TMP302-Q1, Automotive Grade, Low-Power, Easy-to-Use, Temperature Switch in Micro (Rev. B)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SLOS889,B]
- PDF pages: 18
Technical content
Accuracy ( ) C° Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community TMP302-Q1 SLOS889B –OCTOBER 2014–REVISED JULY 2015 TMP302-Q1,AutomotiveGrade,Low-Power,Easy-to-Use, TemperatureSwitchinMicroPackage
1 Features 3 Description
The TMP302-Q1 family of devices is a temperature 1• Qualified for Automotive Applications switch in a micropackage (SOT563). The TMP302-Q1• AEC-Q100 Qualified With the Following Results: family of devices offers low power (15 μA maximum) – Device Temperature Grade 1: –40ºC to 125ºC and ease-of-use through pin-selectable trip points Ambient Operating Temperature Range and hysteresis. – Device HBM ESD Classification Level 2 These devices require no additional components for operation; they can function independent of– Device CDM ESD Classification Level C6 microprocessors or microcontrollers.• Low Power: 15 μA (max) The TMP302-Q1 family of devices is available in• SOT563 Package: 1.6 mm × 1.6 mm × 0.6 mm several different versions with trip points from 50ºC to• Trip-Point Accuracy: ±0.2°C (typ) from 40°C to 125ºC in increments of 5ºC (see the125°C Device Comparison Table).• Pin-Selectable Trip Points
- Open-Drain Output, Active Low Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM)• Selectable Hysteresis: 5°C or 10°C TMP302-Q1 SOT563 (6) 1.60 mm × 1.20 mm• Low Supply Voltage Range: 1.4 to 3.6 V (1) For all available packages, see the orderable addendum at the end of the datasheet.2 Applications
- Infotainment
- Climate Control
- Engine Control Unit
- Automotive Black Box
- Central Body Control Module
- Airbag Control Unit
- Thermal Monitoring
- Electronic Protection Systems Trip Threshold Accuracy An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLOS889B –OCTOBER 2014–REVISED JULY 2015 www.ti.com Table of Contents
4 Revision History
Changes from Revision A (November 2014) to Revision B Page
- Changed the typical device number in the data sheet to TMP302-Q1 instead of the different trip-point versions
- Changed the Handling Ratings table to ESD Ratings and moved storage temperature to the Absolute Maximum Changes from Original (October 2014) to Revision A Page
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5 Device Comparison Table
DEVICE SELECTABLE TRIP POINTS (°C)(1) TMP302A-Q1 50, 55, 60, 65 TMP302B-Q1 70, 75, 80, 85 TMP302C-Q1 90, 95, 100, 105 TMP302D-Q1 110, 115, 120, 125 (1) For other available trip points, please contact a TI representative.
6 Pin Configuration and Functions
NO. NAME 1 TRIPSET0 Digital Input Used in combination with TRIPSET1 to select the temperature at which the device trips
2 GND Ground Ground
3 OUT Digital Output Open drain, active-low output
4 HYSTSET Digital Input Used to set amount of thermal hysteresis
Power5 VS Power supplySupply 6 TRIPSET1 Digital Input Used in combination with TRIPSET0 to select the temperature at which the device trips Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TMP302-Q1
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 3.6 V Input pin voltage TRIPSET0, TRIPSET1, HYSTSET –0.5 VS + 0.5 V Output pin voltage OUT –0.5 3.6 V Output pin current OUT 10 mA Operating temperature –55 130 °C Junction temperature 150 °C Storage temperature –60 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
Human body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Power supply voltage 1.4 3.3 3.6 V Rpullup Pullup resistor connected from OUT to VS 10 100 kΩ
7.4 Thermal Information
THERMAL METRIC(1) DRL(SOT563) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 200 °C/W RθJC(top) Junction-to-case (top) thermal resistance 73.7 °C/W RθJB Junction-to-board thermal resistance 34.4 °C/W ψJT Junction-to-top characterization parameter 3.1 °C/W ψJB Junction-to-board characterization parameter 34.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
At TA = –40°C to 125°C, and VS = 1.4 to 3.6 V, unless otherwise noted. 100% of all units are production tested at TA = 25°C. Over temperature specifications are specified by design.
7.6 Typical Characteristics
At TA = 25°C and VS = 3.3 V, unless otherwise noted. Figure 1. Trip Accuracy Error vs Temperature Figure 2. Quiescent Current vs Temperature
At TA = 25°C and VS = 3.3 V, unless otherwise noted. Figure 3. Temperature Step Response In Perfluorinated Figure 4. Thermal Step Response in Air at 100°C vs Time Figure 6. Output Logic-Level Low VOL vs TemperatureFigure 5. Trip Threshold Accuracy Figure 8. Power-Up, Trip, and Power-Down ResponseFigure 7. Power-Up and Power-Down Response
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8 Detailed Description
8.1 Overview
TRIPSET0 pins. Table 1 lists the pin settings versus trip points. Table 1. Trip Point versus TRIPSET1 and TRIPSET0
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 HYSTSET
the HYSTSET pin. The HYSTSET pin allows the user to choose between a 5°C and a 10°C hysteresis window. Table 2 lists the hysteresis window that corresponds to the HYSTSET setting. Table 2. HYSTSET Window Figure 9. TMP302A-Q1: HYSTSET = VS, TRIPSET1 = VS, TRIPSET0 = GND
8.4 Device Functional Modes
amount of selected hysteresis (see the HYSTSET section).
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9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Configuring the TMP302-Q1
TMP302-Q1 family of devices, use a pullup resistor value greater than 10 kΩ from the OUT pin to the VS pin.
9.2 Typical Application
ground, close to the TMP302-Q1 device. Figure 10. TMP302-Q1 Typical Application Schematic upon the desired connection.
Figure 11. TMP302-Q1 Generic Application Schematic
9.2.1 Design Requirements
9.2.2 Detailed Design Procedure
noise coupled from the power supply.
9.2.3 Application Curves
Figure 12. TMP302A-Q1 Power-On Response, TA Less than Figure 13. TMP302A-Q1 Power-On Response, TA Greater
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10 Power Supply Recommendations
11 Layout
11.1 Layout Guidelines
11.2 Layout Example
Figure 14. Layout Example
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12 Device and Documentation Support
12.1 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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www.ti.com 13-Jul-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TMP302AQDRLRQ1 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHQ TMP302BQDRLRQ1 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHR TMP302CQDRLRQ1 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHS TMP302DQDRLRQ1 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
www.ti.com 13-Jul-2015 Addendum-Page 2 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP302A-Q1, TMP302B-Q1, TMP302C-Q1, TMP302D-Q1 :
- Catalog: TMP302A , TMP302B , TMP302C , TMP302D NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 13-Jul-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP302AQDRLRQ1 SOT DRL 6 4000 223.0 270.0 35.0 TMP302BQDRLRQ1 SOT DRL 6 4000 223.0 270.0 35.0 TMP302CQDRLRQ1 SOT DRL 6 4000 223.0 270.0 35.0 TMP302DQDRLRQ1 SOT DRL 6 4000 223.0 270.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 13-Jul-2015 Pack Materials-Page 2
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