TMP411AD

TMP411ADRG4 TI | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 32

Technical content

FEATURES

/C0068±1°C REMOTE DIODE SENSOR /C0068±1°C LOCAL TEMPERATURE SENSOR /C0068PROGRAMMABLE NON-IDEALITY FACTOR /C0068SERIES RESISTANCE CANCELLATION /C0068ALERT FUNCTION /C0068PROGRAMMABLE RESOLUTION: 9 to 12 Bits /C0068PROGRAMMABLE THRESHOLD LIMITS /C0068TWO-WIRE/SMBus  SERIAL INTERFACE /C0068MINIMUM AND MAXIMUM TEMPERATURE MONITORS /C0068MULTIPLE INTERFACE ADDRESSES /C0068ALERT /THERM2 PIN CONFIGURATION /C0068DIODE FAULT DETECTION

APPLICATIONS

/C0068LCD/DLP /LCOS PROJECTORS /C0068SERVERS /C0068INDUSTRIAL CONTROLLERS /C0068CENTRAL OFFICE TELECOM EQUIPMENT /C0068DESKTOP AND NOTEBOOK COMPUTERS /C0068STORAGE AREA NETWORKS (SAN) /C0068INDUSTRIAL AND MEDICAL EQUIPMENT /C0068PROCESSOR/FPGA TEMPERATURE MONITORING

DESCRIPTION

The TMP411 is a remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensor diode-connected transistors are typically low-cost, NPN- or PNP-type transistors or diodes that are an integral part of microcontrollers, microprocessors, or FPGAs. Remote accuracy is ±1°C for multiple IC manufacturers, with no calibration needed. The Two-Wire serial interface accepts SMBus write byte, read byte, send byte, and receive byte commands to program the alarm thresholds and to read temperature data. Features that are included in the TMP411 are: series resistance cancellation, programmable non-ideality factor, programmable resolution, programmable threshold limits, minimum and maximum temperature monitors, wide remote temperature measurement range (up to +150°C), diode fault detection, and temperature alert function. The TMP411 is available in both MSOP-8 and SO-8 packages. TMP411 SBOS383C − DECEMBER 2006 − REVISED MAY 2008 ±1°C Remote and Local TEMPERATURE SENSOR with N-Factor and Series Resistance Correction /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 www.ti.com Copyright  2006−2008, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DLP is a registered trademark of Texas Instruments. SMBus is a trademark of Intel Corp. All other trademarks are the property of their respective owners. Device ID Register Manufacturer ID Register THERM Hysteresis Register Consecutive Alert Configuration Register TR TL Status Register Conversion Rate Register N−Factor Correction One− Shot Register Bus Interface Pointer Register Resolution Register Configuration Register Local Temp Low Limit Local THERM Limit Local Temp High Limit Remote Temp Low Limit Remote THERM Limit Remote Temp High Limit Remote Temperature Register Local Temperature Register Temperature Comparators Interrupt Configuration SCL GND THERM4

6 ALERT/THERM2V+

Remote Temperature Min/Max Register Local Temperature Min/Max Register

/C0084/C0077/C0080/C0052/C0049/C0049 SBOS383C − DECEMBER 2006 − REVISED MAY 2008 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) ESD Rating: (1)Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT DESCRIPTION I2C ADDRESS PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING TMP41 1A Remote Junction Temperature Sensor 100 1100 MSOP-8 DGK 411A TMP41 1A Remote Junction Temperature Sensor 100 1100 SO-8 D T411A TMP41 1B Remote Junction Temperature Sensor 100 1101 MSOP-8 DGK 411B TMP41 1B Remote Junction Temperature Sensor 100 1101 SO-8 D T411B TMP41 1C Remote Junction Temperature Sensor 100 1110 MSOP-8 DGK 411C TMP41 1C Remote Junction Temperature Sensor 100 1110 SO-8 D T411C (1)For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATION Top View MSOP , SO SCL SDA ALERT/THERM2 GND D − THERM TMP411 PIN ASSIGNMENTS PIN NAME DESCRIPTION 1 V+ Positive supply (2.7V to 5.5V)

2 D+ Positive connection to remote temperature

3 D− Negative connection to remote temperature

4 THERM Thermal flag, active low, open-drain;

requires pull-up resistor to V+

5 GND Ground

6 ALERT /THERM2

Alert (reconfigurable as second thermal flag), active low, open-drain; requires pull-up resistor to V+

7 SDA Serial data line for SMBus, open-drain;

requires pull-up resistor to V+

8 SCL Serial clock line for SMBus, open-drain;

requires pull-up resistor to V+

/C0084/C0077/C0080/C0052/C0049/C0049 SBOS383C − DECEMBER 2006 − REVISED MAY 2008 www.ti.com

ELECTRICAL CHARACTERISTICS

At TA = −40°C to +125°C and VS = 2.7V to 5.5V, unless otherwise noted. TMP411 PARAMETERS CONDITIONS MIN TYP MAX UNITS TEMPERATURE ERROR Local Temperature Sensor TE LOCAL TA = −40°C to +125°C ±1.25 ±2.5 °C Remote Temperature Sensor(1) TEREMOTE TA = +15°C to +75°C, TDIODE = −40°C to +150°C, VS = 3.3V ±0.0625 ±1 °C TA = −40°C to +100°C, TDIODE = −40°C to +150°C, VS = 3.3V ±1 ±3 °C TA = −40°C to +125°C, TDIODE = −40°C to +150°C ±3 ±5 °C vs Supply Local/Remote VS = 2.7V to 5.5V ±0.2 ±0.5 °C/V TEMPERATURE MEASUREMENT Conversion Time (per channel) One-Shot Mode 105 115 125 ms Resolution Local Temperature Sensor (programmable) 9 12 Bits Remote Temperature Sensor 12 Bits Remote Sensor Source Currents High Series Resistance 3kΩ Max 120 µA Medium High 60 µA Medium Low 12 µA Low 6 µA Remote Transistor Ideality Factor η TMP411 Optimized Ideality Factor 1.008 SMBus INTERFACE Logic Input High Voltage (SCL, SDA) VIH 2.1 V Logic Input Low Voltage (SCL, SDA) VIL 0.8 V Hysteresis 500 mV SMBus Output Low Sink Current 6 mA Logic Input Current −1 +1 µA SMBus Input Capacitance (SCL, SDA) 3 pF SMBus Clock Frequency 3.4 MHz SMBus Timeout 25 30 35 ms SCL Falling Edge to SDA Valid Time 1 µs DIGITAL OUTPUTS Output Low Voltage VOL IOUT = 6mA 0.15 0.4 V High-Level Output Leakage Current IOH VOUT = VS 0.1 1 µA ALERT /THERM2 Output Low Sink Current ALERT /THERM2 Forced to 0.4V 6 mA THERM Output Low Sink Current THERM Forced to 0.4V 6 mA POWER SUPPLY Specified Voltage Range VS 2.7 5.5 V Quiescent Current IQ 0.0625 Conversions per Second, VS = 3.3V 28 30 µA Eight Conversions per Second, VS = 3.3V 400 475 µA Serial Bus Inactive, Shutdown Mode 3 10 µA Serial Bus Active, fS = 400kHz, Shutdown Mode 90 µA Serial Bus Active, fS = 3.4MHz, Shutdown Mode 350 µA Undervoltage Lock Out 2.3 2.4 2.6 V Power-On Reset Threshold POR 1.6 2.3 V TEMPERATURE RANGE Specified Range −40 +125 °C Storage Range −60 +130 °C Thermal Resistance MSOP-8, SO-8 150 °C/W (1)Tested with less than 5Ω effective series resistance and 100pF differential input capacitance. TA is the ambient temperature of the TMP411. TDIODE is the temperature at the remote diode sensor.

At TA = +25°C and VS = 5.0V, unless otherwise noted.

30 Typical Units Shown

Figure 3. Figure 4.

maximum/minimum limits, and status information. response to rising temperatures. (1) Diode−connected configuration provides better settling time. Transistor−connected configuration provides better series resistance cancellation. specific application; seeFilteringsection. Temperature Error vs Differential Capacitance. Figure 11. Basic Connections

otherwise result in a temperature offset. characterization and temperature offset correction. sensed remote temperature error. Error vs Differential Capacitance. (Figure 6). range of 0°C to +127°C for both local and remote locations. Configuration Register from low to high. Table 1. Temperature Data Format

Table 3. Register Map

00 NA (1) 00 LT11 LT10 LT9 LT8 LT7 LT6 LT5 LT4 Local Temperature (High Byte)

01 NA 00 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 Remote Temperature

02 NA XX BUSY LHIGH LLOW RHIGH RLOW OPEN RTHRM LTHRM Status Register

10 NA 00 RT3 RT2 RT1 RT0 0 0 0 0 Remote Temperature

15 NA 00 LT3 LT2 LT1 LT0 0 0 0 0 Local Temperature (Low Byte)

(1)NA = not applicable; register is write- or read-only.

/C0084/C0077/C0080/C0052/C0049/C0049 SBOS383C − DECEMBER 2006 − REVISED MAY 2008 www.ti.com TEMPERATURE REGISTERS The TMP411 has four 8-bit registers that hold temperature measurement results. Both the local channel and the remote channel have a high byte register that contains the most significant bits (MSBs) of the temperature analog-to-digital converter (ADC) result and a low byte register that contains the least significant bits (LSBs) of the temperature ADC result. The local channel high byte address is 00h; the local channel low byte address is 15h. The remote channel high byte is at address 01h; the remote channel low byte address is 10h. These registers are read-only and are updated by the ADC each time a temperature measurement is completed. The TMP411 contains circuitry to assure that a low byte register read command returns data from the same ADC conversion as the immediately preceding high byte read command. This assurance remains valid only until another register is read. For proper operation, the high byte of a temperature register should be read first. The low byte register should be read in the next read command. The low byte register may be left unread if the LSBs are not needed. Alternatively, the temperature registers may be read as a 16-bit register by using a single two-byte read command from address 00h for the local channel result or from address 01h for the remote channel result. The high byte will be output first, followed by the low byte. Both bytes of this read operation will be from the same ADC conversion. The power-on reset value of both temperature registers is 00h. LIMIT REGISTERS The TMP411 has 11 registers for setting comparator limits for both the local and remote measurement channels. These registers have read and write capability. The High and Low Limit Registers for both channels span two registers, as do the temperature registers. The local temperature high limit is set by writing the high byte to pointer address 0Bh and writing the low byte to pointer address 16h, or by using a single two-byte write command (high byte first) to pointer address 0Bh. The local temperature high limit is obtained by reading the high byte from pointer address 05h and the low byte from pointer address 16h or by using a two-byte read command from pointer address 05h. The power-on reset value of the local temperature high limit is 55h/00h. The power-on reset value of the local temperature high limit is 55h/00h (+85°C in standard temperature mode; +21°C in extended temperature mode). Similarly, the local temperature low limit is set by writing the high byte to pointer address 0Ch and writing the low byte to pointer address 17h, or by using a single two-byte write command to pointer address 0Ch. The local temperature low limit is read by reading the high byte from pointer address 06h and the low byte from pointer address 17h, or by using a two-byte read from pointer address 06h. The power-on reset value of the local temperature low limit register is 00h/00h (0°C in standard temperature mode; −64°C in extended mode). The remote temperature high limit is set by writing the high byte to pointer address 0Dh and writing the low byte to pointer address 13h, or by using a two-byte write command to pointer address 0Dh. The remote temperature high limit is obtained by reading the high byte from pointer address 07h and the low byte from pointer address 13h, or by using a two-byte read command from pointer address 07h. The power-on reset value of the Remote Temperature High Limit Register is 55h/00h (+85°C in standard temperature mode; +21°C in extended temperature mode). The remote temperature low limit is set by writing the high byte to pointer address 0Eh and writing the low byte to pointer address 14h, or by using a two-byte write to pointer address 0Eh. The remote temperature low limit is read by reading the high byte from pointer address 08h and the low byte from pointer address 14h, or by using a two-byte read from pointer address 08h. The power-on reset value of the Remote Temperature Low Limit Register is 00h/00h (0°C in standard temperature mode; −64°C in extended mode). The TMP411 also has a THERM limit register for both the local and the remote channels. These registers are eight bits and allow for THERM limits set to 1°C resolution. The local channel THERM limit is set by writing to pointer address 20h. The remote channel THERM limit is set by writing to pointer address 19h. The local channel THERM limit is obtained by reading from pointer address 20h; the remote channel THERM limit is read by reading from pointer address 19h. The power-on reset value of the THERM limit registers is 55h (+85°C in standard temperature mode; +21°C in extended temperature mode). The THERM limit comparators also have hysteresis. The hysteresis of both comparators is set by writing to pointer address 21h. The hysteresis value is obtained by reading from pointer address 21h. The value in the Hysteresis Register is an unsigned number (always positive). The power-on reset value of this register is 0Ah (+10°C). Whenever changing between standard and extended temperature ranges, be aware that the temperatures stored in the temperature limit registers are NOT automatically reformatted to correspond to the new temperature range format. These values must be reprogrammed in the appropriate binary or extended binary format.

by reading from pointer address 02h. conversion. It reads as ‘0’ if the ADC is not converting. detected as open since the last read of the Status Register. attempting to convert a remote temperature. Hysteresis Register; see Figure 18. Hysteresis Register; see Figure 18. exceeded since the last clearing of the Status Register. the value in the Hysteresis Register. exceeded since the last clearing of the Status Register. exceeded since the last clearing of the Status Register. Table 4. Status Register Format the TMP411 is converting a temperature reading.

by reading from pointer address 03h. SD = 1 by writing to the One-Shot Register. extended binary format (see Table 1). of the Configuration Register. Table 5. Configuration Register Bit Descriptions

7 MASK 0 = ALERT Enabled

6 SD 0 = Run

5 AL/TH 0 = ALERT Mode

2 Temperature Range 0 = 0°C to +127°C

measurement channel resolution is not affected. the resolution bits for the Resolution Register. Table 6. Resolution Register: options and corresponding current consumption. applies to the 200µs immediately following shutdown. Table 7. Conversion Rate Register

transistor. Equation 1 relates this voltage and temperature. effective n-factor according to Equation 2 and Equation 3. value may be written to and read from pointer address 18h. Table 8. N-Factor Range address 30h and the low byte from pointer address 31h. value for these registers is 00h/00h. 37h. The reset value for these registers is FFh/F0h. using a two-byte read command from pointer address 36h. 37h. The reset value for these registers is 00h/00h.

to other values in the second byte. consecutive alert bits are shown in Table 9. Table 9. Consecutive Alert Register Function section for a description of this feature. Table 10. Allowable THERM Hysteresis Values and generates the START and STOP conditions. indicating whether a read or write operation is intended. interpreted as a control signal. low to high, while SCL is high.

a value for the Pointer Register (see Figure 14). bit high to initiate the read command. register bytes are sent MSB first, followed by the LSB. Table 11. THERM Hysteresis Register Format

output filter back to fast-mode operation. for 30ms (typical) between a START and STOP condition. function is enabled (bit 7 = high). configures pin 6 to function as ALERT (AL/TH = 0). Table 10. The default hysteresis is 10°C. When the Registers to set its comparison range. Local/Remote Temperature High/Low Limit Registers. and the Status Register has been reset. Figure 18. SMBus Alert Timing Diagram

/C0084/C0077/C0080/C0052/C0049/C0049 SBOS383C − DECEMBER 2006 − REVISED MAY 2008 www.ti.com SMBUS ALERT FUNCTION The TMP411 supports the SMBus Alert function. When pin 6 is configured as an alert output, the ALERT pin of the TMP411 may be connected as an SMBus Alert signal. When a master detects an alert condition on the ALERT line, the master sends an SMBus Alert command (00011001) on the bus. If the ALERT pin of the TMP411 is active, the devices will acknowledge the SMBus Alert command and respond by returning its slave address on the SDA line. The eighth bit (LSB) of the slave address byte indicates whether the temperature exceeding one of the temperature high limit settings or falling below one of the temperature low limit settings caused the alert condition. This bit will be high if the temperature is greater than or equal to one of the temperature high limit settings; this bit will be low if the temperature is less than one of the temperature low limit settings. See Figure 17 for details of this sequence. If multiple devices on the bus respond to the SMBus Alert command, arbitration during the slave address portion of the SMBus Alert command determines which device will clear its alert status. If the TMP411 wins the arbitration, its ALERT pin becomes inactive at the completion of the SMBus Alert command. If the TMP411 loses the arbitration, the ALERT pin remains active. SHUTDOWN MODE (SD) The TMP411 Shutdown Mode allows the user to save maximum power by shutting down all device circuitry other than the serial interface, reducing current consumption to typically less than 3µA; see typical characteristic curve Shutdown Quiescent Current vs Supply Voltage . Shutdown Mode is enabled when the SD bit of the Configuration Register is high; the device shuts down once the current conversion is completed. When SD is low, the device maintains a continuous conversion state. SENSOR FAULT The TMP411 will sense a fault at the D+ input resulting from incorrect diode connection or an open circuit. The detection circuitry consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) − 0.6V (typical). The comparator output is continuously checked during a conversion. If a fault is detected, the last valid measured temperature is used for the temperature measurement result, the OPEN bit (Status Register, bit 2) is set high, and, if the alert function is enabled, ALERT asserts low. When not using the remote sensor with the TMP411, the D+ and D− inputs must be connected together to prevent meaningless fault warnings. UNDER-VOLTAGE LOCKOUT The TMP411 senses when the power-supply voltage has reached a minimum voltage level for the ADC converter to function. The detection circuitry consists of a voltage comparator that enables the ADC converter after the power supply (V+) exceeds 2.45V (typical). The comparator output is continuously checked during a conversion. The TMP411 will not perform a temperature conversion if the power supply is not valid. The last valid measured temperature is used for the temperature measurement result. GENERAL CALL RESET The TMP411 supports reset via the Two-Wire General Call address 00h (0000 0000b). The TMP411 acknowledges the General Call address and responds to the second byte. If the second byte is 06h (0000 0110b), the TMP411 executes a software reset. This software reset restores the power-on reset state to all TMP411 registers, aborts any conversion in progress, and clears the ALERT and THERM pins. The TMP411 takes no action in response to other values in the second byte. IDENTIFICATION REGISTERS The TMP411 allows for the Two-Wire bus controller to query the device for manufacturer and device IDs. This feature allows for software identification of the device at the particular Two-Wire bus address. The manufacturer ID is obtained by reading from pointer address FEh. The TMP411 manufacturer code is 55h. The device ID depends on the specific model; see the Register Map (Table 3). These registers are read-only. FILTERING Remote junction temperature sensors are usually implemented in a noisy environment. Noise is most often created by fast digital signals, and it can corrupt measurements. The TMP411 has a built-in 65kHz filter on the inputs of D+ and D− to minimize the effects of noise. However, a bypass capacitor placed differentially across the inputs of the remote temperature sensor is recommended to make the application more robust against unwanted coupled signals. The value of the capacitor should be between 100pF and 1nF. Some applications attain better overall accuracy with additional series resistance; however, this increased accuracy is setup-specific. When series resistance is added, the value should not be greater than 3kΩ. If filtering is needed, the suggested component values are 100pF and 50 Ω on each input. Exact values are application-specific.

/C0084/C0077/C0080/C0052/C0049/C0049 SBOS383C − DECEMBER 2006 − REVISED MAY 2008 www.ti.com REMOTE SENSING The TMP411 is designed to be used with either discrete transistors or substrate transistors built into processor chips and ASICs. Either NPN or PNP transistors can be used, as long as the base-emitter junction is used as the remote temperature sense. Either a transistor or diode connection can also be used; see Figure 11. Errors in remote temperature sensor readings will be the consequence of the ideality factor and current excitation used by the TMP411 versus the manufacturer-specified operating current for a given transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate transistors. The TMP411 uses 6 µA for I LOW and 120µA for IHIGH . The TMP411 allows for different n-factor values; see the N-Factor Correction Register section. The ideality factor (n) is a measured characteristic of a remote temperature sensor diode as compared to an ideal diode. The ideality factor for the TMP411 is trimmed to be 1.008. For transistors whose ideality factor does not match the TMP411, Equation 4 can be used to calculate the temperature error. Note that for the equation to be used correctly, actual temperature (°C) must be converted to Kelvin (°K). TERR /C0043/C0466n /C00421.008 1.008 /C0467/C0032/C0466273.15/C0041T/C0466/C0176C /C0467/C0467 Where: n = Ideality factor of remote temperature sensor T(°C) = actual temperature TERR = Error in TMP411 reading due to n ≠ 1.008 Degree delta is the same for °C and °K For n = 1.004 and T(°C) = 100°C: TERR /C0043/C04661.004/C00421.008 1.008 /C0467/C0032/C0466273.15/C0041100/C0176C /C0467 TERR /C0043/C00421.48/C0176C If a discrete transistor is used as the remote temperature sensor with the TMP411, the best accuracy can be achieved by selecting the transistor according to the following criteria: 1. Base-emitter voltage > 0.25V at 6µA, at the highest sensed temperature. 2. Base-emitter voltage < 0.95V at 120µA, at the lowest sensed temperature. 3. Base resistance < 100Ω. 4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150). Based on these criteria, two recommended small-signal transistors are the 2N3904 (NPN) or 2N3906 (PNP). MEASUREMENT ACCURACY AND THERMAL CONSIDERATIONS The temperature measurement accuracy of the TMP411 depends on the remote and/or local temperature sensor being at the same temperature as the system point being monitored. Clearly, if the temperature sensor is not in good thermal contact with the part of the system being monitored, then there will be a delay in the response of the sensor to a temperature change in the system. For remote temperature sensing applications using a substrate transistor (or a small, SOT23 transistor) placed close to the device being monitored, this delay is usually not a concern. The local temperature sensor inside the TMP411 monitors the ambient air around the device. The thermal time constant for the TMP411 is approximately two seconds. This constant implies that if the ambient air changes quickly by 100°C, it would take the TMP411 about 10 seconds (that is, five thermal time constants) to settle to within 1°C of the final value. In most applications, the TMP411 package is in electrical and therefore thermal contact with the printed circuit board (PCB), as well as subjected to forced airflow. The accuracy of the measured temperature directly depends on how accurately the PCB and forced airflow temperatures represent the temperature that the TMP411 is measuring. Additionally, the internal power dissipation of the TMP411 can cause the temperature to rise above the ambient or PCB temperature. The internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the small currents used. For a 5.5V supply and maximum conversion rate of eight conversions per second, the TMP411 dissipates 1.82mW (PD IQ = 5.5V × 330µA). If both the ALERT/THERM2 and THERM pins are each sinking 1mA, an additional power of 0.8mW is dissipated (PDOUT = 1mA × 0.4V + 1mA × 0.4V = 0.8mW). Total power dissipation is then 2.62mW (PDIQ + PDOUT ) and, with an /C0113JA of 150°C/W, causes the junction temperature to rise approximately 0.393°C above the ambient. (4) (5)

www.ti.com 16-Aug-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TMP411AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411ADGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411ADGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

www.ti.com 16-Aug-2012 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TMP411CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411CDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR TMP411CDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR TMP411CDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411CDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP411CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

www.ti.com 16-Aug-2012 Addendum-Page 3 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP411 :

• Automotive: TMP411-Q1 NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP411ADGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TMP411ADGKT VSSOP DGK 8 250 366.0 364.0 50.0 TMP411ADR SOIC D 8 2500 367.0 367.0 35.0 TMP411BDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TMP411BDGKT VSSOP DGK 8 250 366.0 364.0 50.0 TMP411BDR SOIC D 8 2500 367.0 367.0 35.0 TMP411CDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TMP411CDGKT VSSOP DGK 8 250 366.0 364.0 50.0 TMP411CDR SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2012 Pack Materials-Page 2

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents whichmeet ISO/TS16949 requirements,mainlyforautomotiveuse.Components which have notbeen so designatedareneitherdesignednorintendedforautomotiveuse;and TIwillnotbe responsibleforany failureofsuch components tomeet such requirements. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2012,Texas InstrumentsIncorporated