TMP303 TI | Alldatasheet
Document overview
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Technical content
Temperature Accuracy (qC) Population -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 D003 100k/c87 OUT HYSTSET1 HYSTSET0 1.4V to 3.6V VS GND SOH T emperature Sensor Hysteresis Logic Trip Point Logic /c68/c83 ADC Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP303 SBOS486I –JULY 2009–REVISED DECEMBER 2018 TMP303Easy-to-Use,Low-Power,1°C,Low-Supply TemperatureRangeMonitorInMicropackage
1 Features
1• Low Power: 5 μA (Maximum)
- SOT-563 Package: 1.60 × 1.60 × 0.6 mm
- Trip Point Accuracy: – ±0.2°C (Typical) from –40°C to 125°C
- Push-Pull Output
- Selectable Hysteresis: 1/2/5/10°C
- Supply Voltage Range: 1.4 V to 3.6 V
2 Applications
- Battery Charging
- Battery Thermal Protection
- Consumer Electronics
- Enterprise
- Telecom
3 Description
The TMP303 devices are temperature range monitors that offer design flexibility through an extra small footprint (SOT-563), low power (5 μA maximum) and low supply voltage capability (as low as 1.4 V). These devices require no additional components for operation; each can function independent of microprocessors or microcontrollers. There are seven trip points available see Device Options. Trip points can be programmed at the factory to any desired temperature. For applications that require different values, contact your local TI representative. The OUT pin is a push-pull, active-high output. When the measured temperature is beyond the trip point range, and the Set Output High (SOH) pin is low, the OUT pin is high. The SOH pin is an input pin with an internal pulldown resistor. When the SOH pin is forced high, the OUT pin goes high regardless of the measured temperature. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP303 SOT-563 (6) 1.60 mm × 1.20 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. TMP303 Functional Block Diagram Typical Trip Threshold Accuracy at -20°C to 125°C
SBOS486I –JULY 2009–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP303 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated Table of Contents
12.1 Receiving Notification of Documentation Updates 17
13 Mechanical, Packaging, and Orderable
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision H (October 2018) to Revision I Page
- Changed input pin voltage maximum value in the Absolute Maximum Ratings table from: ((V+) + 0.5) and ≤ 4 to:
- Changed output pin voltage maximum value n the Absolute Maximum Ratings table from: ((V+) + 0.5) and ≤ 4 to: Changes from Revision F (February 2016) to Revision G Page Changes from Revision E (October 2015) to Revision F Page Changes from Revision D (September 2015) to Revision E Page Changes from Revision C (September 2015) to Revision D Page
www.ti.com SBOS486I –JULY 2009–REVISED DECEMBER 2018 Product Folder Links: TMP303 Submit Documentation FeedbackCopyright © 2009–2018, Texas Instruments Incorporated Changes from Revision B (January 2011) to Revision C Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Changes from Revision A (September 2009) to Revision B Page (1) Contact a TI representative for other trip points.
5 Device Options
DEVICE TRIP POINTS (°C) TMP303A TL = 0, TH = 60(1) TMP303B TL = 0, TH = 55(1) TMP303C TL = -20, TH = 60(1) TMP303D TL = -15, TH = 125(1) TMP303E TL = 0, TH = 70(1) TMP303F TL = 0, TH = 80(1) TMP303G TL = 0, TH = 90(1)
6 Pin Configuration and Functions
NAME NO. HYSTSET0 1 Digital Input This pin is used to set the amount of thermal hysteresis. GND 2 Ground Ground OUT 3 Digital Output Active high, push-pull output pin. Does not require a pullup resistor to VS. SOH 4 Digital Input Set output high (SOH) pin. If the SOH pin is pulled high, the TMP303 forces the output high. If the SOH pin is grounded or left floating, this pin has no effect on the behavior of the TMP303. VS 5 Power Supply Power supply HYSTSET1 6 Digital Input This pin is used to set the amount of thermal hysteresis.
SBOS486I –JULY 2009–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP303 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply Voltage, VS – GND 4 V Input Pins, Voltage SOH, HYSTSET1, HYSTSET0 –0.5 ((VS) + 0.3) and ≤ 4 V Output Pin, Voltage OUT –0.5 ((VS) + 0.3) and ≤ 4 V Output Pin, Current OUT –55 8 mA Operating Temperature 130 °C Junction Temperature, TJ max 150 °C Storage Temperature, Tstg –60 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 VCharged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 Machine model (MM) ±200
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Power Supply Voltage 1.4 3.6 V TA Specified Temperature Range –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1) TMP303 UNITDRL (SOT-563)
6 PINS
RθJA Junction-to-ambient thermal resistance 210.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 105.0 °C/W RθJB Junction-to-board thermal resistance 87.5 °C/W ψJT Junction-to-top characterization parameter 6.1 °C/W ψJB Junction-to-board characterization parameter 87.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
www.ti.com SBOS486I –JULY 2009–REVISED DECEMBER 2018 Product Folder Links: TMP303 Submit Documentation FeedbackCopyright © 2009–2018, Texas Instruments Incorporated (1) 100% of all units are production tested at TA = 25°C. Over temperature specifications are specified by design. (2) TL, TH are device-specific. For example, TMP303A TL = 0°C, TH = 60°C; TMP303B TL = 0°C, TH = 55°C; TMP303C TL = –20°C, TH = 60°C; TMP303D TL = –15°C, TH = 125°C; TMP303E TL = 0°C, TH = 70°C; TMP303F TL = 0°C, TH = 80°C; TMP303G TL = 0°C, TH = 90°C
7.5 Electrical Characteristics
At TA = –40°C to 125°C and VS = 1.4 V to 3.6 V, unless otherwise noted.(1) PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE MEASUREMENT TL, TH Trip Point Accuracy(2) TA = 55°C to 60°C, VS = 3.3 V ±0.2 ±1 °CTA = -20 to 60°C, VS = 1.4 V to 3.6 V ±0.2 ±1.5 TA = 60 to 125°C, VS = 1.4 V to 3.6 V ±0.2 ±2.0 vs Supply ±0.1 °C/V Hysteresis See Bit Setting vs Hysteresis Window 1 10 °C HYSTERESIS SET INPUT Input Logic Levels VIH 0.7 × VS 3.6 V VIL –0.5 0.3 × VS Input Current IIN 0 < VIN < 3.6 V 1 μA SOH INPUT Pulldown Resistor Value 80 100 120 kΩ Input Logic Levels VIH 0.7 × VS 3.6 V VIL –0.5 0.3 × VS Input Current VIN = 3.6 V 36 μA OUTPUT Output Logic Levels VOH VS > 2 V, IOH = 0.5 mA VS – 0.4 VS V VS < 2 V, IOH = 0.5 mA VS – 0.2 × (VS) VS VOL VS > 2 V, IOL = 1 mA 0 0.4 VS < 2 V, IOL = 1 mA 0 0.2 × VS POWER SUPPLY Specified Supply Voltage Range VS 1.4 3.6 V Power-up Start-up Time VS > 1.4 V 20 28 35 ms Quiescent Current IQ TA = –55°C to 60°C 3.5 5 μA TA = –40°C to 125°C 4 8 TEMPERATURE RANGE Specified Range –40 125 °C Operating Range –55 130 °C
30 Units
7.6 Typical Characteristics
At VS = 3.3 V and TA = 25°C, unless otherwise noted. Figure 1. Trip Accuracy Error vs Temperature Figure 2. Quiescent Current vs Temperature Figure 3. Temperature Step Response in Perfluorinated Figure 4. Thermal Step Response in Air at 100°C vs Time Figure 5. Trip Threshold Accuracy at -20°C to 125°C Figure 6. Power-Up and Power-Down Transient Response
8 Detailed Description
8.1 Overview
contact a TI representative. Table 1 summarizes the bit setting versus hysteresis temperature window. Table 1. Bit Setting vs Hysteresis Window
8.2 Functional Block Diagram
10 C/c176
50 C/c176
5 C/c176
8.3 Feature Description
8.3.1 HYSTSET0, HYSTSET1 and SOH Functionality
the temperature crosses the hysteresis threshold and returns within the range of the temperature trip window. output high, regardless of temperature. Figure 10 shows this design in graphical form. Figure 10. TMP303A Output Transfer Curves With Hysteresis Change from 10°C to 5°C and SOH
0 C/c176
60 C/c176
8.3.2 TMP303 Power Up and Timing
the temperature falls within the hysteresis window set by HYSTSET0 and HYSTSET1. has reached a level of at least 1.4 V. This sequence is illustrated in Figure 11. Figure 11. TMP303A Start-Up Delay vs Output Voltage (HYSTSET0 = HYSTSET1 = VS) state from high to low (or conversely) when the device is active.
Figure 12. TMP303A Start-Up and Conversion Timing (HYSTSET0 = HYSTSET1 = VS)
8.4 Device Functional Modes
connecting the HYSTSET0 and HYSTSET1 pins to either the GND or Vs pins (see Table 1).
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.2 Typical Applications
9.2.1 TMP303 Typical Configuration
preprogrammed trip-points. Select the TMP303 device that meets the application temperature trip requirement. Figure 13. TMP303 Typical Application Configuration Schematic
9.2.1.1 Design Requirements
HYSTSET1 . These pins are digital inputs and must be tied either high or low, according to Table 1.
9.2.1.2 Detailed Design Procedure
coupled from the power supply.
9.2.1.3 Application Curves
devices behave similarly with regards to power-on response with TA below or above the trip point. Figure 14. TMP303A Power-On Response, TA Less Than Figure 15. TMP303A Power-On Response, TA Greater Than
9.2.2 TMP303 With Switches
0-Ω resistors, which can be either populated or not, depending upon the desired connection. Figure 16. TMP303 With Switches
9.2.3 Simple Fan Controller
Figure 17. Simple Fan Controller
9.2.4 Wireless Fixed Temperature Heat Detector
turn on an alarm in case of temperatures exceeding the trip-point. Figure 18 shows typical connections. Figure 18. Wireless Fixed Temperature Heat Detector
10 Power Supply Recommendations
3.6 V. No specific power supply sequencing with respect to any of the input or output pins is required.
11 Layout
11.1 Layout Guidelines
SOH pin is grounded in this layout. Leaving this pin floating has no effect on the behavior of the TMP303.
- Bypass the VS pin to ground with a low-ESR ceramic bypass capacitor. The typical recommended bypass capacitance is a 0.1-μF ceramic capacitor with a X5R or X7R dielectric. The optimum placement is closest to the VS and GND pins of the device. Take care in minimizing the loop area formed by the bypass-capacitor connection, the VS pin, and the GND pin of the IC. Additional bypass capacitance can be added to compensate for noisy or high-impedance power supplies.
- The OUT pin is a push-pull, active-high output and does not require a pullup resistor to VS.
11.2 Layout Example
Figure 19. PCB Layout Example
www.ti.com SBOS486I –JULY 2009–REVISED DECEMBER 2018 Product Folder Links: TMP303 Submit Documentation FeedbackCopyright © 2009–2018, Texas Instruments Incorporated
12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP303ADRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCO TMP303ADRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCO TMP303ADRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCO TMP303ADRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 OCO TMP303BDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QWM TMP303BDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QWM TMP303BDRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QWM TMP303BDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 QWM TMP303CDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 11U TMP303CDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 11U TMP303CDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 11U TMP303DDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (11U, 12Z) TMP303DDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (11U, 12Z) TMP303DDRLRG4.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 11U TMP303DDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 12Z TMP303EDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 17Z TMP303EDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 17Z TMP303EDRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 17Z TMP303EDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 17Z TMP303FDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 18A TMP303FDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 18A TMP303FDRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 18A TMP303FDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 18A TMP303GDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 18B TMP303GDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 18B TMP303GDRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 18B TMP303GDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 18B (1) Status: For more details on status, see our product life cycle. Addendum-Page 1
www.ti.com 23-May-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP303ADRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP303BDRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0 TMP303BDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP303CDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP303DDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP303EDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP303FDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP303GDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE 1.7 1.5 4X 0.5 2X 1 6X 0.3 0.1
0.6 MAX
6X 0.18 0.08 6X 0.4 0.2 0.05
0.00 TYP
6X 0.27 0.15 2X 0 -10 2X 4 -15 1.3 1.1 1.7 1.5 NOTE 3 SOT - 0.6 mm max heightDRL0006A PLASTIC SMALL OUTLINE 4223266/F 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-293 Variation UAAD 1 6 PIN 1 ID AREA 3 4 SEATING PLANE 0.05 C SCALE 8.000
0.1 C A B
0.05 C SYMM SYMM A B C
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
0.05 MIN
6X (0.67) 6X (0.3) (1.48) 4X (0.5) (R0.05) TYP 4223266/F 11/2024 SOT - 0.6 mm max heightDRL0006A PLASTIC SMALL OUTLINE NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 7. Land pattern design aligns to IPC-610, Bottom Termination Component (BTC) solder joint inspection criteria. SYMM LAND PATTERN EXAMPLE SCALE:30X SYMM 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDERMASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (1.48) 4X (0.5) 6X (0.67) 6X (0.3) (R0.05) TYP SOT - 0.6 mm max heightDRL0006A PLASTIC SMALL OUTLINE 4223266/F 11/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:30X SYMM SYMM 3 4
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