TMP302 TI | Alldatasheet
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Accuracy ( ) C° Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP302 SBOS488E –JUNE 2009–REVISED DECEMBER 2018 TMP302Easy-to-Use,Low-Power,Low-SupplyTemperatureSwitchinMicropackage
1 Features
1• Low Power: 15 μA (Maximum)
- SOT563 Package: 1.6-mm × 1.6-mm × 0.6 mm
- Trip-Point Accuracy: ±0.2°C (Typical) From +40°C to +125°C
- Pin-Selectable Trip Points
- Open-Drain Output
- Pin-Selectable Hysteresis: 5°C and 10°C
- Low Supply Voltage Range: 1.4 V to 3.6 V
2 Applications
- Cell Phone Handsets
- Portable Media Players
- Consumer Electronics
- Servers
- Power-Supply Systems
- DC-DC Modules
- Thermal Monitoring
- Electronic Protection Systems
3 Description
The TMP302 device is a temperature switch in a micropackage (SOT563). The TMP302 offers low power (15-μA maximum) and ease-of-use through pin-selectable trip points and hysteresis. These devices require no additional components for operation; they can function independent of microprocessors or microcontrollers. The TMP302 is available in several different versions. For additional trip points, contact a TI representative. Device Information(1) PART NUMBER PACKAGE SELECTABLE TRIP POINTS (ºC)(2) TMP302A SOT (6) 50, 55, 60, 65 TMP302B SOT (6) 70, 75, 80, 85 TMP302C SOT (6) 90, 95, 100, 105 TMP302D SOT (6) 110, 115, 120, 125 (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) For other available trip points, contact a TI representative. Trip Threshold Accuracy
SBOS488E –JUNE 2009–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP302 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated Table of Contents
11.1 Receiving Notification of Documentation Updates 12
12 Mechanical, Packaging, and Orderable
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (October 2018) to Revision E Page Changes from Revision B (December 2014) to Revision C Page
- Moved Specified Operating Temperature parameter from Electrical Characteristics table to Recommended Changes from Revision A (September 2009) to Revision B Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
5 Pin Configuration and Functions
www.ti.com SBOS488E –JUNE 2009–REVISED DECEMBER 2018 Product Folder Links: TMP302 Submit Documentation FeedbackCopyright © 2009–2018, Texas Instruments Incorporated Pin Functions PIN TYPE DESCRIPTION NO. NAME 1 TRIPSET0 Digital Input Used in combination with TRIPSET1 to select the temperature at which the device trips
2 GND Ground Ground
3 OUT Digital Output Open drain, active-low output
4 HYSTSET Digital Input Used to set amount of thermal hysteresis
6 TRIPSET1 Digital Input Used in combination with TRIPSET0 to select the temperature at which the device trips
SBOS488E –JUNE 2009–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP302 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Voltage Supply 4 VInput pin (TRIPSET0, TRIPSET1, HYSTSET) –0.5 VS + 0.3 and ≤ 4 Output pin (OUT) –0.5 4 Current Output pin (OUT) 10 mA Temperature Operating –55 130 °CJunction 150 Storage –60 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 VCharged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 Machine model (MM) ±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Power supply voltage 1.4 3.3 3.6 V Rpullup Pullup resistor connected fromOUT to VS 10 100 kΩ TA Specified temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
6.4 Thermal Information
THERMAL METRIC(1) TMP302 UNITDRL (SOT)
6 PINS
RθJA Junction-to-ambient thermal resistance 210.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 105.0 °C/W RθJB Junction-to-board thermal resistance 87.5 °C/W ψJT Junction-to-top characterization parameter 6.1 °C/W ψJB Junction-to-board characterization parameter 87.0 °C/W
6.5 Electrical Characteristics
25°C; overtemperature specifications are specified by design.
6.6 Typical Characteristics
At TA = 25°C and VS = 3.3 V, unless otherwise noted. Figure 1. Trip Accuracy Error vs Temperature Figure 2. Quiescent Current vs Temperature
7 Detailed Description
7.1 Overview
The TMP302 temperature switch is optimal for ultra low-power applications that require accurate trip thresholds. pins. Table 1 lists the pin settings versus trip points. Table 1. Trip Point versus TRIPSET1 and TRIPSET0
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 HYSTSET
the HYSTSET pin. The HYSTSET pin allows the user to choose between a 5°C and a 10°C hysteresis window. Table 2 lists the hysteresis window that corresponds to the HYSTSET setting. Table 2. HYSTSET Window output does not return to the original high state until it reaches 50°C. This case is more clearly shown in Figure 9. Figure 9. TMP302A: HYSTSET = VS, TRIPSET1 = VS, TRIPSET0 = GND
7.4 Device Functional Modes
hysteresis (see the HYSTSET section).
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Configuring the TMP302
8.2 Typical Application
Figure 10. TMP302 Typical Application Schematic upon the desired connection.
Figure 11. TMP302 Generic Application Schematic
8.2.1 Design Requirements
HYSTSET pin. This pin is a digital input and must be tied either high or low, according to Table 2. See Figure 10 and Figure 11 for typical circuit configurations.
8.2.2 Detailed Design Procedure
8.2.3 Application Curves
the trip point. Note that the OUT signal typically requires 35 ms following power on to become valid.
Figure 12. TMP302A Power-On Response, Figure 13. TMP302A Power-On Response,
9 Power Supply Recommendations
family of devices is fully functional within 35 ms of the voltage at the VS pin reaching or exceeding 1.4 V.
10 Layout
10.1 Layout Guidelines
10.2 Layout Example
Figure 14. Layout Example
SBOS488E –JUNE 2009–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP302 Submit Documentation Feedback Copyright © 2009–2018, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP302ADRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCP TMP302ADRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCP TMP302ADRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 OCP TMP302BDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCT TMP302BDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCT TMP302BDRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCT TMP302BDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 OCT TMP302CDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCR TMP302CDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCR TMP302CDRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCR TMP302CDRLT Obsolete Production SOT-5X3 (DRL) | 6 - - Call TI Call TI -40 to 125 OCR TMP302DDRLR Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCS TMP302DDRLR.A Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCS TMP302DDRLR.B Active Production SOT-5X3 (DRL) | 6 4000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 OCS (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Addendum-Page 1
www.ti.com 23-May-2025 Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP302 :
- Automotive : TMP302-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP302ADRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP302ADRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0 TMP302BDRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0 TMP302BDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP302CDRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0 TMP302CDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 TMP302DDRLR SOT-5X3 DRL 6 4000 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE 1.7 1.5 4X 0.5 2X 1 6X 0.3 0.1
0.6 MAX
6X 0.18 0.08 6X 0.4 0.2 0.05
0.00 TYP
6X 0.27 0.15 2X 0 -10 2X 4 -15 1.3 1.1 1.7 1.5 NOTE 3 SOT - 0.6 mm max heightDRL0006A PLASTIC SMALL OUTLINE 4223266/F 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-293 Variation UAAD 1 6 PIN 1 ID AREA 3 4 SEATING PLANE 0.05 C SCALE 8.000
0.1 C A B
0.05 C SYMM SYMM A B C
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
0.05 MIN
6X (0.67) 6X (0.3) (1.48) 4X (0.5) (R0.05) TYP 4223266/F 11/2024 SOT - 0.6 mm max heightDRL0006A PLASTIC SMALL OUTLINE NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 7. Land pattern design aligns to IPC-610, Bottom Termination Component (BTC) solder joint inspection criteria. SYMM LAND PATTERN EXAMPLE SCALE:30X SYMM 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDERMASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (1.48) 4X (0.5) 6X (0.67) 6X (0.3) (R0.05) TYP SOT - 0.6 mm max heightDRL0006A PLASTIC SMALL OUTLINE 4223266/F 11/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:30X SYMM SYMM 3 4
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