reads the general call address and responds to the second byte. If the second byte is 06h (0000 0110b), the TMP411 executes a software reset. The software reset restores the power-on-reset state to all TMP411 registers, aborts any conversion in progress, and clears the ALERT and THERM pins. The TMP411 does not respond to other values in the second byte.

9.5.9 Software Reset

The TMP411 resets by writing any value to Pointer Register FCh. This restores the power-on-reset state to all of the TMP411 registers, aborts any conversion in process, and clears the ALERT and THERM pins.

9.5.10 SMBus Alert Function

The TMP411 device supports the SMBus alert function. When pin 6 is configured as an alert output, the ALERT pin of the TMP411 can connect as an SMBus alert signal. When a master detects an alert condition on the ALERT line, the master sends an SMBus alert command (00011001) on the bus. If the ALERT pin of the TMP411 is active, the device acknowledges the SMBus alert command and returns the slave address on the SDA line. The eighth bit of the slave address byte indicates if the high limit or low limit temperature settings caused the alert condition. The bit is high if the temperature is greater than or equal to one of the temperature high limit settings; the bit is low if the temperature is less than one of the temperature low limit settings. See Figure 16 for details of this sequence. If multiple devices on the bus respond to the SMBus alert command, arbitration during the slave address portion of the SMBus alert command determines which device clears the alert status. If the TMP411 wins the arbitration, the ALERT pin inactivates when the SMBus alert command is complete. If the TMP411 device loses the arbitration, the ALERT pin remains active.

(1) NA = not applicable; register is write- or read-only. (2) X = indeterminable state. (3) Offset registers 11 and 12 are only available for the TMP411E device.

9.6 Register Map

Table 3. Register Map Summary

00 NA (1) 00 LT11 LT10 LT9 LT8 LT7 LT6 LT5 LT4 Local Temperature (High Byte)

01 NA 00 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 Remote Temperature (High

02 NA XX BUSY LHIGH LLOW RHIGH RLOW OPEN RTHRM LTHRM Status Register

10 NA 00 RT3 RT2 RT1 RT0 0 0 0 0 Remote Temperature (Low Byte)

15 NA 00 LT3 LT2 LT1 LT0 0 0 0 0 Local Temperature (Low Byte)

Table 3. Register Map Summary (continued)

9.6.1 Register Information

9.6.2 Pointer Register

power-on-reset (POR) value of the Pointer Register is 00h (0000 0000b). Figure 18. Internal Register Structure

9.6.3 Temperature Registers

and are updated by the ADC each time a temperature measurement is completed. read output first, followed by the low byte. Both bytes of this read operation are from the same ADC conversion. The power-on-reset value of both temperature registers is 00h.

9.6.4 Limit Registers

The TMP411 has 11 registers for setting comparator limits for the local and remote measurement channels. These registers have read and write capability. The High and Low Limit Registers for both channels span two registers, as do the temperature registers. The local temperature high limit is set by writing the high byte to pointer address 0Bh, writing the low byte to pointer address 16h, or by using a single two-byte write command (high byte first) to pointer address 0Bh. The local temperature high limit is read by the high byte from pointer address 05h, the low byte from pointer address 16h, or by using a two-byte read command from pointer address 05h. The power-on-reset value of the local temperature high limit is 55h or 00h. The power-on-reset value of the local temperature high limit is 55h or 00h (85°C in standard temperature mode and 21°C in extended temperature mode). Similarly, the local temperature low limit is set by writing the high byte to pointer address 0Ch, writing the low byte to pointer address 17h, or by using a single two-byte write command to pointer address 0Ch. The local temperature low limit is read by the high byte from pointer address 06h, the low byte from pointer address 17h, or by using a two-byte read from pointer address 06h. The power-on-reset value of the local temperature low limit register is 00h (0°C in standard temperature mode, and −64°C in extended mode). The remote temperature high limit is set by writing the high byte to pointer address 0Dh, writing the low byte to pointer address 13h, or by using a two-byte write command to pointer address 0Dh. The remote temperature high limit is read by the high byte from pointer address 07h, the low byte from pointer address 13h, or by using a two-byte read command from pointer address 07h. The power-on-reset value of the Remote Temperature High Limit Register is 55h or 00h (85°C in standard temperature mode, and 21°C in extended temperature mode). The remote temperature low limit is set by writing the high byte to pointer address 0Eh,writing the low byte to pointer address 14h, or by using a two-byte write to pointer address 0Eh. The remote temperature low limit is read by the high byte from pointer address 08h, the low byte from pointer address 14h, or by using a two-byte read from pointer address 08h. The power-on-reset value of the Remote Temperature Low Limit Register is 00h (0°C in standard temperature mode, and −64°C in extended mode). The TMP411 has a THERM limit register for the local and remote channels. These registers are eight bits and allow for THERM limits to be set to 1°C resolution. The local channel THERM limit is set by writing to pointer address 20h. The remote channel THERM limit is set by writing to pointer address 19h. The local channel THERM limit is read from pointer address 20h, and the remote channel THERM limit is read from pointer address 19h. The power-on-reset value of the THERM limit registers is 55h (85°C in standard temperature mode or 21°C in extended temperature mode). The THERM limit comparators have hysteresis. The hysteresis of the comparators is set by writing to pointer address 21h. The hysteresis value is obtained by reading from pointer address 21h. The Hysteresis Register value is an unsigned number that is always positive. The power-on-reset value of this register is 0Ah (10°C). When changing between standard and extended temperature ranges, note that the temperatures stored in the temperature limit registers do not automatically reformat to correspond to the new temperature range format. These values must be reprogrammed in the appropriate binary or extended binary format.

9.6.5 Status Register

The TMP411 has a Status Register that reports the state of the temperature comparators. Table 4 lists the Status Register bits. The Status Register is read-only from pointer address 02h. The BUSY bit reads as 1 if the ADC is making a conversion, and 0 if the ADC is not converting. The OPEN bit reads as 1 if the remote transistor is detected as OPEN since the last read of the Status Register. The OPEN status is only detected when the ADC is attempting to convert a remote temperature. The RTHRM bit reads as 1 if the remote temperature exceeds the remote THERM limit, remains greater than the remote THERM limit, and less than the value in the shared Hysteresis Register, as shown in Figure 17. The LTHRM bit reads as 1 if the local temperature exceeds the local THERM limit, remains greater than the local THERM limit, and less than the value in the shared Hysteresis Register, as shown in Figure 17.

conversion. The BUSY bit is high whenever the TMP411 device is converting a temperature reading. Register. If the AL or TH bit is 1, the remote high limit and the local high limit implement a THERM2 function. high limit, and less than the value in the Hysteresis Register. remote high limit, and less than the value in the Hysteresis Register. exceeded since the last clearing of the Status Register. ALERT pin. An SMBus alert response address command must clear the ALERT pin. Table 4. Status Register Format

9.6.6 Configuration Register

reading from pointer address 03h. set to 1, the TMP411 retains the ALERT pin status, but the ALERT pin does not go low. continuous conversions. A single conversion starts by writing to the One-Shot Register when SD = 1. consecutive out-of-limit temperature measurements occur. the thresholds. THERM2 goes low when RHIGH or LHIGH is set.

+150°C). Temperature conversions are stored in the extended binary format, as listed in Table 1. this register is 00h. Table 5 lists the Configuration Register bits. Table 5. Configuration Register Bit Descriptions

7 MASK 0 = ALERT enabled

6 SD 0 = Run

5 AL or TH 0 = ALERT mode

2 Temperature range 0 = 0°C to 127°C

9.6.7 Resolution Register

temperature measurement channel. Remote temperature measurement channel resolution is not effected. resolution bits for the Resolution Register. Table 6. Resolution Register: Local Channel Programmable Resolution to 0. The power-on-reset value of this register is 1Ch.

9.6.8 Conversion Rate Register

corresponding current consumption.

Table 7. Conversion Rate Register

9.6.9 N-Factor Correction Register

the temperature of the remote transistor. Equation 1 relates the voltage and temperature. power-on-reset value is 00h, which is not effected unless the value is written to.

Table 8. N-Factor Range

9.6.10 Minimum and Maximum Registers

to any of the pointer addresses 30h through 37h. The reset value for these registers is FFh and F0h. value for these registers is 00h and 00h. reset value for these registers is FFh and F0h. reset value for these registers is 00h and 00h.

9.6.11 Consecutive Alert Register

Table 9. Consecutive Alert Register Bit 7 of the Consecutive Alert Register controls the enable/disable of the timeout function. See the Timeout Function section for a description of this feature.

9.6.12 THERM Hysteresis Register

10°C, whether the device is operating in the standard or extended mode setting. Table 10. Allowable THERM Hysteresis Values

Table 11. THERM Hysteresis Register Format

9.6.13 Remote Temperature Offset Register

allows for an accurate system calibration over the entire temperature range.

9.6.14 Identification Registers

The TMP411 allows for the two-wire bus controller to query the device for manufacturer and device identification. 55h. The device identification depends on the specific model, as listed in Table 3. These registers are read-only.

1.004 1.008T 273.15 100 C1.008 T 1.48 C § · u ¨ ¸ © ¹ ERR n 1.008T 273.15 T( C)1.008 § · u ¨ ¸ © ¹ TMP411 SBOS383D –DECEMBER 2006–REVISED DECEMBER 2016 www.ti.com Product Folder Links: TMP411 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

10.1 Application Information

The TMP411 only requires a transistor connected between the D+ and D– pins for remote temperature measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is measured. The SDA, ALERT and THERM pins (and SCL, if driven by an open-drain output) require pullup resistors as part of the communication bus. TI recommends using a 0.1-µF power-supply decoupling capacitor for local bypassing. Figure 11 illustrates the typical configurations for the TMP411.

10.2 Typical Application

10.2.1 Design Requirements

The TMP411 is designed to be used with discrete transistors or substrate transistors built into processor chips and ASICs. NPN or PNP transistors can be used, as long as the base-emitter junction is the remote temperature sensor. A transistor or diode connection can be used, as shown in Figure 11. Errors in remote temperature sensor readings are the result of the ideality factor and current excitation from the TMP411 versus the manufacturer-specified operating current for a given transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate transistors. The TMP411 has an ILOW value of 6 μA, and an IHIGH value of 120 μA. The TMP411 allows for different n-factor values, as shown in Table 8. The ideality factor (n) is a measured characteristic of a remote temperature sensor diode compared to an ideal diode. The ideality factor reduces to a value of 1.008. For transistors with an ideality factor that does not match the TMP411, Equation 4 calculates the temperature error. Note that the actual temperature (°C) must be converted to Kelvin (°K) for the equation to yield the correct results. where:

n = the ideality factor of the remote temperature sensor
T(°C) = actual temperature
TERR = device reading error due to n ≠ 1.008
Degree delta is the same for °C and °K (4) For n = 1.004 and T(°C) = 100°C, use Equation 5: (5) If a discrete transistor is used as the remote temperature sensor, selecting the transistor according to the following criteria results in the best accuracy. 1. Base-emitter voltage > 0.25 V at 6 µA, at the highest sensed temperature. 2. Base-emitter voltage < 0.95 V at 120 µA, at the lowest sensed temperature. 3. Base resistance < 100 Ω 4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150).

10.2.2 Detailed Design Procedure

a small, SOT-23 transistor) placed close to the device , this delay is usually not a concern. temperature sensor is negligible because of the small currents used. approximately 0.318°C above the ambient.

10.2.3 Application Curves

Figure 19. Remote Temperature Error vs TMP411 Ambient Figure 20. Local Temperature Error vs TMP411 Ambient

11 Power Supply Recommendations

The TMP411 operates with a power supply range of 2.7 V to 5.5 V. The device is optimized for operation at a 3.3-V supply, but measures temperature accurately in the full supply range. TI recommends using a power supply bypass capacitor. Place the capacitor as close as possible to the supply and ground pins of the device. 0.1 µF is a typical value for the supply bypass capacitor. Applications with noisy or high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.

12 Layout

12.1 Layout Guidelines

Place the TMP411 as close to the remote junction sensor as possible.
Route the D+ and D– traces next to each other and shield the traces from adjacent signals using ground guard traces, as shown in Figure 21. If a multilayer PCB is used, bury these traces between ground or VDD planes to shield them from extrinsic noise sources. TI recommends using 5-mm (0.127 mm) PCB traces.
Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are used, make the same number and approximate location of copper-to-solder connections in the D+ and D– connections to cancel any thermocouple effects.
Use a 0.1–µF local bypass capacitor directly between the V+ and GND pins of the TMP411, as shown in

Figure 22. Minimize filter capacitance between D+ and D– to 1000 pF or less for optimum measurement

If the connection between the remote temperature sensor and the TMP411 is less than eight inches (20 cm), use a twisted-wire pair connection. If the connection measures more than eight inches (20 cm), use a twisted, shielded pair with the shield grounded as close to the TMP411 as possible. Leave the remote sensor connection end of the shield wire open to avoid grounded loops and 60-Hz pickup.

Figure 21. Example Signal Traces

Figure 22. Suggested Bypass Capacitor Placement

12.2 Layout Example

Figure 23. TMP411 Device Layout

13 Device and Documentation Support

13.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

E2E is a trademark of Texas Instruments. DLP is a trademark of others. All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.5 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP411AD Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 T411A TMP411ADGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411A TMP411ADGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 411A TMP411ADGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 411A TMP411ADGKT Obsolete Production VSSOP (DGK) | 8 - - Call TI Call TI -40 to 125 411A TMP411ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 T411A TMP411ADR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 T411A TMP411BD Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 T411B TMP411BDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411B TMP411BDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 411B TMP411BDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 411B TMP411BDGKT Obsolete Production VSSOP (DGK) | 8 - - Call TI Call TI -40 to 125 411B TMP411BDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 T411B TMP411BDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 T411B TMP411CD Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 T411C TMP411CDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411C TMP411CDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411C TMP411CDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411C TMP411CDGKT Obsolete Production VSSOP (DGK) | 8 - - Call TI Call TI -40 to 125 411C TMP411CDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 T411C TMP411CDR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 T411C TMP411CDR.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 T411C TMP411EDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411E TMP411EDGKR.A Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411E TMP411EDGKR.B Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAUAG Level-2-260C-1 YEAR -40 to 125 411E TMP411EDGKT Obsolete Production VSSOP (DGK) | 8 - - Call TI Call TI -40 to 125 411E (1) Status: For more details on status, see our product life cycle. Addendum-Page 1

www.ti.com 23-May-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP411 :

Automotive : TMP411-Q1 NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP411ADGKR VSSOP DGK 8 2500 367.0 367.0 38.0 TMP411ADGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TMP411ADR SOIC D 8 2500 356.0 356.0 35.0 TMP411BDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TMP411BDGKR VSSOP DGK 8 2500 367.0 367.0 38.0 TMP411BDR SOIC D 8 2500 356.0 356.0 35.0 TMP411CDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TMP411CDR SOIC D 8 2500 356.0 356.0 35.0 TMP411EDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 6X 0.65 1.95 8X 0.38 0.25 5.05

4.75 TYP

0.15 0.05 0.25 GAGE PLANE 0 -8

1.1 MAX

0.23 0.13 B 3.1 2.9 NOTE 4 A 3.1 2.9 NOTE 3 0.7 0.4 VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023

0.13 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187. PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

8X (1.4) 8X (0.45) 6X (0.65) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. 9. Size of metal pad may vary due to creepage requirement. TM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SYMM SYMM SEE DETAILS 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 8X (1.4) 8X (0.45) 6X (0.65) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE SCALE: 15X SYMM SYMM

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

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Product Information

TMP411ADGKR.B specifications and overview.

Summary

TMP411 ±1°C Remote and Local Temperature Sensor With N-Factor and Series Resistance Correction REVISED DECEMBER 2016

Description

TMP411 ±1°C Remote and Local Temperature Sensor With N-Factor and Series Resistance Correction REVISED DECEMBER 2016

Source title TMP411ADGKR.B Datasheet(PDF) - Texas Instruments

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